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1. 发明授权

EP2070635B1 LASER PROCESSING METHOD 有权
公开(公告)号：EP2070635B1
公开(公告)日：2015-02-18
申请号：EP07828332.2
申请日：2007-09-25
申请人： Hamamatsu Photonics K.K.
发明人： ATSUMI, Kazuhiro , KUNO, Koji , SUZUKI, Tatsuya
IPC分类号： B23K26/00 , B23K26/38 , B23K26/04 , B23K26/40 , H01L21/301 , C03B33/02 , C03B33/09 , H01L21/02 , H01L21/78
CPC分类号： H01L21/78 , B23K26/0057 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2201/40 , B23K2203/50 , C03B33/0222 , C03B33/091 , H01L21/02381 , H01L21/02675

2. 发明授权

EP2070633B1 LASER WORKING METHOD 有权
标题翻译：激光工作方法
公开(公告)号：EP2070633B1
公开(公告)日：2016-01-27
申请号：EP07807872.2
申请日：2007-09-26
申请人： Hamamatsu Photonics K.K.
发明人： ATSUMI, Kazuhiro , KUNO, Koji , SUZUKI, Tatsuya
IPC分类号： B23K26/38 , B23K26/06 , B23K26/40 , H01L21/301 , B23K26/00 , B23K26/04
CPC分类号： B23K26/046 , B23K26/0057 , B23K26/048 , B23K26/40 , B23K2203/50

3. 发明授权

EP2070636B1 LASER PROCESSING METHOD 有权
公开(公告)号：EP2070636B1
公开(公告)日：2015-08-05
申请号：EP07828566.5
申请日：2007-09-27
申请人： Hamamatsu Photonics K.K.
发明人： KUNO, Koji , SUZUKI, Tatsuya , ATSUMI, Kazuhiro
IPC分类号： B23K26/38 , B23K26/06 , B23K26/40 , H01L21/301 , B23K26/04 , B23K26/00 , H01L21/02 , H01L21/78
CPC分类号： B23K26/0057 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2203/50 , B28D5/0011 , H01L21/02381 , H01L21/02675 , H01L21/67092 , H01L21/78

4. 发明授权

EP1712322B1 LASER PROCESSING METHOD AND DEVICE 有权
标题翻译：激光装置和方法
公开(公告)号：EP1712322B1
公开(公告)日：2013-03-27
申请号：EP04806952.0
申请日：2004-12-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： ATSUMI, Kazuhiro , KUNO, Koji , KUSUNOKI, Masayoshi , SUZUKI, Tatsuya
IPC分类号： B23K26/04 , B23K26/38 , B23K26/00 , B23K26/40
CPC分类号： B23K26/0057 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2203/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided. This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.

5. 发明公开

EP2070634A1 LASER PROCESSING DEVICE 失效
标题翻译： LASERBEARBEITUNGSVORRICHTUNG
公开(公告)号：EP2070634A1
公开(公告)日：2009-06-17
申请号：EP07807875.5
申请日：2007-09-26
申请人： Hamamatsu Photonics K.K.
发明人： KUNO, Koji , SUZUKI, Tatsuya , KURITA, Norio , OSAJIMA, Tetsuya
IPC分类号： B23K26/38 , B23K26/06 , B23K26/40 , H01L21/301
CPC分类号： B23K26/38 , B23K26/0057 , B23K26/048 , B23K26/0624 , B23K26/0676 , B23K26/0853 , B23K26/0869 , B23K26/40 , B23K2201/40 , B23K2203/50
摘要： The time required for forming a modified region within an object to be processed is shortened. An apparatus 100 comprises a mount table 107, a light source 101 for emitting linearly polarized laser light L, a light source 41 for emitting laser light L3, a wave plate 51 for changing the polarization direction of the laser light L, a polarizing plate 52 for splitting the laser light L into a laser light component L1 having a polarization direction in an X direction and a laser light component L2 having a polarization direction in a Y direction, a wave plate 55 for orienting the polarization direction of the split laser light component L2 to the X direction, a lens 31 for converging the laser light components L1, L3, a lens 32 which is arranged in parallel with the lens 31 along the X direction and converges the laser light component L2 having the polarization direction oriented to the X direction, a control section 105 for controlling a device 29 such that a converging point of the laser light component L2 is located at a predetermined position with reference to a front face 3 by detecting a reflected light component L4, and a control section 115 for moving the mount table 107 along a line 5 while making the X direction substantially coincide with the line 5.
摘要翻译：在待处理物体内形成改质区域所需的时间缩短。装置100包括安装台107，用于发射线偏振激光L的光源101，用于发射激光L3的光源41，用于改变激光L的偏振方向的波片51，偏振板52 用于将激光L分解为具有X方向的偏振方向的激光成分L1和具有Y方向的偏振方向的激光成分L2，用于使分割的激光成分的偏振方向取向的波片55 L2到X方向，用于使激光成分L1，L3聚光的透镜31，沿着X方向与透镜31平行配置的透镜32，使具有偏振方向的激光成分L2朝向X方向方向，控制部分105，用于控制装置29，使得激光部件L2的会聚点相对于前表面3位于相对于正面3的预定位置处检测反射光分量L4;以及控制部分115，用于沿着线5移动安装台107，同时使X方向基本上与线5重合。

