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1. 发明公开

EP3093882A1 ELECTRONIC CIRCUIT DEVICE 有权
标题翻译： ELEKTRONISCHE SCHALTVORRICHTUNG
公开(公告)号：EP3093882A1
公开(公告)日：2016-11-16
申请号：EP14877890.5
申请日：2014-12-15
申请人： Furukawa Electric Co. Ltd.
发明人： KOJIMA Naoyuki , SATO Shunichiro , HIKASA Kazuhito , FUJIWARA Hidemichi
IPC分类号： H01L23/12 , H01L23/36 , H05K1/02
CPC分类号： H01L23/42 , H01L23/367 , H01L23/3735 , H01L23/3736 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/8384 , H01L2924/0002 , H05K1/0204 , H05K1/0271 , H05K1/0306 , H01L2924/00
摘要： To improve the heat dissipating effect of a conductor layer while suppressing a crack of a substrate along an interface between an insulating layer and a conductor layer. An electronic circuit device (100) has an insulating layer (10), a conductor layer (2) provided on at least one face side of the insulating layer (10), and a heat generating element (4) provided on a face of the conductor layer (2) at a side opposite of the insulating layer (10) via a joining layer (3). The conductor layer (2) has a heat dissipating conductor layer (21) located on a heat generating element (4) side and a circuit layer (22) located on an insulating layer (10) side, and the shortest distance (l 1 ) between a side end portion of the heat generating element (4) and a side end portion of the heat dissipating conductor layer (21) on a face of the heat dissipating conductor layer (21) on the circuit layer (22) side is greater than or equal to a thickness (t 1 ) of the heat dissipating conductor layer (21).
摘要翻译：为了提高导体层的散热效果，同时抑制沿着绝缘层和导体层之间的界面的基板的裂纹。电子电路装置（100）具有绝缘层（10），设置在绝缘层（10）的至少一个面侧的导体层（2）和设置在绝缘层（10）的表面上的发热元件导体层（2）经由接合层（3）与绝缘层（10）相对的一侧。导体层（2）具有位于发热元件（4）侧的散热导体层（21）和位于绝缘层（10）侧的电路层（22），并且最短距离（l 1）在电路层（22）侧的散热导体层（21）的面上的发热元件（4）的侧端部与散热导体层（21）的侧端部之间的距离大于或等于散热导体层（21）的厚度（t 1）。

2. 发明公开

EP3057123A1 JOINING STRUCTURE AND ELECTRONIC MEMBER-JOINING STRUCTURAL BODY 有权
标题翻译： VERBINDUNGSSTRUKTUR UNDSTRUKTURKÖRPERZUR VERBINDUNG ELEKTRONISCHER ELEMENTE
公开(公告)号：EP3057123A1
公开(公告)日：2016-08-17
申请号：EP14851457.3
申请日：2014-10-03
申请人： Furukawa Electric Co., Ltd.
发明人： KOJIMA Naoyuki , HIKASA Kazuhito , SATO Shunichiro , FUJIWARA Hidemichi , WATANABE Masato
IPC分类号： H01L21/603 , B22F7/00 , B22F7/04 , H01L21/52
CPC分类号： H01L24/83 , B22F7/004 , H01L21/4846 , H01L21/4871 , H01L23/142 , H01L23/3735 , H01L23/49866 , H01L24/29 , H01L24/32 , H01L24/75 , H01L2224/04026 , H01L2224/05155 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/29294 , H01L2224/29311 , H01L2224/2932 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/29387 , H01L2224/32227 , H01L2224/32245 , H01L2224/75101 , H01L2224/75102 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/75986 , H01L2224/83075 , H01L2224/8309 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2924/0544 , H01L2924/15787 , H01L2924/351 , H01L2924/3512 , H01L2924/35121 , H01L2924/00 , H01L2924/00014 , H01L2924/0541 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/05432 , H01L2924/054 , H01L2924/01028 , H01L2924/01069 , H01L2924/0105 , H01L2924/053 , H01L2924/01051 , H01L2924/01046 , H01L2924/01022 , H01L2924/00012
摘要： Provided is a joining structure that prevents occurrence of a crack at a joining portion between a metal member and a metal porous body, and can achieve a highly reliable joining. The joining structure of the present invention has a metal member 1 and a metal porous body 2 formed on the metal member 1. The metal member 1 includes an outer layer 1b and an inner layer 1c, the outer layer 1b including one of main surfaces 1a and being formed on the metal porous body 2 side, the inner layer 1c being formed at a position farther from the metal porous body 2 than the outer layer 1b in a thickness direction, the outer layer 1b has an average crystal grain size ds that is smaller than an average crystal grain size di of the inner layer 1c, and the metal porous body 2 has an average crystal grain size dp that is smaller than or equal to the average crystal grain size ds of the outer layer 1b.
摘要翻译：提供一种防止在金属构件和金属多孔体之间的接合部发生裂纹的接合结构，并且可以实现高可靠性的接合。本发明的接合结构具有形成在金属构件1上的金属构件1和金属多孔体2.金属构件1包括外层1b和内层1c，外层1b包括主表面1a 并且形成在金属多孔体2侧，内层1c形成在厚度方向上比外层1b更远离金属多孔体2的位置，外层1b的平均晶粒尺寸ds为小于内层1c的平均晶粒尺寸di，并且金属多孔体2的平均晶粒尺寸dp小于或等于外层1b的平均晶粒尺寸ds。

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