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1. 发明公开

EP2863436A1 MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE 有权
标题翻译：用于固态成像装置和固态成像装置的制造方法
公开(公告)号：EP2863436A1
公开(公告)日：2015-04-22
申请号：EP13804695.8
申请日：2013-02-21
申请人： Hamamatsu Photonics K.K.
发明人： YONETA Yasuhito , TAKISAWA Ryoto , ISHIHARA Shingo , SUZUKI Hisanori , MURAMATSU Masaharu
IPC分类号： H01L27/14
CPC分类号： H01L27/1469 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14687 , H01L27/148
摘要： A manufacturing method is provided for a solid-state imaging device which is easy to manufacture.
A method for manufacturing a solid-state imaging device 1 comprises a first step of preparing an imaging element 10 including a first principal surface S1 for receiving an energy line incident thereon, a second principal surface S2 opposing the first principal surface S1 and having an electrode 14 arranged thereon, and a photoelectric converter part 11 for photoelectrically converting the incident energy line so as to generate a signal charge; a second step of preparing a support substrate 20, provided with at least one through hole 23 extending in a thickness direction thereof, having principal surfaces S3, S4 opposing each other; a third step of aligning the imaging element 10 and the support substrate 20 with each other so that the one electrode 14 is exposed out of the one through hole 23 while the principal surfaces S2, S3 oppose each other and joining the imaging element 10 and the support substrate 20 to each other; and a fourth step of embedding a conductive member 30 in the through hole 23 after the third step.
摘要翻译：为易于制造的固态成像装置提供制造方法。用于制造固态成像装置1的方法包括：第一步骤，准备包括用于接收入射在其上的能量线的第一主表面S1，与第一主表面S1相对且具有电极的第二主表面S2的成像元件10 14和光电转换器部分11，用于光电转换入射能量线以产生信号电荷; 准备支撑基板20的第二步骤，该支撑基板20设置有沿其厚度方向延伸的至少一个通孔23，该通孔具有彼此相对的主表面S3，S4; 将摄像元件10和支承基板20对准，使得一个电极14露出到一个贯通孔23外的同时使主面S2，S3相对并将摄像元件10和摄像元件10接合的第3工序将衬底20彼此支撑; 以及在第三步骤之后将导电构件30嵌入通孔23中的第四步骤。

2. 发明公开

EP2863438A1 MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE 有权
标题翻译： HERMTELLUNGSVERFAHRENFÜREINEFESTKÖRPERABBILDUNGSVORRICHTUNGUNDFESTKÖRPERABBILDUNGSVORRICHTUNG
公开(公告)号：EP2863438A1
公开(公告)日：2015-04-22
申请号：EP13804510.9
申请日：2013-02-21
申请人： Hamamatsu Photonics K.K.
发明人： YONETA Yasuhito , TAKISAWA Ryoto , ISHIHARA Shingo , SUZUKI Hisanori , MURAMATSU Masaharu
IPC分类号： H01L27/146 , H01L27/14
CPC分类号： H01L21/77 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/1469 , H01L2224/11 , H04N5/369 , Y10T29/49124
摘要： A manufacturing method is provided for a solid-state imaging device which is easy to manufacture while having excellent reliability as a product.
A method for manufacturing a solid-state imaging device 1A comprises a first step of preparing an imaging element 10 having a first principal surface S1 for receiving an energy ray incident thereon, a second principal surface S2 opposing the first principal surface S1 and having at least one electrode 14 arranged thereon, and a photoelectric converter part 11 for photoelectrically converting the incident energy ray so as to generate a signal charge; a second step of preparing a support substrate 20, provided with at least one through hole 23 extending in a thickness direction thereof, having third and fourth principal surfaces S3, S4 opposing each other; a third step of aligning the imaging element 10 and the support substrate 20 with each other so that the electrode 14 is exposed out of the through hole 23 while the second and third principal surfaces S2, S3 oppose each other and joining the imaging element 10 and the support substrate 20 to each other; and a fourth step of arranging a conductive ball-shaped member 30 in the through hole 23 and electrically connecting the ball-shaped member 30 to the electrode 14 after the third step.
摘要翻译：为固体成像装置提供制造方法，其易于制造，同时具有作为产品的良好的可靠性。一种制造固态成像装置1A的方法包括：准备具有用于接收入射到其上的能量射线的第一主面S1的成像元件10的第一步骤，与第一主面S1相对的第二主面S2，布置在其上的一个电极14和用于光电转换入射能量射线以产生信号电荷的光电转换器部分11; 制备支撑基板20的第二步骤，其具有沿其厚度方向延伸的至少一个通孔23，具有彼此相对的第三和第四主表面S3，S4; 将成像元件10和支撑基板20彼此对准的第三步骤，使得电极14暴露在通孔23之外，同时第二和第三主表面S2，S3彼此相对并且将成像元件10和支撑基板20彼此之间; 以及在通孔23中布置导电球形构件30并在第三步骤之后将球形构件30电连接到电极14的第四步骤。

3. 发明授权

EP2863438B1 MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE 有权
公开(公告)号：EP2863438B1
公开(公告)日：2019-06-05
申请号：EP13804510.9
申请日：2013-02-21
申请人： Hamamatsu Photonics K.K.
发明人： YONETA Yasuhito , TAKISAWA Ryoto , ISHIHARA Shingo , SUZUKI Hisanori , MURAMATSU Masaharu
IPC分类号： H01L27/146 , H01L27/14 , H01L21/77 , H04N5/369

4. 发明授权

EP2863436B1 MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE AND SOLID-STATE IMAGING DEVICE 有权
公开(公告)号：EP2863436B1
公开(公告)日：2018-11-28
申请号：EP13804695.8
申请日：2013-02-21
申请人： Hamamatsu Photonics K.K.
发明人： YONETA Yasuhito , TAKISAWA Ryoto , ISHIHARA Shingo , SUZUKI Hisanori , MURAMATSU Masaharu
IPC分类号： H01L27/14 , H01L27/146 , H01L27/148
CPC分类号： H01L27/1469 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14687 , H01L27/148
摘要： A manufacturing method is provided for a solid-state imaging device which is easy to manufacture. A method for manufacturing a solid-state imaging device 1 comprises a first step of preparing an imaging element 10 including a first principal surface S1 for receiving an energy line incident thereon, a second principal surface S2 opposing the first principal surface S1 and having an electrode 14 arranged thereon, and a photoelectric converter part 11 for photoelectrically converting the incident energy line so as to generate a signal charge; a second step of preparing a support substrate 20, provided with at least one through hole 23 extending in a thickness direction thereof, having principal surfaces S3, S4 opposing each other; a third step of aligning the imaging element 10 and the support substrate 20 with each other so that the one electrode 14 is exposed out of the one through hole 23 while the principal surfaces S2, S3 oppose each other and joining the imaging element 10 and the support substrate 20 to each other; and a fourth step of embedding a conductive member 30 in the through hole 23 after the third step.

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