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1. 发明公开

EP1196016A3 Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor 审中-公开
标题翻译：电路基板及其制造方法和施加到用于无电镀铜溶液
公开(公告)号：EP1196016A3
公开(公告)日：2004-06-30
申请号：EP01123229.5
申请日：2001-10-02
申请人： Hitachi, Ltd.
发明人： Itabashi, Takeyuki , Akahoshi, Haruo , Takai, Eiji , Nishimura, Naoki , Iida, Tadashi , Ueda, Yoshinori, Hitachi Horiyamashita Apt. D-22
IPC分类号： H05K3/42 , C23C18/40
CPC分类号： C23C18/40 , H05K3/421 , H05K3/422 , H05K3/426 , H05K3/429 , H05K2201/09518
摘要： Providing a multilayer wiring substrate high in connection reliability through process steps of forming more than one opening (3) such as a via-hole in a dielectric layer (2) laminated on a substrate (1) and then applying uniform copper plating (4) to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative way of performing such electroless copper plating is to make use of an electroless copper plating solution with chosen additive agents or "admixtures" containing at least one of mandelonitrile and triethyltetramine plus eriochrome black T along with at least one of 2,2'-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline.

2. 发明公开

EP0669793A3 A method for manufacturing printed circuit board 失效
标题翻译：一种用于制造电路板的过程。
公开(公告)号：EP0669793A3
公开(公告)日：1996-08-14
申请号：EP95301193.9
申请日：1995-02-23
申请人： HITACHI, LTD. , HITACHI CHEMICAL CO., LTD.
发明人： Satsu, Yuichi , Akahoshi, Haruo , Kawamoto, Mineo , Takahashi, Akio , Miyazaki, Masashi , Ishimaru, Toshiaki
IPC分类号： H05K3/10 , G03F7/085
CPC分类号： G03F7/085 , H05K3/0076 , H05K3/062 , H05K3/108 , H05K3/384 , H05K2201/0347 , H05K2201/0355 , H05K2203/1105 , H05K2203/124 , Y10S430/155
摘要： A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1) ;
where, R 1 is any of H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R 2 is an alkyl group having 0-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2) ;
where, R 3 is either of H or an alkyl group having 1-6 carbon atoms, X is either of NH or S, and Z is either of N or C-Y, where Y is any of H, NH 2 , or SH.

3. 发明公开

EP0895447A2 A circuit board, a method for manufacturing same, and a method of electroless plating 失效
标题翻译：印刷电路板，它们的用于化学镀的制备和方法流程
公开(公告)号：EP0895447A2
公开(公告)日：1999-02-03
申请号：EP98113687.2
申请日：1998-07-22
申请人： Hitachi, Ltd.
发明人： Itabashi, Takeyuki , Akahoshi, Haruo
IPC分类号： H05K3/46
CPC分类号： H05K3/422 , H05K3/064 , H05K3/4652 , H05K2201/09563 , H05K2203/105 , Y10T29/49155 , Y10T29/49165
摘要： Objects of the present invention are to provide a circuit board, wherein electroless plating to fill via-holes can be controlled uniformly with desirable reproducibility, and via-hole portions (38) can be identified from surface of the substrate (21) after forming a second conductor (4) thereon; a manufacturing method of same; and a method of electroless plating.
Feature of the present invention is in the specific circuit board obtained by applying a potential higher than the potential of the electroless plating to the conductor on the surface when filling the via-holes (38) by the electroless plating, and in the method.
In accordance with the present invention, the circuit board, of which via-hole portions (38) can be identified optically, because the via-hole portion differs from the second conductor (4) in the surface condition, and a dent is formed.

4. 发明授权

EP0352973B1 Process for producing a composite article comprising a copper element 失效
标题翻译：一种用于制造含有铜元素复合制品的方法。
公开(公告)号：EP0352973B1
公开(公告)日：1995-11-08
申请号：EP89307392.4
申请日：1989-07-20
申请人： HITACHI, LTD.
发明人： Akahoshi, Haruo , Murakami, Kanji , Suzuki, Yoshihiro , Nagai, Akira , Kogawa, Kiyonori , Takahashi, Akio
IPC分类号： H05K3/38 , B32B15/08 , C23C18/40
CPC分类号： H05K3/385 , H05K3/384 , H05K3/4611 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1157 , Y10S428/901 , Y10T156/10 , Y10T428/24917 , Y10T428/31 , Y10T428/31678

