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1. 发明公开

EP1879011A3 Method for separating a minute sample from a work piece 有权
标题翻译：一种用于分离的工件的一个小样本方法
公开(公告)号：EP1879011A3
公开(公告)日：2009-09-02
申请号：EP07112014.1
申请日：2007-07-09
申请人： FEI COMPANY
发明人： Schampers, Ruud , Verkleij, Dick , Venema, Sjoerd
IPC分类号： G01N1/28 , H01J37/305 , H01J37/31 , G01N1/32 , G01N1/06
CPC分类号： H01J37/3056 , G01N1/06 , G01N1/286 , G01N1/32 , H01J2237/31732 , H01J2237/31745
摘要： The invention pertains to a method for separating a minute sample (1) from a work piece (2). Such a method is routinely used in the semiconductor industry to obtain samples from wafers to be inspected in a TEM. It occurred to the inventor that approximately 20% of the obtained samples could not be properly finished (thinned) due to a misalignment of specimen carrier (6) and sample. It turned out that this misalignment is caused by the specimen carrier contacting the sample prior to welding. By not contacting the sample while welding, but leaving a small gap between specimen carrier and sample, this misalignment is avoided. To avoid movement of the specimen carrier during welding, due to e.g. vibration, the specimen carrier can be landed on the wafer on a position (8) close to the sample.

2. 发明授权

EP1879011B1 Method for separating a minute sample from a work piece 有权
标题翻译：一种用于分离的工件的一个小样本方法
公开(公告)号：EP1879011B1
公开(公告)日：2013-01-30
申请号：EP07112014.1
申请日：2007-07-09
申请人： FEI COMPANY
发明人： Schampers, Ruud , Verkleij, Dick , Venema, Sjoerd
IPC分类号： G01N1/28 , H01J37/305 , H01J37/31 , G01N1/32 , G01N1/06
CPC分类号： H01J37/3056 , G01N1/06 , G01N1/286 , G01N1/32 , H01J2237/31732 , H01J2237/31745

3. 发明公开

EP1879011A2 Method for separating a minute sample from a work piece 有权
标题翻译： Verfahren zur Abtrennung einer kleinen Probe von einemWerkstück
公开(公告)号：EP1879011A2
公开(公告)日：2008-01-16
申请号：EP07112014.1
申请日：2007-07-09
申请人： FEI COMPANY
发明人： Schampers, Ruud , Verkleij, Dick , Venema, Sjoerd
IPC分类号： G01N1/28 , H01J37/305 , H01J37/31
CPC分类号： H01J37/3056 , G01N1/06 , G01N1/286 , G01N1/32 , H01J2237/31732 , H01J2237/31745
摘要： The invention pertains to a method for separating a minute sample (1) from a work piece (2). Such a method is routinely used in the semiconductor industry to obtain samples from wafers to be inspected in a TEM. It occurred to the inventor that approximately 20% of the obtained samples could not be properly finished (thinned) due to a misalignment of specimen carrier (6) and sample. It turned out that this misalignment is caused by the specimen carrier contacting the sample prior to welding. By not contacting the sample while welding, but leaving a small gap between specimen carrier and sample, this misalignment is avoided. To avoid movement of the specimen carrier during welding, due to e.g. vibration, the specimen carrier can be landed on the wafer on a position (8) close to the sample.
摘要翻译：本发明涉及一种从工件（2）分离微小样品（1）的方法。这种方法常规用于半导体工业中以在TEM中检查的晶片获得样品。发明人发现，由于样品载体（6）和样品的未对准，大约20％的获得的样品不能正确地完成（变薄）。原来，这种未对准是由焊接前样品载体与样品接触引起的。通过在焊接时不接触样品，但是在样品载体和样品之间留下小的间隙，则可以避免该失准。为了避免在焊接期间试样载体的移动，由于例如振动时，样品载体可以靠近样品的位置（8）落在晶片上。

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