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1. 发明公开

EP4328649A1 MICROMIRROR ASSEMBLY AND LASER DEVICE 审中-实审
公开(公告)号：EP4328649A1
公开(公告)日：2024-02-28
申请号：EP22806662.7
申请日：2022-05-07
申请人： Huawei Technologies Co., Ltd.
发明人： ZHAO, Fei , CHU, Huai Yuan , XU, Jinghui , WU, Jiahao
IPC分类号： G02B26/08
摘要： A micromirror assembly (001) and a laser device (0001) are provided, and may be used in a self-driving vehicle, an intelligent robot, VR/AR, or the like. The micromirror assembly (001) includes a first position-limiting part (200), a micromirror chip (100), and a second position-limiting part (300) that are stacked. The micromirror chip (100) includes a fastening frame (103), a movable part (101), and a first cantilever (102), where the movable part (101) is connected to the fastening frame (103) by the first cantilever (102). The first position-limiting part (200) and the second position-limiting part (300) are separately connected to the fastening frame (103), the first position-limiting part (200) and the second position-limiting part (300) have a hollow area, and the hollow areas are opposite to the movable part (101). The first position-limiting part (200) is configured to absorb shock on a collision with the micromirror chip (100), and a projection of a collision part of the first position-limiting part (200) on the micromirror chip (100) intersects with a central axis of the first cantilever (102). The second position-limiting part (300) is configured to absorb shock on a collision with the micromirror chip (100).

2. 发明公开

EP4037335A1 PIEZOELECTRIC MEMS SENSOR AND RELEVANT DEVICE 审中-公开
公开(公告)号：EP4037335A1
公开(公告)日：2022-08-03
申请号：EP20881753.6
申请日：2020-09-14
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： YAO, Danyang , XU, Jinghui
IPC分类号： H04R17/00
摘要： Embodiments of the present invention disclose a piezoelectric MEMS sensor and a related device, applied to scenarios such as a terminal, a smart acoustic system, a wireless Bluetooth headset, an active noise reduction headset, a notebook computer, and an automobile industry. The piezoelectric MEMS sensor includes a substrate including a sound entry channel and at least one cantilever. The cantilever includes a first region and a second region that are connected to each other. The first region includes a first side face and a second side face, the first side face is a side face that is of the first region and that faces a target face, and the target face is a face that is of the cantilever and that is connected to the substrate. An included angle between the first side face and the second side face is greater than or equal to 90 degrees and less than 180 degrees, so that there are fewer restrictions on two sides of regions close to the substrate of the cantilever, and two sides of the cantilever are not constrained by another structure, to effectively ensure free deformation of the cantilever, help improve evenness of a stress distribution on the cantilever, and effectively improve a signal-to-noise ratio and sensitivity.

3. 发明公开

EP4379449A1 DRIVING ASSEMBLY AND RELATED DEVICE 失效
公开(公告)号：EP4379449A1
公开(公告)日：2024-06-05
申请号：EP22863186.7
申请日：2022-08-19
申请人： Huawei Technologies Co., Ltd.
发明人： SUN, Fengpei , FENG, Zhihong , XU, Jinghui , DONG, Xiaoshi , SUN, Jianbo
IPC分类号： G02B26/10 , G02B26/08
CPC分类号： G02B26/08 , H02N1/00 , G02B26/10
摘要： An actuating member and a related device are provided, and may be applied to an optical communication scenario such as OXC, VOA, or WSS, or the field of projection display. A first fastening structure (11), a second fastening structure (12), and a third fastening structure (13) are fastened to a substrate. A rotating frame (40) is connected to the first fastening structure (11) by using a first cantilever beam (21), and a first comb (31) is formed on the rotating frame (40). The first comb (31) is arranged in a staggered manner with a second comb (32), and the second comb (32) is formed on the second fastening structure (12). A rotating platform (60) is located at an inner side of the rotating frame (40), the rotating platform (60) is connected to the rotating frame (40) by using a second cantilever beam (22), and a third comb (33) is formed on the rotating platform (60). The third comb (33) is arranged in a staggered manner with a fourth comb (34), the fourth comb (34) is formed on a rotating structure (50), the rotating structure (50) is connected to the third fastening structure (13) by using a third cantilever beam (23), and the rotating structure (50) and the rotating frame (40) are fastened together. The first comb (31) and the second comb (32) are configured to actuate the rotating frame (40) and the rotating structure (50) to rotate around a first axial direction. The third comb (33) and the fourth comb (34) are configured to actuate the rotating platform (60) to rotate around a second axial direction.

