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    • 6. 发明公开
    • Image forming method including heat development while covering surface of light-sensitive material
    • 一种图像形成方法包括:在热显影期间它被覆盖,所述光敏材料。
    • EP0618503A2
    • 1994-10-05
    • EP94101914.3
    • 1994-02-08
    • FUJI PHOTO FILM CO., LTD.
    • Yokoya, Hiroaki, c/o Fuji Photo Film Co., Ltd.Tanabe, Osami, c/o Fuji Photo Film Co., Ltd.
    • G03F7/06G03F7/09G03F3/10G03F7/028
    • G03F7/0285
    • The present invention provides a new image forming method. The image forming method uses a light-sensitive material. The light-sensitive material comprises a support and a light-sensitive polymerizable layer. The light-sensitive polymerizable layer contains silver halide, a reducing agent and an ethylenically unsaturated polymerizable compound or a cross-linkable polymer. Any of the silver halide, the reducing agent, the polymerizable compound and the polymer are not encapsulated in the layer. The image forming method comprising the steps of imagewise exposing to light the light-sensitive material and simultaneously or thereafter heating the light-sensitive material at a temperature of not lower than 70 °C. At the heat development, the silver halide is developed and the polymerizable compound or the cross-linkable polymer is hardened. Thus, a hardened image is formed on the light-sensitive material. The heat development is conducted while covering a surface of the light-sensitive polymerizable layer with a sheet or a heating means. According to the present invention, a space of 0.5 to 500 µm intervenes between the surface of the light-sensitive polymerizable layer and the surface of the sheet or the heating means.
    • 本发明提供一种新的图像形成方法。 所述图像形成方法使用感光材料。 所述感光材料包括支持体和光敏层聚合。 感光层含有卤化银可聚合的烯不饱和可聚合化合物或可交联的聚合物的还原剂和。 任何的卤化银,还原剂,可聚合化合物和所述聚合物的层中的不包封。 所述的图像形成方法,包括成影像的步骤暴露于光的感光材料并同时或之后在不低于70℃的温度下在热显影加热光敏材料,卤化银显影和 聚合性化合物或可交联的聚合物硬化。 因此,硬化的图像形成在所述感光材料。 同时覆盖感光层的聚合性与片材或加热装置的一个表面的热进行显影。 。根据本发明,为0.5〜500微米的空间的光敏感的可聚合组层的表面和所述片材的表面或所述加热装置之间介入。