6. 发明公开

EP1712322A1 LASER PROCESSING METHOD AND DEVICE 有权
标题翻译： LASERBEARBEITUNGSVERFAHREN UND -VORRICHTUNG
公开(公告)号：EP1712322A1
公开(公告)日：2006-10-18
申请号：EP04806952.0
申请日：2004-12-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： ATSUMI, Kazuhiro , KUNO, Koji , KUSUNOKI, Masayoshi , SUZUKI, Tatsuya
IPC分类号： B23K26/04 , B23K26/38
CPC分类号： B23K26/0057 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2203/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided.
This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
摘要翻译：提供一种可以有效地执行激光加工同时最小化激光束的会聚点的偏差的激光加工方法。该激光处理方法包括：位移获取步骤（S07至S11），用用于测量物体的主表面的位移的测距激光束照射被处理物体，同时将激光束与透镜一起收敛，并获得沿着切割线的主表面，同时响应于照射检测由主表面反射的反射光; 并且沿着主表面相对于彼此移动处理物镜和物体，同时根据通过位移获取步骤获取的位移调节处理物镜与表面之间的间隙，从而沿着线形成修改区域切。

7. 发明公开

EP1707298A1 LASER PROCESSING METHOD AND DEVICE 有权
标题翻译：激光加工方法和装置
公开(公告)号：EP1707298A1
公开(公告)日：2006-10-04
申请号：EP04806954.6
申请日：2004-12-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： ATSUMI, Kazuhiro , KUNO, Koji , KUSUNOKI, Masayoshi , SUZUKI, Tatsuya
IPC分类号： B23K26/04 , B23K26/38
CPC分类号： B23K26/0057 , B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2201/40 , B23K2203/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.
This laser processing method comprises a displacement acquiring step (S06 and S07) of acquiring a displacement between a point on the line to cut and one end of the line to cut in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step (S08 and S09) of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position. After a modified region is formed in one end part of the line to cut by irradiation with a first laser beam for processing while holding the lens at the initial position, the lens is released from being held, and then the modified region is formed while adjusting the position of the lens.
摘要翻译：提供一种激光加工方法，其能够在使被加工物的端部的激光的聚光点的偏差最小化的同时高效地进行激光加工。该激光加工方法具备：位移取得步骤（S06，S07），其一边照射第2激光，一边取得被切断预定线上的点与切断预定线的一端之间的位移，透镜，用于测量物体的主表面的位移; 以及位置设定步骤（S08和S09），其根据所获得的位移来设定用于保持透镜的初始位置相对于对象的主表面，并且将透镜保持在由此设定的初始位置。在将透镜保持在初始位置的同时，通过照射第一激光束进行加工而在要切割的线的一个端部中形成改变区域之后，从透镜释放而不被保持，然后形成改性区域镜头的位置。

8. 发明授权

EP1707298B1 LASER PROCESSING METHOD AND DEVICE 有权
标题翻译：激光装置和方法
公开(公告)号：EP1707298B1
公开(公告)日：2011-08-31
申请号：EP04806954.6
申请日：2004-12-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： ATSUMI, Kazuhiro , KUNO, Koji , KUSUNOKI, Masayoshi , SUZUKI, Tatsuya
IPC分类号： B23K26/04 , B23K26/38
CPC分类号： B23K26/0057 , B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2201/40 , B23K2203/50
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a displacement acquiring step (S06 and S07) of acquiring a displacement between a point on the line to cut and one end of the line to cut in the object while irradiating the object with a second laser beam, converged by a lens, for measuring the displacement of a main surface of the object; and a position setting step (S08 and S09) of setting an initial position for holding the lens with respect to the main surface of the object according to the acquired displacement, and holding the lens at thus set initial position. After a modified region is formed in one end part of the line to cut by irradiation with a first laser beam for processing while holding the lens at the initial position, the lens is released from being held, and then the modified region is formed while adjusting the position of the lens.

