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1. 发明公开

EP3098844A4 HEAT-DISSIPATING MEMBER, METHOD FOR MANUFACTURING HEAT-DISSIPATING MEMBER, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, INTEGRATED MODULE, AND INFORMATION PROCESSING SYSTEM 审中-公开
标题翻译： WÄRMEABLEITENDESENDESELEMENT，VERFAHREN ZUR HERSTELLUNG EINESWÄRMEABLEITENDENELEMENTS，ELEKTRONISCHE VORRICHTUNG，VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG，INTEGRATES MODUL UND INFORMATIONSVERARBEITUNGSSYSTEM
公开(公告)号：EP3098844A4
公开(公告)日：2017-06-07
申请号：EP14880107
申请日：2014-07-08
申请人： FUJITSU LTD
发明人： SUZUKI TAKASHI , NAKAGAWA KANAE
IPC分类号： H01L23/36 , G08G1/042 , H01L21/56 , H01L23/31 , H01L23/373 , H01L23/38 , H01L23/433 , H05K7/20
CPC分类号： H05K7/20436 , G08G1/042 , H01L21/4878 , H01L21/4882 , H01L21/565 , H01L23/3121 , H01L23/36 , H01L23/3675 , H01L23/373 , H01L23/4334 , H01L24/48 , H01L35/02 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73215 , H01L2924/00014 , H01L2924/1815 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A heat dissipating component comprising: a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that is provided at the main body, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to an electronic component; and a covering portion that is formed from the first material, and that covers at least a portion of a bottom portion of a groove between the plurality of fins.
摘要翻译：一种散热部件，包括：由第一材料形成的主体; 散热片，其由导热率比所述第一材料高的第二材料形成，所述散热片设置在所述主体上，并且包括在顶点以外的位置处彼此热连接的多个翅片;和热连接部，将多个翅片连接到电子部件; 以及覆盖部分，其由第一材料形成并覆盖多个翅片之间的沟槽的底部的至少一部分。

2. 发明公开

EP2472712A4 POWER GENERATING APPARATUS AND POWER GENERATING SYSTEM PROVIDED WITH THE POWER GENERATING APPARATUS 有权
标题翻译：发电装置和与发电设备装机功率发电系统
公开(公告)号：EP2472712A4
公开(公告)日：2015-04-01
申请号：EP10811612
申请日：2010-07-05
申请人： FUJITSU LTD
发明人： SUZUKI TAKASHI
IPC分类号： H01L31/042 , H01L35/28 , H02N11/00 , H02S40/44
CPC分类号： H01L31/05 , H01L31/02021 , H01L31/042 , H01L35/28 , H02S40/44 , Y02E10/50 , Y02E10/60
摘要： A power generating apparatus according to an aspect of the invention includes a plurality of pn stacks 11, each formed by stacking a p-type semiconductor layer 11a and an n-type semiconductor layer 11b one on top of the other, and a mode switching unit 16 which effects switching to a photovoltaic power generation mode or a thermal power generation mode by connecting the plurality of pn stacks with each other. The mode switching unit 16 effects switching to the photovoltaic power generation mode by connecting the p-type semiconductor layers 11a in parallel with each other and the n-type semiconductor layers 11b in parallel with each other between the plurality of pn stacks 11. The mode switching unit 16 effects switching to the thermal power generation mode by connecting the p-type semiconductor layer 11a and the n-type semiconductor layer 11b in series between different ones of the pn stacks 11.

3. 发明公开

EP2159685A4 PROCESSOR 有权
标题翻译：处理器
公开(公告)号：EP2159685A4
公开(公告)日：2010-12-08
申请号：EP07767283
申请日：2007-06-20
申请人： FUJITSU LTD
发明人： FUSEJIMA ATSUSHI , SUZUKI TAKASHI , YOSHIDA TOSHIO , AKIZUKI YASUNOBU
IPC分类号： G06F11/34 , G06F9/38
CPC分类号： G06F9/3851 , G06F9/3013 , G06F9/3857 , G06F11/3466 , G06F2201/88

4. 发明公开

EP2536020A4 PIEZOELECTRIC POWER GENERATING DEVICE 有权
标题翻译：压电发电装置
公开(公告)号：EP2536020A4
公开(公告)日：2013-03-06
申请号：EP10845721
申请日：2010-02-09
申请人： FUJITSU LTD
发明人： SUZUKI TAKASHI
IPC分类号： H02N2/18 , H01L41/113
CPC分类号： H01L41/1136 , H02N2/181 , H02N2/188

