专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

EP0319827B1 Wiring method and apparatus for electronic circuit boards or the like 失效
标题翻译：电子电路板的布线方法和装置等
公开(公告)号：EP0319827B1
公开(公告)日：1993-08-18
申请号：EP88119876.6
申请日：1988-11-29
申请人： HITACHI, LTD.
发明人： Hasegawa, Hiroshi Ekureru Ninomiya 404 , Amimoto, Toshiyuki , Tani, Mitsukiyo
IPC分类号： H05K7/06 , H05K13/06
CPC分类号： H05K3/222 , H05K7/06 , H05K13/06 , Y10T29/49162 , Y10T29/49167 , Y10T29/49169 , Y10T156/1002 , Y10T156/1007

2. 发明公开

EP0265927A3 Wire stacked bonding method 失效
标题翻译：电线堆叠焊接方法
公开(公告)号：EP0265927A3
公开(公告)日：1988-09-14
申请号：EP87115823
申请日：1987-10-28
申请人： HITACHI, LTD.
发明人： Hasegawa, Hiroshi , Sugimoto, Koichi , Yano, Takeshi , Netsu, Tositada , Tani, Mitsukiyo , Kojima, Tosaku
IPC分类号： B23K20/24 , H01R04/02
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05553 , H01L2224/48095 , H01L2224/48463 , H01L2224/4847 , H01L2224/48477 , H01L2224/49111 , H01L2224/4942 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/014 , H01R4/02 , H01L2224/45099 , H01L2924/00 , H01L2224/05599 , H01L2224/85399
摘要： The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad (1), and a second wire (3) is bonded on the position where the first wire (2) has been bonded. Bonding of a subsequent wire (4) is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad (1) area is very small.
摘要翻译：本发明涉及细线的接合，更具体地说，涉及一种适用于连接狭窄区域内的多根电线的引线接合方法。第一线接合在衬垫（1）上，并且第二线（3）接合在第一线（2）已经接合的位置上。执行后续线（4）的接合是以与上述类似的方式堆叠和接合线。因此，即使垫（1）面积非常小，也可以在一个焊盘内结合多个修复线。

3. 发明公开

EP0319827A3 Wiring method and apparatus for electronic circuit boards or the like 失效
标题翻译：电子电路板的布线方法和装置等
公开(公告)号：EP0319827A3
公开(公告)日：1990-01-17
申请号：EP88119876.6
申请日：1988-11-29
申请人： HITACHI, LTD.
发明人： Hasegawa, Hiroshi Ekureru Ninomiya 404 , Amimoto, Toshiyuki , Tani, Mitsukiyo
IPC分类号： H05K7/06 , H05K13/06
CPC分类号： H05K3/222 , H05K7/06 , H05K13/06 , Y10T29/49162 , Y10T29/49167 , Y10T29/49169 , Y10T156/1002 , Y10T156/1007
摘要： A wiring method for an electronic device (32) including a plurality of electronic components (21) and a plurality of connector elements (23, 24) for interconnecting the plurality of electronic components, the connector elements (23, 24) being arranged on the same plane in spaced relation to each other so as to define, between the connector elements, passages (25, 26) for permitting discrete lines (15, 15′) to pass. The wiring method comprises the steps of connecting a first discrete line (15) to a surface of a first connector element (23b) such that the first discrete line (15) extends on a first passage (25a) extending along the first connector element (23b), positioning at least two pins (52, 5b, 5c, 5d) along the first passage (25a) substantially vertically thereto, bending and deforming the first discrete line (15) along the at least two pins, and reducing a distance between the at least two pins, and removing the at least two pins away from the first passage (25a). The method further comprises the steps of connecting a second discrete line (15′) to a surface of a second connector element (23a) located along the first passage (25a), such that the second discrete line (15′) extends on the first passage, positioning the at least two pins (5a, 5b, 5c, 5d) along the first discrete line (15) substantially vertically to the first passage (25a), bending and deforming the second discrete line (15′) along the at least two pins positioned along the first discrete line (15), to superimpose the second discrete line (15′) upon the first discrete line (15), and reducing the distance between the at least two pins positioned along the first discrete line, and removing the at least two pins away from the first passage, thereby wiring the second discrete line to the second connector element.