9. 发明公开

EP2070635A1 LASER PROCESSING METHOD 有权
标题翻译：激光加工方法
公开(公告)号：EP2070635A1
公开(公告)日：2009-06-17
申请号：EP07828332.2
申请日：2007-09-25
申请人： Hamamatsu Photonics K.K.
发明人： ATSUMI, Kazuhiro , KUNO, Koji , SUZUKI, Tatsuya
IPC分类号： B23K26/38 , B23K26/00 , B23K26/04 , B23K26/40 , H01L21/301
CPC分类号： H01L21/78 , B23K26/0057 , B23K26/046 , B23K26/048 , B23K26/40 , B23K2201/40 , B23K2203/50 , C03B33/0222 , C03B33/091 , H01L21/02381 , H01L21/02675
摘要： A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference γ has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference γ exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut 5 and randomly reflects measuring laser light, whereby a segment where the presence of the particle affects a control signal in a line segment to cut is detected as the particle segment Z. Correcting the control signal in the particle segment Z inhibits a converging lens from moving more than necessary because of an error included in the signal value under the influence of the presence of the particle, thus allowing the converging point of the processing laser light to accurately follow a front face 3.
摘要翻译：相对于被处理物的激光照射面，在所希望的位置正确地形成改质区域。当平均差值γ在轨迹记录期间具有超过预定阈值的值时，定义包括平均差值γ超过预定阈值的线段S的粒子段Z. 这确定在要切割的线5上存在粒子并随机地反射测量激光，由此在线段中检测到粒子的存在影响控制信号的区段被检测为粒子区段Z.校正控制信号在粒子段Z中，由于在粒子的存在的影响下信号值中包括的误差，所以抑制了会聚透镜不必要地移动，从而允许加工激光的会聚点精确地跟随前面3 。

10. 发明公开

EP1804280A1 LASER BEAM MACHINING METHOD 有权
标题翻译：激光束加工方法
公开(公告)号：EP1804280A1
公开(公告)日：2007-07-04
申请号：EP05790460.9
申请日：2005-10-05
申请人： HAMAMATSU PHOTONICS K.K.
发明人： KUNO, Koji , SUZUKI, Tatsuya
IPC分类号： H01L21/301 , B23K26/00 , B23K26/06 , B23K26/40 , H01L21/302 , B23K101/40
CPC分类号： B23K26/0057 , B23K26/0665 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D5/0011 , H01L21/78
摘要： To provide a laser processing method which can highly accurately cut a planar object to be processed having an irregular surface as an entrance surface for processing laser light.
This laser processing method irradiates a planar object to be processed with laser light while locating a light-converging point within the object, thereby forming modified regions 71 to 77 to become a starting point region for cutting along lines to cut 5. The entrance surface r for the laser light in the object is an irregular surface. The lines to cut 5 extend over a depressed area surface r2 and a protruded area surface r1 in the entrance surface r. The modified region 71 is formed inside by a predetermined distance from the depressed area surface r2. At the time of irradiation with laser light along a part 51a on the protruded area surface r1, the light-converging point is located on the outside of the object. The modified region 72 is formed inside by a predetermined distance from the protruded area surface r1. At the time of irradiation with laser light along a part 51 b on the depressed area surface r2, the light-converging point is located on the outside of the object.
摘要翻译：本发明提供一种激光加工方法，其能够高精度地切割具有不规则表面的待加工平面物体作为用于处理激光的入射面。该激光加工方法，通过一边使聚光点位于被加工物内部一边照射激光，从而形成改质区域71〜77，成为沿着切割预定线5的切割的起点区域。入射面r 因为物体中的激光是不规则的表面。切割线5在入射面r上的凹陷区域表面r2和突出区域表面r1上延伸。改质区域71从凹陷区域表面r2向内形成预定距离。在沿着突出区域表面r1上的部分51a照射激光时，聚光点位于物体的外侧。改质区域72形成在距突出区域表面r1预定距离的内侧。在沿着凹陷区域表面r2上的部分51b照射激光时，聚光点位于物体的外侧。

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