5. 发明公开

EP2159690A4 INFORMATION PROCESSING UNIT AND METHOD FOR CONTROLLING REGISTER 审中-公开
标题翻译：信息处理单元及其控制方法寄存器
公开(公告)号：EP2159690A4
公开(公告)日：2010-09-01
申请号：EP07790185
申请日：2007-06-20
申请人： FUJITSU LTD
发明人： SUZUKI TAKASHI , YOSHIDA TOSHIO
IPC分类号： G06F9/38 , G06F9/30
CPC分类号： G06F9/3885 , G06F9/30127 , G06F9/3824 , G06F9/3851

6. 发明公开

EP1990714A4 PROCESSING DEVICE BY PREDICTING BRANCH FROM COMPRESSED ADDRESS INFORMATION 失效
标题翻译：处理设备通过预测JUNCTION压缩地址信息学报
公开(公告)号：EP1990714A4
公开(公告)日：2009-04-29
申请号：EP06714899
申请日：2006-02-28
申请人： FUJITSU LTD
发明人： YOKOI MEGUMI , UKAI MASAKI , SUZUKI TAKASHI
IPC分类号： G06F9/38
CPC分类号： G06F9/3806 , G06F9/322 , G06F9/324 , G06F9/3844
摘要： A processing device comprises an acquiring section to acquire an instruction at an acquisition stage, an address control section to determine an instruction address of an original memory for the instruction acquired by the acquiring section, a branch instruction predicting section to predict whether an instruction to be executed in the next execution stage is a branch instruction or not in accordance with instruction history information processed in the past, and an executing section to execute at least one instruction at the execution stage. The address control section includes an encoding section to generate higher-order address information made by compressing a predetermined higher-order bit part from predetermined higher-order and lower-order bit parts included in the instruction address, and a restoring section to restore the higher-order bit part from the higher-order address information. The branch instruction predicting section includes a history memory section that stores the higher-order bit part corresponding to a branch address of a processed branch instruction and the lower-order bit part at either one of a plurality of storing places determined from the higher-order bit part corresponding to a branch address of a processed branch instruction and the lower-order bit part.

7. 发明公开

EP3168867A4 HEAT DISSIPATION COMPONENT, HEAT DISSIPATION COMPONENT MANUFACTURING METHOD, ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, INTEGRATED MODULE, AND INFORMATION PROCESSING SYSTEM 审中-公开
标题翻译： WÄRMEABLEITUNGSKOMPONENTE，VERFAHREN ZUR HERSTELLUNG DERWÄRMEABLEITUNGSKOMPONENTE，ELEKTRONISCHE VORRICHTUNG，VERFAHREN ZUR HERSTELLUNG DER ELEKTRONISCHEN VORRICHTUNG，INTEGRATES MODUL UND INFORMATIONSVERARBEITUNGSSYSTEM
公开(公告)号：EP3168867A4
公开(公告)日：2017-07-05
申请号：EP14897355
申请日：2014-07-10
申请人： FUJITSU LTD
发明人： SUZUKI TAKASHI , NAKAGAWA KANAE
IPC分类号： H01L23/36 , H01L23/367 , H01L23/373 , H01L23/38 , H05K7/20
CPC分类号： H01L23/3735 , H01L23/36 , H01L23/367 , H01L23/38 , H01L2224/48091 , H01L2224/48472 , H01L2924/1815 , H05K7/20 , H05K7/2039 , H01L2924/00014
摘要： A heat dissipating component including a main body formed from a first material, and a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that covers the main body, and that includes a fin, and a connecting portion that is thermally connected to the fin at a position other than an apex of the fin and is also thermally connected to an electronic component.
摘要翻译：一种散热部件，包括由第一材料形成的主体和由导热率比所述第一材料高的第二材料形成的散热片，所述散热片覆盖所述主体并且包括散热片，并且所述散热片包括连接部在散热片的顶点以外的位置处与散热片热连接并且还与电子元件热连接的部分。

8. 发明公开

EP2159692A4 INFORMATION PROCESSOR AND LOAD ARBITRATION CONTROL METHOD 审中-公开
标题翻译：信息处理和控制方法LASTARBITRIERUNGS-
公开(公告)号：EP2159692A4
公开(公告)日：2010-09-15
申请号：EP07790191
申请日：2007-06-20
申请人： FUJITSU LTD
发明人： SUZUKI TAKASHI , YOSHIDA TOSHIO
IPC分类号： G06F9/38
CPC分类号： G06F9/3851

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