4. 发明公开

EP4300158A1 ELECTROSTATIC MEMS MICROMIRROR 审中-实审
公开(公告)号：EP4300158A1
公开(公告)日：2024-01-03
申请号：EP22783839.8
申请日：2022-03-11
申请人： Huawei Technologies Co., Ltd.
发明人： DONG, Xiaoshi , XU, Jinghui , SUN, Fengpei
IPC分类号： G02B26/08
摘要： An electrostatic MEMS micromirror is provided, and may be used in a device such as a mobile phone, a microphone, a camera, a radar, or an optical switch. The electrostatic MEMS micromirror includes a support beam, a micromirror, and a drive component. The drive component includes a comb frame and a drive comb located in the comb frame. The support beam and the micromirror are connected by using the comb frame. Two sides of the comb frame that are connected to the micromirror are separately located on two sides of a rotating axis determined by an extension line of the support beam. The drive comb includes at least one comb pair. The comb pair includes a movable comb structure and a stationary comb structure. The movable comb structure includes a plurality of movable combs. One end of the movable comb is fastened to the comb frame. The stationary comb structure is configured to generate electrostatic force with the movable comb structure. A distance between a fixed end of the movable comb and the rotating axis is greater than a distance between the other end of the movable comb and the rotating axis. The structure can further improve a rotation angle range and stability of the electrostatic MEMS micromirror.

5. 发明公开

EP4063317A1 MICRO-ELECTRO-MECHANICAL SYSTEM AND PREPARATION METHOD THEREFOR 审中-实审
公开(公告)号：EP4063317A1
公开(公告)日：2022-09-28
申请号：EP20910700.2
申请日：2020-12-23
申请人： Huawei Technologies Co., Ltd.
发明人： SUN, Fengpei , FENG, Zhihong , XU, Jinghui
IPC分类号： B81B7/00 , B81C1/00 , G02B26/08
摘要： Micro-electro-mechanical systems and a preparation method thereof are provided. The micro-electro-mechanical systems include first fixed comb fingers, second fixed comb fingers, a support beam (303), a movable platform (304), and movable comb fingers (305). The first fixed comb fingers and the second fixed comb fingers are fastened to a substrate, and the first fixed comb fingers are electrically isolated from the second fixed comb fingers. Two ends of the support beam are fastened to the substrate, and the movable platform is connected to the support beam. The movable comb fingers are connected to the movable platform, and form a three-layer comb finger structure with the first fixed comb fingers and the second fixed comb fingers. This structure improves drive efficiency of the micro-electro-mechanical systems.

6. 发明公开

EP4040785A1 CAMERA MODULE, CAMERA, TERMINAL DEVICE AND IMAGE INFORMATION DETERMINATION METHOD 审中-实审
公开(公告)号：EP4040785A1
公开(公告)日：2022-08-10
申请号：EP20889796.7
申请日：2020-09-10
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： FENG, Jun , LI, Ming , LIAO, Wenzhe , YANG, Hui , XU, Jinghui , HE, Jifang
IPC分类号： H04N9/04 , H04N5/225
摘要： A camera module, a camera, a terminal device, and a method for determining image information are provided. The camera module may be separately used as a camera, or may be applied to a terminal device such as a mobile phone or a tablet computer, or a vehicle-mounted device. The camera module includes an optical lens component, a light filtering layer, an image sensor and a drive module. The optical lens component is configured to receive a light beam from a photographed object, and transmit the light beam to the light filtering layer. The light filtering layer is configured to move a position under the drive of the drive module, and respectively transmit light signals filtered at different positions to the image sensor. The image sensor is configured to receive the light signals at the different positions from the light filtering layer, and determine image information based on the light signals at the different positions. The position of the light filtering layer is moved, so that light signals filtered at different spatial positions may be respectively transmitted to the image sensor, and the image sensor may complete sampling at different physical spatial positions, thereby increasing a sampling frequency at a spatial position, and helping improve a resolution of an image of the photographed object.

7. 发明公开

EP4276057A1 ENCAPSULATION STRUCTURE, SUBSTRATE AND ENCAPSULATION METHOD 审中-实审
公开(公告)号：EP4276057A1
公开(公告)日：2023-11-15
申请号：EP22745014.5
申请日：2022-01-07
申请人： Huawei Technologies Co., Ltd.
发明人： WU, Guoqiang , YANG, Shangshu , XU, Jinghui , WU, Zhongye , HU, Qifang
IPC分类号： B81B7/02
摘要： An encapsulation structure includes a MEMS device, a substrate, and an attachment material. Materials included in the substrate at least include a first-type material and a second-type material, a coefficient of thermal expansion of the first-type material is less than a coefficient of thermal expansion of a base material of the MEMS device, and a coefficient of thermal expansion of the second-type material is greater than the coefficient of thermal expansion of the base material of the MEMS device. The attachment material is located between the MEMS device and the substrate, and is configured to attach the MEMS device to the substrate. The substrate includes a plurality of different materials. Properties of the materials in the substrate can be adjusted, to adjust and reduce an encapsulation stress of the MEMS device that is generated due to a mismatch between the coefficient of thermal expansion of the MEMS device and a coefficient of thermal expansion of the substrate in an attachment process, to adjust deformation of the MEMS device. A substrate and an encapsulation method are further provided.

