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1. 发明公开

EP2933834A1 ELECTRONIC COMPONENT PACKAGE STRUCTURE AND ELECTRONIC DEVICE 有权
标题翻译：房屋结构电子元件和电子设备
公开(公告)号：EP2933834A1
公开(公告)日：2015-10-21
申请号：EP15163414.4
申请日：2015-04-13
申请人： Huawei Technologies Co., Ltd.
发明人： Yu, Xuequan , Yang, Lin , Bai, Yadong
IPC分类号： H01L23/552 , H01L23/10
CPC分类号： H05K9/0028 , H01L23/10 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/16151 , H01L2924/16235 , H01L2924/16251 , H01L2924/164 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0231 , H05K1/0236 , H05K1/181
摘要： The present invention discloses an electronic component package structure and an electronic device. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 mm. With the present invention, planar capacitance intensity of a planar capacitance structure formed by the conductive lid, the non-conductive adhesive, and the substrate is increased, and further, planar capacitance of the planar capacitance structure formed by the conductive lid, the non-conductive adhesive, and the substrate can be increased. Therefore, EMI radiated can be reduced effectively, and an EMI shielding effect of the shielding space can be improved.

2. 发明授权

EP2933834B1 ELECTRONIC COMPONENT PACKAGE STRUCTURE AND ELECTRONIC DEVICE 有权
标题翻译： GEHÄUSESTRUKTURFÜRELEKTRONISCHE KOMPONENTE UND ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP2933834B1
公开(公告)日：2017-03-01
申请号：EP15163414.4
申请日：2015-04-13
申请人： Huawei Technologies Co., Ltd.
发明人： Yu, Xuequan , Yang, Lin , Bai, Yadong
IPC分类号： H05K1/02 , H05K1/18 , H05K9/00 , H01L23/552 , H01L23/10
CPC分类号： H05K9/0028 , H01L23/10 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2924/16151 , H01L2924/16235 , H01L2924/16251 , H01L2924/164 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0231 , H05K1/0236 , H05K1/181
摘要： The present invention discloses an electronic component package structure and an electronic device. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 mm. With the present invention, planar capacitance intensity of a planar capacitance structure formed by the conductive lid, the non-conductive adhesive, and the substrate is increased, and further, planar capacitance of the planar capacitance structure formed by the conductive lid, the non-conductive adhesive, and the substrate can be increased. Therefore, EMI radiated can be reduced effectively, and an EMI shielding effect of the shielding space can be improved.
摘要翻译：本发明公开了一种电子部件封装结构和电子器件。电子部件封装结构至少包括：具有用于附接电子部件的固定附接区域的基板; 具有顶部和侧壁的导电盖，所述顶部和侧壁朝向所述基板延伸，所述侧壁的靠近所述基板的一侧具有接合端，其中所述接合端通过使用非导电粘合剂将所述导电盖结合到所述基板，以及结合到基板的导电盖包围附接区域并在附接区域上形成屏蔽空间; 并且非导电性粘合剂位于基板和接合端之间，并且具有不小于7的介电常数和不大于0.07mm的涂层厚度。通过本发明，由导电盖，非导电性粘合剂和基板形成的平面电容结构的平面电容强度增加，而且由导电盖形成的平面电容结构的平面电容，导电粘合剂，并且可以增加基材。因此，可以有效地降低EMI辐射，并且可以提高屏蔽空间的EMI屏蔽效果。

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