专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP4328649A1 MICROMIRROR ASSEMBLY AND LASER DEVICE 审中-实审
公开(公告)号：EP4328649A1
公开(公告)日：2024-02-28
申请号：EP22806662.7
申请日：2022-05-07
申请人： Huawei Technologies Co., Ltd.
发明人： ZHAO, Fei , CHU, Huai Yuan , XU, Jinghui , WU, Jiahao
IPC分类号： G02B26/08
摘要： A micromirror assembly (001) and a laser device (0001) are provided, and may be used in a self-driving vehicle, an intelligent robot, VR/AR, or the like. The micromirror assembly (001) includes a first position-limiting part (200), a micromirror chip (100), and a second position-limiting part (300) that are stacked. The micromirror chip (100) includes a fastening frame (103), a movable part (101), and a first cantilever (102), where the movable part (101) is connected to the fastening frame (103) by the first cantilever (102). The first position-limiting part (200) and the second position-limiting part (300) are separately connected to the fastening frame (103), the first position-limiting part (200) and the second position-limiting part (300) have a hollow area, and the hollow areas are opposite to the movable part (101). The first position-limiting part (200) is configured to absorb shock on a collision with the micromirror chip (100), and a projection of a collision part of the first position-limiting part (200) on the micromirror chip (100) intersects with a central axis of the first cantilever (102). The second position-limiting part (300) is configured to absorb shock on a collision with the micromirror chip (100).

2. 发明公开

EP4386466A1 MICROMIRROR CHIP PACKAGING STRUCTURE, LASER APPARATUS, AND AUTOMOBILE 审中-实审
公开(公告)号：EP4386466A1
公开(公告)日：2024-06-19
申请号：EP22866730.9
申请日：2022-09-08
申请人： Huawei Technologies Co., Ltd.
发明人： WU, Jiahao , ZENG, Li , ZHOU, Wu
IPC分类号： G02B26/08 , B81B7/02
CPC分类号： G02B26/08 , B81B7/00 , B81B7/02
摘要： Embodiments of this application provide a micromirror chip package structure, a laser device, and a vehicle, relate to the field of micro-electro-mechanical technologies, and mainly used to provide a micromirror chip package structure that can suppress a vibration amplitude of a micromirror chip. The micromirror chip package structure includes a micromirror chip, and a first substrate and a second substrate that are stacked, where the micromirror chip is disposed on a side that is of the first substrate and that faces away from the second substrate, where the micromirror chip includes a frame, a movable component, and a first torsion arm, and the movable component is connected to the frame through the first torsion arm; the first substrate includes a vibration isolation platform, an elastic beam, and a support frame, the micromirror chip is disposed on the vibration isolation platform, and the vibration isolation platform is connected to the support frame through the elastic beam; the support frame is fastened to the second substrate, and a gap is formed between the vibration isolation platform and the second substrate; and the vibration isolation platform and the second substrate each have a hollow area, and the hollow area is opposite to the movable component. The micromirror chip package structure is a two-degree-of-freedom system for vibration isolation, thereby improving performance of the micromirror chip.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式