8. 发明公开

EP4220191A1 ACCELEROMETER, INERTIAL MEASUREMENT UNIT (IMU) AND ELECTRONIC DEVICE 审中-实审
公开(公告)号：EP4220191A1
公开(公告)日：2023-08-02
申请号：EP21884563.4
申请日：2021-08-09
申请人： Huawei Technologies Co., Ltd.
发明人： TANG, Shihao , HU, Qifang , XU, Jinghui
IPC分类号： G01P15/125 , G01P15/18 , G01C21/16
摘要： This application provides an accelerometer, an inertial measurement unit IMU, and an electronic device. A first anchor region is located at a central position of a first axis accelerometer, to help reduce temperature coefficients of parameters such as a bias and a scale factor of the accelerometer, and improve stability of a component. The accelerometer includes an upper cover layer, the first axis accelerometer, and a substrate layer. The first axis accelerometer includes the first anchor region, a cantilever beam, a first proof mass, a first movable electrode, a second movable electrode, a first fixed electrode, a second fixed electrode, a second anchor region, and a third anchor region. The first proof mass is supported by the cantilever beam and suspended above the substrate layer. The first anchor region, the second anchor region, and the third anchor region are separately connected to the substrate layer and/or the upper cover layer. The first anchor region is located at the central position of the first axis accelerometer. This application may be applied to fields such as consumer electronics, wearable devices, industrial automation, the automobile industry, and the aircraft industry.

9. 发明公开

EP4177218A1 MEMS CHIP AND PREPARATION METHOD THEREFOR, MEMS DEVICE AND ELECTRONIC DEVICE 审中-实审
公开(公告)号：EP4177218A1
公开(公告)日：2023-05-10
申请号：EP21849520.8
申请日：2021-07-27
申请人： Huawei Technologies Co., Ltd.
发明人： SUN, Fengpei , FENG, Zhihong , XU, Jinghui , DONG, Xiaoshi
IPC分类号： B81C1/00 , B81B7/00 , G01C19/5656
摘要： An MEMS chip is disclosed, including a substrate (10), a movable assembly (20), a fastening assembly (30), and a drive assembly (60). The fastening assembly (30) is located between the substrate (10) and the movable assembly (20). The movable assembly (20) includes a fastening portion (21), a movable portion (22), and a first support beam (23). The first support beam (23) is connected to the movable portion (22) and the fastening portion (21). A first avoidance slot (24) is disposed on a face that is of the movable portion (22) and that faces the fastening assembly (30). The fastening assembly (30) is grounded. Aboss (31) and a first position limiting pole (32) are disposed on a face that is of the fastening assembly (30) and that faces the movable assembly. The boss (31) is connected to the fastening portion (21) and is configured to support the fastening portion (21). The first position limiting pole (32) corresponds to the first avoidance slot (24). The drive assembly (60) is connected to the movable portion (22) to drive the movable portion (22) to move. The first position limiting pole of the MEMS chip has a stop function, to improve structural reliability of the chip. An MEMS chip array, an MEMS device, an electronic device, and an MEMS chip manufacturing method are further disclosed.

10. 发明公开

EP4174536A1 MIRROR AND MANUFACTURING METHOD THEREFOR, LENS MODULE, AND ELECTRONIC DEVICE 审中-实审
公开(公告)号：EP4174536A1
公开(公告)日：2023-05-03
申请号：EP21841193.2
申请日：2021-05-18
申请人： Huawei Technologies Co., Ltd.
发明人： XU, Jinghui , SUN, Fengpei , FENG, Jun , LI, Ming
IPC分类号： G02B5/08
摘要： A reflector (10), a method for manufacturing the same, a lens module (001), and an electronic device are provided, and pertain to the field of optical technologies. The reflector (10) uses a silicon-based substrate (101) with a planar structure as abase material, which can effectively reduce a volume and mass of the reflector (10) when compared with a right triangular prism. In addition, an included angle (γ) between a second side surface (1d) and a second surface (1b) of the silicon-based substrate (101) is designed as an obtuse angle, to ensure that after the reflector (10) is arranged in an inclined manner, a right angle protruding outward is not formed between the second side face (1d) and the second surface (1b). Therefore, space occupied when the reflector (10) applied to a periscope camera module can be reduced, but also a risk of cracking or edge breakage of a side edge of the silicon-based substrate (101) caused due to collision or friction during assembly of the reflector (10) can be reduced.

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