5. 发明公开

EP0584780A3 Process for producing printed wiring board 失效
标题翻译： Verfahren zur Herstellung von gedruckten Leiterplatten。
公开(公告)号：EP0584780A3
公开(公告)日：1995-08-02
申请号：EP93113478.7
申请日：1993-08-24
申请人： HITACHI, LTD.
发明人： Miyazaki, Masashi , Akahoshi, Haruo , Nohara, Shozo , Kikuta, Kenzi , Ishimaru, Toshiaki
IPC分类号： H05K3/10 , H05K3/18
CPC分类号： G03F7/322 , G03F7/033 , G03F7/30 , H05K3/0076 , H05K3/108 , H05K3/184 , H05K2203/0783 , H05K2203/0793 , Y10T29/49126 , Y10T29/49156
摘要： In an additive process for producing printed wiring boards, by using a developer (103) comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material (101) a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.
摘要翻译：在制造印刷电路板的添加方法中，通过使用包含无氯有机溶剂和碱性水溶液的显影剂（103）和作为抗蚀剂材料（101）的甲基丙烯酸和甲基丙烯酸甲酯的共聚物等，即使使用面积大的基板，也可以简化制造工序，废除作为显影剂的含氯有机溶剂成为可能。

6. 发明公开

EP0584780A2 Process for producing printed wiring board 失效
标题翻译：一种用于印刷电路板的制造过程。
公开(公告)号：EP0584780A2
公开(公告)日：1994-03-02
申请号：EP93113478.7
申请日：1993-08-24
申请人： HITACHI, LTD.
发明人： Miyazaki, Masashi , Akahoshi, Haruo , Nohara, Shozo , Kikuta, Kenzi , Ishimaru, Toshiaki
IPC分类号： H05K3/10 , H05K3/18
CPC分类号： G03F7/322 , G03F7/033 , G03F7/30 , H05K3/0076 , H05K3/108 , H05K3/184 , H05K2203/0783 , H05K2203/0793 , Y10T29/49126 , Y10T29/49156
摘要： In an additive process for producing printed wiring boards, by using a developer (103) comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material (101) a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.

7. 发明授权

EP0189913B1 Method of bonding copper and resin 失效
标题翻译：结合铜和树脂的方法
公开(公告)号：EP0189913B1
公开(公告)日：1988-12-14
申请号：EP86101165.8
申请日：1986-01-29
申请人： HITACHI, LTD.
发明人： Akahoshi, Haruo , Murakami, Kanji , Wajima, Motoyo , Furukawa, Kiyonori , Toba, Ritsuji , Shimazaki, Takeshi
IPC分类号： C23C18/38 , C23C18/40 , C23C16/40 , C23C16/56 , B32B15/08 , B32B15/20 , B32B31/20 , H05K3/46
CPC分类号： B32B15/08 , B32B15/20 , B32B38/004 , B32B2305/076 , C23C18/40 , C23C22/63 , C23C22/83 , H05K3/385 , H05K3/4611 , H05K2203/0315 , H05K2203/1157

8. 发明公开

EP2535138A2 High corrosion resistant equipment for a plant 有权
标题翻译： Fabrikanlage mit hoherKorrosionsbeständigkeit
公开(公告)号：EP2535138A2
公开(公告)日：2012-12-19
申请号：EP12171976.9
申请日：2012-06-14
申请人： Hitachi Ltd.
发明人： Ishibashi, Ryo , Takahashi, Katsuhito , Park, Seunghwan , Imano, Shinya , Akahoshi, Haruo , Ohashi, Kenya
IPC分类号： B23K20/12
CPC分类号： B23K20/1265 , B23K20/129 , B23K2201/12 , B23K2203/14 , Y10T428/12 , Y10T428/12389
摘要： Provided is high corrosion resistant equipment for a plant having the lining structure which exhibits high reliability against breaking of a joining portion over a long use period. The high corrosion resistant equipment for a plant includes a lining plate 1 and a support portion 3 which are made of a high corrosion resistance material and a structural material portion 2 made of a steel material or the like. The lining plate 1 and the support portion 3 include a joining portion 5 to which friction stirring is applied. The support portion 3 is assembled into or fastened to the structural material portion 2 by means of the geometrical structure with a gap interposed between the support portion 3 and the structural material portion 2. Due to such a constitution, high corrosion resistant equipment for a plant having the lining which exhibits high reliability can be acquired.
摘要翻译：本发明提供一种具有衬里结构的植物的高耐腐蚀性设备，其在长时间使用期间对连接部分断裂具有高可靠性。用于设备的高耐腐蚀设备包括由高耐腐蚀材料制成的衬板1和支撑部分3以及由钢材等制成的结构材料部分2。衬板1和支撑部3包括施加摩擦搅拌的接合部5。支撑部分3通过几何结构组装到结构材料部分2中或者将其紧固到结构材料部分2上，间隙介于支撑部分3和结构材料部分2之间。由于这种结构，用于植物的高耐蚀设备可以获得具有高可靠性的衬里。

