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1. 发明公开

EP2551866A1 Electrical distribution system 有权
标题翻译：配电系统
公开(公告)号：EP2551866A1
公开(公告)日：2013-01-30
申请号：EP12178134.8
申请日：2012-07-26
申请人： GENERAL ELECTRIC COMPANY
发明人： Aimi, Marco Francesco , Gowda, Arun Virupaksha , Jiang, Jianjun
IPC分类号： H01H1/00 , H01H9/40 , H01H1/58 , B81B7/00 , H01H59/00
CPC分类号： H01H1/0036 , H01H1/58 , H01H9/40 , H01H59/0009 , Y10T29/49105
摘要： An apparatus 100, such as an electrical distribution system, is provided. The apparatus can include a first conductor 102 and a second conductor 104. Multiple conduction paths 116 can form parallel electrical connections along a connection span 118 between the first and second conductors 102, 104, with each of the conduction paths 116 having a respectively similar nominal electrical resistance. The first and second conductors 102, 104 have respective cross-sectional areas that decrease in opposing directions along said connection span 118.
摘要翻译：提供装置100，例如配电系统。该装置可以包括第一导体102和第二导体104.多个导电路径116可以形成沿第一导体102和第二导体104之间的连接跨距118的并联电连接，其中每个导电路径116分别具有相似的标称值电阻。第一导体102和第二导体104具有沿着所述连接跨度118沿相反方向减小的相应横截面积。

2. 发明公开

EP2053017A3 Electrical connection through a substrate to a microelectromechanical devise 有权
标题翻译：在微机电装置通过基板的电连接
公开(公告)号：EP2053017A3
公开(公告)日：2012-03-28
申请号：EP08166698.4
申请日：2008-10-15
申请人： General Electric Company
发明人： Hays, David Cecil , Aimi, Marco Francesco , Keimel, Christopher Fred , Claydon, Glenn Scott , Subramanian, Kanakasabapathi , Boomhower, Oliver Charles
IPC分类号： B81B7/00 , H01H1/00
CPC分类号： B81B7/007 , B81B2207/07 , B81B2207/096 , H01H1/0036
摘要： An electrical through-connection, or via, that passes through a substrate (22) to a bus (28) on a first surface (21) of the substrate (22). The via may be configured with an interlock (46) such that the electrically conductive core (60) of the via is constrained to thermally expand towards the second surface (23), away from the bus (28), thus preventing damage to the bus (28). The interlock (46) may be a local constriction or enlargement of the via near the first surface (21) of the substrate (22). The via may be greater in length along the bus (28) than a unit spacing of beams (30) in a parallel microswitch array (20) actuated in unison along the bus (28). The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface (23) of the substrate (22) than at the first surface (21).

3. 发明公开

EP2328160A1 Switch structures 有权
标题翻译： Schaltstrukturen
公开(公告)号：EP2328160A1
公开(公告)日：2011-06-01
申请号：EP10191932.2
申请日：2010-11-19
申请人： General Electric Company
发明人： Aimi, Marco Francesco , Bansal, Shubhra , Keimel, Christopher Fred , Kishore, Kuna Venkat Satya Rama , Sundaram, Sairam , Thakre, Parag
IPC分类号： H01H1/00 , H01H59/00
CPC分类号： H01H59/0009 , H01H1/0036 , H01H2001/0052 , H01H2001/0084
摘要： A device, such as a switch structure (100), is provided. The switch structure can include a contact (102) and a conductive element (104) each respectively disposed on a substrate (108). The conductive element can be composed substantially of metallic material, and can be configured to be deformable between a first position, in which the conductive element is separated from the contact by a separation distance, and a second position, in which the conductive element contacts the contact and stores mechanical energy. The conductive element can be further configured such that, subsequent to being deformed into the second position at a temperature between about room temperature and about half of a melting temperature of the metallic material for a cumulative time of at least 10 7 seconds, the separation distance in the absence of external forces varies by less than 20 percent over the cumulative time. Associated methods are also provided.
摘要翻译：提供诸如开关结构（100）的装置。开关结构可以包括每个分别设置在基板（108）上的触点（102）和导电元件（104）。导电元件可以大体上由金属材料构成，并且可以被配置为可在第一位置和导电元件与其接触的第二位置之间变形联系并存储机械能。导电元件可以被进一步配置，使得在随着金属材料的熔化温度约为室温至大约一半的温度下变形为第二位置，累积时间至少为10 7秒时，分离距离在没有外部力量的情况下，在累积时间内变化小于20％。还提供了相关方法。

