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1. 发明公开

EP2555237A2 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：EP2555237A2
公开(公告)日：2013-02-06
申请号：EP12176678.6
申请日：2012-07-17
申请人： Elpida Memory, Inc.
发明人： Kitano, Tomohiro , Nagamine, Hisayuki
IPC分类号： H01L23/522 , H01L27/02
CPC分类号： H01L23/5226 , H01L21/563 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/5223 , H01L23/5225 , H01L23/528 , H01L25/0657 , H01L25/18 , H01L27/0207 , H01L27/10897 , H01L2224/16145 , H01L2225/06513 , H01L2225/06544 , H01L2225/06565 , H01L2924/15311
摘要： A semiconductor device comprises a first external terminal having a first size, a plurality of second external terminals each having a second size smaller than the first size, an external terminal area in which the first external terminal and the second external terminals are arranged, and a plurality of wires connecting between the second external terminals and a plurality of circuits formed adjacent to the external terminal area and corresponding to the second external terminals. The second external terminals and the wires constitute a plurality of interfaces. Each of the interfaces includes at least one adjustment portion that adjusts a time constant of the wire so that the wires have the same time constant. At least part of the adjustment portions is located in a margin area produced in the external terminal area by a difference between the first size and the second size.
摘要翻译：一种半导体装置，其特征在于，具有：第1外部端子，具有第1尺寸;多个第2外部端子，具有比所述第1尺寸小的第2尺寸;第1外部端子和第2外部端子排列的外部端子区域; 多条导线连接在第二外部端子和形成在外部端子区域附近并对应于第二外部端子的多个电路之间。第二外部端子和导线构成多个接口。每个接口包括至少一个调整部分，其调整导线的时间常数，使得导线具有相同的时间常数。至少一部分调整部分位于在外部端子区域中由第一尺寸和第二尺寸之间的差异产生的边缘区域中。

2. 发明公开

EP2535934A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：EP2535934A1
公开(公告)日：2012-12-19
申请号：EP12171618.7
申请日：2012-06-12
申请人： Elpida Memory, Inc.
发明人： Ishihara, Takashi , Nagamine, Hisayuki
IPC分类号： H01L27/02
CPC分类号： H01L27/0292
摘要： A semiconductor device is disclosed, which includes first and second power supply pads supplied with first and second power voltages, respectively, a first protection circuit coupled between the first and second power supply pads, and an internal circuit including a first power line and a plurality of transistors electrically coupled to the first power line. The first power line includes first and second portions, and the first portion is electrically connected to the first power supply pad. The device further includes a second protection circuit coupled between the second portion of the first power line and the second power supply pad.
摘要翻译：公开了一种半导体器件，其包括分别被供应第一和第二电源电压的第一和第二电源焊盘，耦合在第一和第二电源焊盘之间的第一保护电路以及包括第一电源线和多个电耦合到第一电力线的晶体管。第一电源线包括第一部分和第二部分，并且第一部分电连接到第一电源焊盘。该装置还包括耦合在第一电源线的第二部分和第二电源焊盘之间的第二保护电路。

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