9. 发明公开

EP0895447A3 A circuit board, a method for manufacturing same, and a method of electroless plating 失效
标题翻译：印刷电路板，它们的用于化学镀的制备和方法流程
公开(公告)号：EP0895447A3
公开(公告)日：2000-07-12
申请号：EP98113687.2
申请日：1998-07-22
申请人： Hitachi, Ltd.
发明人： Itabashi, Takeyuki , Akahoshi, Haruo
IPC分类号： H05K3/46
CPC分类号： H05K3/422 , H05K3/064 , H05K3/4652 , H05K2201/09563 , H05K2203/105 , Y10T29/49155 , Y10T29/49165
摘要： Objects of the present invention are to provide a circuit board, wherein electroless plating to fill via-holes can be controlled uniformly with desirable reproducibility, and via-hole portions (38) can be identified from surface of the substrate (21) after forming a second conductor (4) thereon; a manufacturing method of same; and a method of electroless plating. Feature of the present invention is in the specific circuit board obtained by applying a potential higher than the potential of the electroless plating to the conductor on the surface when filling the via-holes (38) by the electroless plating, and in the method. In accordance with the present invention, the circuit board, of which via-hole portions (38) can be identified optically, because the via-hole portion differs from the second conductor (4) in the surface condition, and a dent is formed.
摘要翻译：本发明的目的是提供一个电路板，worin无电解电镀来填充通孔能够均匀地具有所期望的再现性来控制，并且通过孔部（38）可从所述基板（21）表面上形成之后被识别第二导体（4）在其上; 的相同的制造方法; 和化学镀的方法。本发明的特征是在通过施加比无电电镀到表面上的导体的电势高的电势当由无电解电镀填充所述通孔（38）中得到的具体的电路板，和在所述方法中。在本发明中，电路板，它的通孔部（38）可以光学地鉴定，因为通孔部从表面状态的第二导体（4）的不同，和凹痕形成雅舞蹈。

10. 发明公开

EP0944126A1 Lithium secondary battery, its electrolyte, and electric apparatus using the same 审中-公开
标题翻译： LithiumSekundärbatterie，ihr Elektrolyt，und elektrischesGerät，das diese verwendet
公开(公告)号：EP0944126A1
公开(公告)日：1999-09-22
申请号：EP99102880.4
申请日：1999-03-03
申请人： Hitachi, Ltd.
发明人： Arai, Juichi , Katayama, Hideaki , Akahoshi, Haruo , Takamura, Tomoe , Iwayanagi, Takao
IPC分类号： H01M10/42 , H01M10/40
CPC分类号： H01M10/0569 , H01M10/4235 , H01M2200/10
摘要： Object of the present invention is to provide a lithium secondary battery, which is capable of terminating the operation of the battery safely accompanying with no rapid change in appearance, no gas generation, nor pressure change when any of overcharge, overdischarge, and abnormal temperature rise occurs with the secondary battery itself, its electrolyte, and electric apparatus using the battery as a power source.
A lithium secondary battery comprises a negative electrode (5, 6), which is capable of absorbing and desorbing lithium, a positive electrode (7, 8), which is capable of absorbing and desorbing lithium, and a non-aqueous electrolyte, wherein the non-aqueous electrolyte is solidified by a thermal reaction at a designated temperature.
摘要翻译：本发明的目的是提供一种锂二次电池，其能够安全地终止电池的运行，伴随着过充电，过放电和异常升温中的任何一个，外观上没有快速变化，没有气体产生，也没有压力变化发生在二次电池本身，其电解质和使用电池作为电源的电气设备中。锂二次电池包括能够吸收和解吸锂的负极（5,6），能够吸收和解吸锂的正极（7,8）和非水电解质，其中，非水电解质通过在指定温度下的热反应固化。

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