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    • 6. 发明公开
    • Method of manufacturing thick-film resistor
    • Verfahren zur Herstellung eines Dickschichtwiderstandes
    • EP0747911A1
    • 1996-12-11
    • EP95108638.8
    • 1995-06-06
    • E.I. DU PONT DE NEMOURS AND COMPANY
    • Hayakawa, KeiichiroSmith, Jerome D.Yamada, Hidehiro
    • H01C17/06
    • H01C17/065H01C7/003H05K1/092H05K1/167H05K3/1258H05K2203/0568
    • To provide a method of manufacturing thick-film resistor elements that forms thick-film resistors having a uniform thickness on a substrate surface with high precision.
      A method of manufacturing thick-film resistor elements by applying a thick-film resistor composition, obtained by dispersing a conductive component and an inorganic binder in an organic medium and which has a specified rheology, through a clear relief image obtained by exposing, curing, and developing a resist layer of a photopolymerizable mixture formed on an insulating substrate according to the resist pattern, and the thick-film paste obtained at this time has almost the same thickness as the photopolymerizable layer on the surface of the insulating substrate and is patterned according to the high-precision pattern defined by the sharp, linear, lateral edge enclosed by the resist image removed by development.
    • 提供一种制造厚膜电阻器元件的方法,其在基板表面上以高精度形成厚度均匀的厚膜电阻器。 通过将通过将导电成分和无机粘合剂分散在有机介质中而得到的具有规定流变性的厚膜电阻体组合物,通过曝光,固化, 并且根据抗蚀剂图案显影形成在绝缘基板上的可光聚合混合物的抗蚀剂层,此时获得的厚膜浆料具有与绝缘基板表面上的可光聚合层几乎相同的厚度,并根据 由由显影去除的抗蚀剂图像包围的尖锐的,线性的,侧边缘限定的高精度图案。