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    • 3. 发明公开
    • COMMUNICATION DEVICE AND SINGLE BOARD FOR SAME
    • 通信设备和单板相同
    • EP3229101A1
    • 2017-10-11
    • EP16734917.4
    • 2016-01-06
    • Huawei Technologies Co. Ltd.
    • LIU, ChangyiFEI, XudongYAO, Xidong
    • G06F1/18
    • H04B3/54G06F1/18G06F1/203G06F1/206H04L12/40039H05K7/1492H05K7/20209
    • Embodiments of the present invention disclose a communications device and a board used in the communications device. The communications device includes: a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.
    • 本发明的实施例公开了通信设备和通信设备中使用的板。 通信设备包括:容器,至少一个电源模块,至少一个温度调节模块和多个电路板。 容器被配置为容纳至少一个温度调节模块和多个板,并且容器进一步被配置为容纳功率总线层。 功率总线层连接到至少一个功率模块,至少一个温度调节模块和多个板。 所述至少一个功率模块被配置为通过使用所述功率总线层向所述至少一个温度调节模块和所述多个板提供功率。 多个板,至少一个功率模块和至少一个温度调节模块之间的至少部分通信通过使用功率总线层以电力线通信方式执行。
    • 5. 发明公开
    • COOLING SYSTEM FOR A PROCESSOR
    • EÜNEPROZESSORKÜHLSYSTEMFÜR
    • EP3088987A1
    • 2016-11-02
    • EP16167123.5
    • 2016-04-26
    • Toshiba TEC Kabushiki Kaisha
    • KATO, Kazunori
    • G06F1/20H05K7/20
    • G06F1/206B23P19/00G05B19/048G05B2219/49216G05D23/1917G06F1/20H05K7/20209
    • A cooling system for a processor includes a base member (2) that is electrically grounded, a circuit board (3) having a first terminal (20) and a second terminal (21) that is electrically separated from the first terminal, one of the first and second terminals being secured and electrically connected to the base member, a cooling unit configured to be operated in a first mode in response to a first control signal and in a second mode in response to a second control signal, and a control unit (5) configured to output the first control signal when the first terminal is secured and electrically connected to the base member and the second control signal when the second terminal is secured and electrically connected to the base member.
    • 用于处理器的冷却系统包括电接地的基座部件(2),具有与第一端子电分离的第一端子(20)和第二端子(21)的电路板(3),其中一个 第一和第二端子被固定并电连接到基座构件;冷却单元,被配置为响应于第一控制信号以第一模式操作,并且响应于第二控制信号而在第二模式中操作;以及控制单元 5)被配置为当第一端子被固定并且当第二端子被固定并电连接到基座构件时电连接到基座构件和第二控制信号时输出第一控制信号。
    • 10. 发明公开
    • Thermal management of electronics and photonics equipment
    • äever ung ung。。。。。。。
    • EP2618645A1
    • 2013-07-24
    • EP12290025.1
    • 2012-01-19
    • Alcatel Lucent
    • Hernon, DomhnaillDaly, JohnJeffers, Nicholas
    • H05K7/20
    • H05K7/20181H05K7/20145H05K7/20209
    • For thermal management of electronics and/or photonics equipment, comprising one or more circuit packs that include a plurality of devices (30) that get significantly hotter in operation than other components, a source of compressed air is coupled (22) to a fluid distribution arrangement which includes a manifold having a plurality of outlets (26) which are arranged so as to direct a respective jet of cold air at each of the devices, and wherein each outlet has an associated flap (28) of, for example memory shape alloy, responsive to change in temperature of the respective device, whereby to open the fluid outlet to permit flow of the respective jet with a rise in temperature of the respective device.
    • 对于电子和/或光子设备的热管理,包括一个或多个电路组件,其包括多个在其操作中比其他部件更热的装置(30),压缩空气源(22)与流体分配 排列包括具有多个出口(26)的歧管,所述出口布置成在每个装置处引导相应的冷空气射流,并且其中每个出口具有相关联的翼片(28),例如记忆形状合金 响应于相应装置的温度变化,从而打开流体出口以允许各个喷射器随着相应装置的温度升高而流动。