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1. 发明公开

EP2862230A1 DIRECTIONAL COUPLER WAVEGUIDE STRUCTURE AND METHOD 有权
标题翻译：波导结构和工艺与定向耦合器
公开(公告)号：EP2862230A1
公开(公告)日：2015-04-22
申请号：EP12729949.3
申请日：2012-06-18
申请人： Huawei Technologies Co., Ltd.
发明人： MORGIA, Fabio , MARCONI, Franco , SU, Guoyu
IPC分类号： H01P5/107 , H01P5/18
CPC分类号： H01P5/087 , H01P5/18 , H01P5/188
摘要： A directional coupler arrangement (100), comprising an air waveguide (101) and a dielectric waveguide (109) having a coupling slot (111), wherein the air waveguide (101) and the dielectric waveguide (109) are coupled by the coupling slot (111). A method for coupling a first waveguide to a second waveguide comprising forming a coupling slot in the first waveguide and arranging the coupling slot of the first waveguide inside the second waveguide is also disclosed. The directional coupler arrangement has improved insertion loss, directivity and operational bandwidth. It is robust against manufacturing tolerances.

2. 发明公开

EP3070786A1 ARRAY ANTENNA 审中-公开
标题翻译：阵列天线
公开(公告)号：EP3070786A1
公开(公告)日：2016-09-21
申请号：EP14869696.6
申请日：2014-08-20
申请人： Huawei Technologies Co., Ltd.
发明人： CAO, Chang , MORGIA, Fabio , GOEBEL, Uhland , SU, Guoyu
IPC分类号： H01Q13/10 , H01Q21/08
CPC分类号： H01Q21/0043 , H01P5/12 , H01Q13/18 , H01Q21/0006 , H01Q21/005 , H01Q21/0093 , H01Q21/064
摘要： The present invention provides an array antenna, including a cavity power divider and a final-stage power dividing, coupling, and radiating unit. The cavity power divider receives an input signal and performs power division to output a first power-divided signal. The final-stage power dividing, coupling, and radiating unit includes a dielectric substrate, a first metal surface layer, and a second metal surface layer; a coupling slot array is formed on the second metal surface layer to receive the first power-divided signal; a radiating slot array corresponding to the coupling slot array is formed on the first metal surface layer; and several plated through-hole units are provided on the dielectric substrate, where the plated through-hole units go through the first and second metal surface layers vertically, and a range corresponding to each plated through-hole unit encloses a coupling slot and a radiating slot corresponding to the coupling slot, so that final-stage power division is performed on the first power-divided signal to output a second power-divided signal to the radiating slot array and that the radiating slot array radiates the second power-divided signal. The present invention achieves an objective of increasing bandwidth.
摘要翻译：本发明提供了一种阵列天线，包括腔体功分器和末级功分，耦合，辐射单元。腔功率分配器接收输入信号并执行功率分配以输出第一功率分配信号。末级功率分配，耦合和辐射单元包括介质基板，第一金属表面层和第二金属表面层; 耦合槽阵列形成在第二金属表面层上以接收第一功分信号; 在所述第一金属表面层上形成与所述耦合缝隙阵列对应的辐射缝隙阵列; 所述电介质基板上设置有多个镀通孔单元，所述镀通孔单元垂直穿过所述第一金属表层和所述第二金属表层，每个镀通孔单元对应的范围包括耦合槽和辐射从而对第一功率分配信号执行最后一级功率分配，以将第二功率分配信号输出到辐射时隙阵列，并且辐射时隙阵列辐射第二功率分配信号。本发明实现了增加带宽的目标。

3. 发明授权

EP2862230B1 DIRECTIONAL COUPLER WAVEGUIDE STRUCTURE AND METHOD 有权
标题翻译：波导结构和工艺与定向耦合器
公开(公告)号：EP2862230B1
公开(公告)日：2016-08-10
申请号：EP12729949.3
申请日：2012-06-18
申请人： Huawei Technologies Co., Ltd.
发明人： MORGIA, Fabio , MARCONI, Franco , SU, Guoyu
IPC分类号： H01P5/08 , H01P5/18
CPC分类号： H01P5/087 , H01P5/18 , H01P5/188

4. 发明公开

EP2862231A1 DIRECTIONAL COUPLER ARRANGEMENT AND METHOD 审中-公开
标题翻译：定向耦合器和程序
公开(公告)号：EP2862231A1
公开(公告)日：2015-04-22
申请号：EP12729950.1
申请日：2012-06-18
申请人： Huawei Technologies Co., Ltd.
发明人： SU, Guoyu , MORGIA, Fabio , MARCONI, Franco
IPC分类号： H01P5/107 , H01P5/18
CPC分类号： H01P5/181 , H01P5/107 , H01P5/184 , H01P5/185 , H01P11/002 , H01P11/003 , Y10T29/49016
摘要： A directional coupler arrangement (100) comprising an air waveguide (101) and a coupler port (103) having a coupler line (105) arranged inside the air waveguide (101). A method (700) for producing a directional coupler arrangement (100) comprising forming (701) an air waveguide (101) and forming (703) a coupler port (103) having a coupler line (105) arranged inside the air waveguide (101) is also disclosed. Placing the coupler line (105) of a directional coupler inside the air waveguide (101) makes the interface to the air waveguide (101) more robust against manufacturing tolerances and improves its behaviour with respect to insertion loss, directivity, operational bandwidth and impedance matching.

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