4. 发明公开

EP0319827A2 Wiring method and apparatus for electronic circuit boards or the like 失效
标题翻译： Verdrahtungsverfahren undGerätfürelektronische Schaltungsplatten oder dergleichen。
公开(公告)号：EP0319827A2
公开(公告)日：1989-06-14
申请号：EP88119876.6
申请日：1988-11-29
申请人： HITACHI, LTD.
发明人： Hasegawa, Hiroshi Ekureru Ninomiya 404 , Amimoto, Toshiyuki , Tani, Mitsukiyo
IPC分类号： H05K7/06 , H05K13/06
CPC分类号： H05K3/222 , H05K7/06 , H05K13/06 , Y10T29/49162 , Y10T29/49167 , Y10T29/49169 , Y10T156/1002 , Y10T156/1007
摘要： A wiring method for an electronic device (32) including a plurality of electronic components (21) and a plurality of connector elements (23, 24) for interconnecting the plurality of electronic components, the connector elements (23, 24) being arranged on the same plane in spaced relation to each other so as to define, between the connector elements, passages (25, 26) for permitting discrete lines (15, 15′) to pass. The wiring method comprises the steps of connecting a first discrete line (15) to a surface of a first connector element (23b) such that the first discrete line (15) extends on a first passage (25a) extending along the first connector element (23b), positioning at least two pins (52, 5b, 5c, 5d) along the first passage (25a) substantially vertically thereto, bending and deforming the first discrete line (15) along the at least two pins, and reducing a distance between the at least two pins, and removing the at least two pins away from the first passage (25a). The method further comprises the steps of connecting a second discrete line (15′) to a surface of a second connector element (23a) located along the first passage (25a), such that the second discrete line (15′) extends on the first passage, positioning the at least two pins (5a, 5b, 5c, 5d) along the first discrete line (15) substantially vertically to the first passage (25a), bending and deforming the second discrete line (15′) along the at least two pins positioned along the first discrete line (15), to superimpose the second discrete line (15′) upon the first discrete line (15), and reducing the distance between the at least two pins positioned along the first discrete line, and removing the at least two pins away from the first passage, thereby wiring the second discrete line to the second connector element.
摘要翻译：一种电子设备（32）的布线方法，包括多个电子部件（21）和用于互连多个电子部件的多个连接器元件（23,24），连接器元件（23,24）布置在相同的平面彼此间隔开，以便在连接器元件之间限定用于允许离散线路（15,15分钟）通过的通道（25,26）。布线方法包括以下步骤：将第一离散线（15）连接到第一连接器元件（23b）的表面，使得第一离散线（15）在沿着第一连接器元件延伸的第一通道（25a）上延伸 23b），沿着第一通道（25a）大致垂直定位至少两个销（52,5b，5c，5d），沿着至少两个销弯曲和变形第一离散线（15），并且减小所述至少两个销，并且将所述至少两个销移除离开所述第一通道（25a）。该方法还包括以下步骤：将第二离散线（15分钟）连接到沿着第一通道（25a）定位的第二连接器元件（23a）的表面，使得第二离散线（15分钟）在第一离散线沿着第一离散线（15）将至少两个销（5a，5b，5c，5d）定位成基本上垂直于第一通道（25a），使至少两个销（5a，5b，5c，5d）沿着至少第二离散线（15分钟）沿着第一离散线（15）定位的两个销，以将第二离散线（15分钟）叠加在第一离散线（15）上，并且减小沿着第一离散线定位的至少两个销之间的距离，以及移除所述至少两个销远离所述第一通道，从而将所述第二离散线布线到所述第二连接器元件。

6. 发明公开

EP0265927A2 Wire stacked bonding method 失效
标题翻译： Verfahren zum Stapelverbinden vonDrähten。
公开(公告)号：EP0265927A2
公开(公告)日：1988-05-04
申请号：EP87115823.4
申请日：1987-10-28
申请人： HITACHI, LTD.
发明人： Hasegawa, Hiroshi , Sugimoto, Koichi , Yano, Takeshi , Netsu, Tositada , Tani, Mitsukiyo , Kojima, Tosaku
IPC分类号： B23K20/24 , H01R4/02
CPC分类号： H01L24/85 , B23K20/007 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05553 , H01L2224/48095 , H01L2224/48463 , H01L2224/4847 , H01L2224/48477 , H01L2224/49111 , H01L2224/4942 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/014 , H01R4/02 , H01L2224/45099 , H01L2924/00 , H01L2224/05599 , H01L2224/85399
摘要： The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad (1), and a second wire (3) is bonded on the position where the first wire (2) has been bonded. Bonding of a subsequent wire (4) is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad (1) area is very small.
摘要翻译：本发明涉及细线的接合，更具体地说，涉及一种适用于连接狭窄区域内的多根电线的引线接合方法。第一线焊接在焊盘（1）上，第二线（3）接合在第一线（2）已经接合的位置。进行后续导线（4）的接合，是以与上述相似的方式层叠和接合导线。因此，即使垫（1）面积非常小，也可以在一个衬垫内结合多个修复线。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式