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1. 发明公开

EP3207416A1 OPTICAL ELEMENT STACK ASSEMBLIES 有权
标题翻译：光学元件组件
公开(公告)号：EP3207416A1
公开(公告)日：2017-08-23
申请号：EP15850175.9
申请日：2015-10-14
申请人： Heptagon Micro Optics Pte. Ltd.
发明人： HEIMGARTNER, Stephan , BIETSCH, Alexander , RIEL, Peter
IPC分类号： G02B7/00 , B32B37/12 , H01L31/0232
摘要： The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.
摘要翻译：本公开描述了包括彼此堆叠的多个基板的光学元件堆叠组件。至少一个衬底在其表面上包括光学元件，例如DOE。例如，可以在晶圆级工艺中制造堆叠组件。

2. 发明公开

EP2580781A1 METHOD OF MANUFACTURING A PLURALITY OF OPTICAL DEVICES 审中-公开
标题翻译：工艺生产光学多个设备
公开(公告)号：EP2580781A1
公开(公告)日：2013-04-17
申请号：EP11738586.4
申请日：2011-06-10
申请人： Heptagon Micro Optics Pte. Ltd.
发明人： RUDMANN, Hartmut , RIEL, Peter
IPC分类号： H01L27/146
CPC分类号： H01L27/14687 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14632 , H01L2924/0002 , H01L2924/00
摘要： In accordance with an aspect of the invention, a method of manufacturing, on a waver scale, a plurality of optical devices comprises the steps of providing a wafer scale spacer with a plurality of holes arranged in a hole pattern at the positions of camera modules, providing a wafer scale substrate with an infrared (IR) filter that is patterned to comprise a plurality of IR filter sections, the IR filter sections being arranged in an IR filter pattern that is such that radiation paths through the substrate and onto the camera modules go through the IR filter sections, and stacking the substrate and the spacer on each other with the holes and the filter sections being aligned.

3. 发明公开

EP3198689A1 COMPACT, POWER-EFFICIENT STACKED BROADBAND OPTICAL EMITTERS 有权
标题翻译：紧凑，高效堆叠宽带光学发射器
公开(公告)号：EP3198689A1
公开(公告)日：2017-08-02
申请号：EP15845489.2
申请日：2015-09-23
申请人： Heptagon Micro Optics Pte. Ltd.
发明人： RIEL, Peter , ROENTGEN, Peter
IPC分类号： H01S3/091 , H01S3/16 , H01S5/10 , H01S5/30
CPC分类号： G01J3/10 , G01J3/06 , G01J3/108 , G01J3/26 , H01S3/094096 , H01S5/0071 , H01S5/0287 , H01S5/041 , H01S5/1096 , H01S5/183 , H01S5/32375 , H01S5/34306 , H01S5/34313 , H01S5/34326 , H01S5/3438 , H01S5/4043 , H01S5/4087
摘要： The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.
摘要翻译：本公开描述了包括半导体层堆叠的宽带光发射源，其中每个半导体层可操作以发射不同相应波长的光; 光源，其可操作以提供用于从所述堆叠体激发的光子发射的光学泵浦; 其中所述半导体层顺序地布置在所述堆叠中，使得所述半导体层中的第一半导体层最靠近所述光源，并且所述半导体层中的最后一个半导体层距离所述光源最远，并且其中所述半导体层中的每个特定半导体层是对于由比特定半导体层更靠近光源的其他半导体层产生的光至少部分透明。本公开还描述了包括宽带光发射装置的各种光谱仪，并且可选地包括可操作以允许所选波长或窄波长范围通过的可调波长滤波器。

4. 发明授权

EP3207416B1 OPTICAL ELEMENT STACK ASSEMBLIES 有权
公开(公告)号：EP3207416B1
公开(公告)日：2020-02-26
申请号：EP15850175.9
申请日：2015-10-14
申请人： Heptagon Micro Optics Pte. Ltd.
发明人： HEIMGARTNER, Stephan , BIETSCH, Alexander , RIEL, Peter
IPC分类号： B32B33/00 , G02B5/18 , G02B27/42

5. 发明公开

EP3172608A1 LIGHT EMITTER AND LIGHT DETECTOR MODULES INCLUDING VERTICAL ALIGNMENT FEATURES 有权
标题翻译：发光器和光检测器模块，包括垂直对准特征
公开(公告)号：EP3172608A1
公开(公告)日：2017-05-31
申请号：EP15824258.6
申请日：2015-07-22
申请人： Heptagon Micro Optics Pte. Ltd.
发明人： RIEL, Peter , ROSSI, Markus , CALERO, Daniel Pérez , GLOOR, Matthias , DORON, Moshe , BAKIN, Dmitry , BOUCHILLOUX, Philippe
IPC分类号： G02B7/02 , H01L27/144
CPC分类号： G03B21/142 , G02B7/003 , G02B7/02 , G03B21/2033 , H01L27/14618 , H01L33/483 , H01L33/58 , H01L2933/0033 , H01L2933/0058
摘要： This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
摘要翻译：本公开内容描述了各种模块，其可以为诸如光发射器或光检测器之类的光电子器件提供超精确和稳定的封装。模块包括垂直对准特征，根据需要，可以在模块制造期间加工垂直对准特征，以在光电子器件与设置在光电子器件上的光学元件或光学组件之间建立精确的距离。

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