4. 发明公开

EP2315227A1 Switch structures 审中-公开
标题翻译：开关结构
公开(公告)号：EP2315227A1
公开(公告)日：2011-04-27
申请号：EP10171544.9
申请日：2010-08-02
申请人： General Electric Company
发明人： Wang, Xuefeng , Aimi, Marco Francesco , Bansal, Shubhra , Keimel, Christopher Fred , Kishore, Kuna Venkat Satya Rama , Surbramanian, Kanakasabapathi , Patro, Debdutt , Sinha, Vikash Kumar , Prakash, Om
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2001/0084
摘要： A device, such as a switch structure (100), is provided, the device including a contact (102) and a conductive element (104). The conductive element can be configured to be selectively moveable between a non-contacting position, in which the conductive element is separated from the contact (in some cases by a distance less than or equal to about 4 µm, and in others by less than or equal to about 1 µm), and a contacting position, in which the conductive element contacts and establishes electrical communication with the contact. When the conductive element is disposed in the non-contacting position, the contact and the conductive element can be configured to support an electric field therebetween with a magnitude of greater than 320 V µm -1 and/or a potential difference of about 330 V or more.
摘要翻译：提供了诸如开关结构（100）的器件，该器件包括触点（102）和导电元件（104）。导电元件可以被配置为可选择地在非接触位置和非接触位置之间移动，在非接触位置中导电元件与接触件分离（在一些情况下小于或等于约4μm的距离，并且在其他范围内小于或等于等于约1μm）以及接触位置，其中导电元件与接触件接触并建立电连通。当导电元件布置在非接触位置时，接触件和导电元件可以被配置为在其间以大于320Vμm-1的量值和/或大约330V的电位差支持电场，或者更多。

5. 发明公开

EP2053017A2 Electrical connection through a substrate to a microelectromechanical devise 有权
标题翻译： Elektrische Verbindung durch ein Substrat a einer mikroelektromechanischen Vorrichtung
公开(公告)号：EP2053017A2
公开(公告)日：2009-04-29
申请号：EP08166698.4
申请日：2008-10-15
申请人： General Electric Company
发明人： Hays, David Cecil , Aimi, Marco Francesco , Keimel, Christopher Fred , Claydon, Glenn Scott , Subramanian, Kanakasabapathi , Boomhower, Oliver Charles
IPC分类号： B81B7/00
CPC分类号： B81B7/007 , B81B2207/07 , B81B2207/096 , H01H1/0036
摘要： An electrical through-connection, or via, that passes through a substrate (22) to a bus (28) on a first surface (21) of the substrate (22). The via may be configured with an interlock (46) such that the electrically conductive core (60) of the via is constrained to thermally expand towards the second surface (23), away from the bus (28), thus preventing damage to the bus (28). The interlock (46) may be a local constriction or enlargement of the via near the first surface (21) of the substrate (22). The via may be greater in length along the bus (28) than a unit spacing of beams (30) in a parallel microswitch array (20) actuated in unison along the bus (28). The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface (23) of the substrate (22) than at the first surface (21).
摘要翻译：一种穿过衬底（22）到衬底（22）的第一表面（21）上的总线（28）的电穿透连接或通孔。通孔可以配置有互锁（46），使得通孔的导电芯（60）被限制为朝向第二表面（23）热膨胀，远离总线（28），从而防止对总线的损坏（28）。互锁（46）可以是在基板（22）的第一表面（21）附近的通路的局部收缩或扩大。沿着总线（28），通孔的长度可以大于沿着总线（28）一致致动的平行微动开关阵列（20）中的梁（30）的单位间隔。通孔的宽度可以比长度窄，并且可以形成在基板（22）的第二表面（23）处比在第一表面（21）处更大的梯形几何形状。

6. 发明授权

EP2073238B1 Mems switch with improved standoff voltage control 有权
标题翻译： Mems开关通过改进的隔离电压控制
公开(公告)号：EP2073238B1
公开(公告)日：2017-11-01
申请号：EP08171425.5
申请日：2008-12-12
申请人： General Electric Company
发明人： Premerlani, William James , Keimel, Christopher Fred , Subramanian, Kanakasabapathi , Wang, Xuefeng , Aimi, Marco Francesco
IPC分类号： H01H59/00 , H01H1/00
CPC分类号： H01H59/0009 , H01H1/0036

