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    • 7. 发明公开
    • ELECTROCONDUCTIVE-FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM
    • 组成的用于形成电导电膜及其制造方法的导电膜
    • EP3029119A1
    • 2016-06-08
    • EP14832874.3
    • 2014-06-12
    • FUJIFILM Corporation
    • TSUYAMA HiroakiWATANABE ToruHAYATA Yuuichi
    • C09D201/00C09D1/00C09D5/24C09D7/12H01B1/00H01B1/22H01B13/00H05K1/09H05K3/12
    • The present invention provides an electroconductive-film-forming composition capable of forming an electroconductive film having excellent conductivity and few voids and a method for producing an electroconductive film using the same. The electroconductive-film-forming composition of the present invention contains copper particles having an average particle diameter of 1 nm to 10 µm, copper oxide particles having an average particle diameter of 1 nm to 500 nm, a reducing agent having a hydroxy group, a metal catalyst including metals other than copper, and a solvent, in which the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol% to 800 mol% with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles.
    • 本发明提供了在能够在导电电影形成具有优异的导电性和少量空隙和用于使用相同的导电性,在制造电影的方法的导电膜形成用组合物。 本发明的导电膜形成用组合物包含具有在1纳米至10微米的平均粒径,具有在1纳米至500纳米的平均粒径的氧化铜颗粒,具有羟基基团的还原剂的铜颗粒, 金属催化剂包括除铜之外的金属,和一种溶剂,其中,所述铜氧化物粒子的含量为50质量%〜300质量%相对于所述铜粒子的含量,还原剂的含量为100摩尔 %至800摩尔%,相对于氧化铜粒子的含量,和金属催化剂的含量以质量或更小10%,相对于氧化铜粒子的含量。