会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明公开
    • WIRELESS CHARGING ARRANGEMENT
    • DRAHTLOSE LADEANORDNUNG
    • EP3061106A1
    • 2016-08-31
    • EP14855804.2
    • 2014-10-16
    • Elcoflex OY
    • TARVAINEN, TimoPELTONIEMI, TimoPAAVOLA, Juho
    • H01F27/28H02J7/02
    • H02J50/10H01F27/2828H02J7/025
    • In a manufacturing method of the induction charger film according to the invention a first patterned insulation layer (15) is advantageously printed on the surface of a clean copper foil (130). In the following manufacturing stages one or more conductive (16), semi-conductive, insulating material layers or layers including graphics, are printed on the patterned insulation layer (15). When the material layers to be manufactured on the first surface of the induction charger film have been printed, the induction charger film is attached to an appropriate surface film (19). After this copper conductors (131-134) of the induction charger are patterned by etching from the second, yet untreated surface of the metal foil. After etching the conductors a ferrite film (14) is laminated underneath the primary coil (13) and the copper conductors (131-134) of the induction charger, with which ferrite film the magnetic flux created by the primary coil (13) is directed above the primary coil.
    • 在根据本发明的感应充电器膜的制造方法中,有利地将第一图案化绝缘层(15)印刷在干净的铜箔(130)的表面上。 在以下制造阶段中,在图案化绝缘层(15)上印刷一个或多个导电(16)半导体绝缘材料层或包括图形的层。 当在感应充电器膜的第一表面上制造的材料层已被印刷时,感应充电器膜附着到适当的表面膜(19)上。 在感应充电器的这个铜导体(131-134)通过蚀刻从金属箔的第二未处理表面进行图案化之后。 在对导体进行蚀刻之后,铁氧体膜层叠在感应充电器的初级线圈(13)和铜导体(131-134)的下方,铁氧体膜由初级线圈(13)产生的磁通量导向铁氧体膜 在初级线圈之上。
    • 3. 发明公开
    • METHOD FOR MANUFACTURING A FLEXIBLE CIRCUIT BOARD AND A FLEXIBLE CIRCUIT BOARD
    • VERFAHREN ZUR HERSTELLUNG EINER FLEXIBLEN LEITERPLATTE UND EINE FLEXIBLE LEITERPLATTE
    • EP3039948A1
    • 2016-07-06
    • EP14840174.8
    • 2014-08-28
    • Elcoflex OY
    • TARVAINEN, TimoPAAVOLA, JuhoPELTONIEMI, Timo
    • H05K1/03H05K1/11H05K3/46H05K1/02B41J15/00
    • H05K3/4664H05K1/0393H05K2201/0355H05K2201/10098
    • In the manufacturing method according to the invention no separate working phases are needed for connecting the components of two conductive layers in desired places to each other by electrically conductive vias through the insulation layer. The vias are manufactured in connection with the manufacture of the insulating and conductive layers of the circuit board, which layers are appropriately patterned in connection with the manufacture. In the manufacturing method according to the invention, the first patterned insulation layer (22) is advantageously printed on the surface of a clean metal foil (21, 21 a), which is advantageously a copper foil. Holes are left in the insulation layer in places where the vias are to be manufactured. In the following manufacturing stages one or more conductive, semiconductive or insulating material layers (23, 24 25) are printed on the patterned insulation layer. The vias of the circuit board according to the invention are advantageously implemented by printing a conductive material (23) in the holes patterned in the first insulation layer (22), whereby an electrical contact from the printed conductive layer (23) to the metal foil (21, 21 a) is provided. Several patterned insulating and conductive layers can be printed on top of each other. After the material layers on the first surface of the circuit board have been printed, the side of the flexible circuit board manufactured by printing is attached to an appropriate support film (25). After this the copper conductors of the circuit board are patterned by etching to the second yet untreated surface of the metal foil. After the etching of the conductors a patterned insulating protective layer can be manufactured on the manufactured copper conductors of the circuit board for getting the circuit board ready for operation.
    • 在根据本发明的制造方法中,通过通过绝缘层的导电通孔,不需要单独的工作阶段来将所需位置中的两个导电层的组件彼此连接。 通孔与电路板的绝缘和导电层的制造相结合制造,该层与制造相结合地适当地构图。 在根据本发明的制造方法中,第一图案化绝缘层(22)有利地印刷在清洁金属箔(21,21a)的表面上,该金属箔有利地是铜箔。 在要制造通孔的地方,将孔留在绝缘层中。 在以下制造阶段中,在图案化绝缘层上印刷一个或多个导电,半导体或绝缘材料层(23,24 25)。 根据本发明的电路板的通孔有利地通过在图案化在第一绝缘层(22)中的孔中印刷导电材料(23)来实现,由此从印刷导电层(23)到金属箔 (21,21a)。 几个图案化的绝缘和导电层可以印刷在彼此的顶部。 在电路板的第一表面上的材料层已经被印刷之后,通过印刷制造的柔性电路板的一侧被附着到适当的支撑膜(25)上。 此后,电路板的铜导体通过蚀刻被图案化到金属箔的第二未处理表面。 在导体蚀刻之后,可以在制造的电路板的铜导体上制造图案化的绝缘保护层,以使电路板准备好运行。