7. 发明授权

EP2315221B1 Switch structure and method 有权
标题翻译：开关结构和方法
公开(公告)号：EP2315221B1
公开(公告)日：2012-11-14
申请号：EP10177345.5
申请日：2010-09-17
申请人： General Electric Company
发明人： Keimel, Christopher Fred , Aimi, Marco Francesco , Bansal, Shubhra , Corderman, Reed Roeder , Kishore, Kuna Venkat Satya Rama , Reddy, Eddula Sudhakar , Saha, Atanu , Subramanian, Kanakasabapathi , Thakre, Parag , Corwin, Alex David
IPC分类号： H01H1/00 , H01H59/00
CPC分类号： H01H1/0036 , H01H59/0009 , H01H2001/0052 , H01H2001/0084 , Y10T29/49105

8. 发明公开

EP2518745A2 Switching array having circuity to adjust a temporal distribution of a gating signal applied to the array 审中-公开
标题翻译：开关阵列电路，用于调整的驱动信号的临时分配施加于阵列
公开(公告)号：EP2518745A2
公开(公告)日：2012-10-31
申请号：EP12165462.8
申请日：2012-04-25
申请人： General Electric Company
发明人： Aimi, Marco Francesco
IPC分类号： H01H1/00
CPC分类号： H01H1/0036 , H01H9/541
摘要： A Micro-electro-mechanical systems (MEMS) switching array (1000) includes circuitry (1008), which may be coupled to a gate line (1006) of the array to adjust a temporal distribution of a gating signal applied to a plurality of MEMS switches that make up the switching array. The temporal distribution may be shaped to reduce a voltage surge that can develop in the switches during switching of electrical current. This voltage surge reduction is conducive to improving the durability of the array.
摘要翻译：一种微机电系统（MEMS）开关阵列（1000）包括电路（1008），其可以被耦合到所述阵列的栅极线（1006），以调整施加到MEMS的多个A选通信号的时间分布开关确实弥补开关阵列。时间分布可以被成形为减少电流的开关期间的电压浪涌确实可以在交换机发展。该电压浪涌减少，有利于提高阵列的耐久性。

9. 发明公开

EP2073236A1 MEMS Microswitch having a conductive mechanical stop 有权
标题翻译： MEMS-Mikroschalter mitleitfähigemMechanikstopp
公开(公告)号：EP2073236A1
公开(公告)日：2009-06-24
申请号：EP08171380.2
申请日：2008-12-11
申请人： General Electric Company
发明人： Wang, Xuefeng , Subramanian, Kanakasabapathi , Keimel, Christopher Fred , Aimi, Marco Francesco , Kishore, Kuna Venkat Satya Rama , Claydon, Glenn Scott , Boomhower, Oliver Charles , Thakre, Parag
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2059/0072
摘要： A MEMS switch 30, 50, 60, 70, 80 includes a substrate 32, a movable actuator 53, 63, 83 coupled to the substrate 32, a substrate contact 35, 85 , a substrate electrode 36, 56, 86, and a conductive stopper 39 59, 69, 79 electrically coupled to the movable actuator 33, 63, 83 and structured to prevent the movable actuator 33, 63, 83 from contacting the substrate electrode 36, 56, 86 while allowing the movable actuator 33, 63. 83 to make contact with the substrate contact 35, 85.
摘要翻译： MEMS开关30,50,60,70,80包括基板32，耦合到基板32的可移动致动器53,63,83，基板触点35,85，基板电极36,56,86以及导电电阻耦合到可动致动器33,63,83并且构造成阻止可动致动器33,63,83与基板电极36,56,88接触，同时允许可动致动器33,63,83。83 以与衬底接触35,85接触。

10. 发明授权

EP2073237B1 MEMS microswitch having a dual actuator and shared gate 有权
标题翻译： MEMS微动双致动和共享
公开(公告)号：EP2073237B1
公开(公告)日：2016-10-19
申请号：EP08171381.0
申请日：2008-12-11
申请人： General Electric Company
发明人： Keimel, Christopher Fred , Wang, Xuefeng , Aimi, Marco Francesco , Subramanian, Kanakasabapathi
IPC分类号： H01H59/00 , H01H9/40
CPC分类号： H01H59/0009 , H01H9/40 , H01H2001/0084 , H01H2057/006

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