专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1333504A2 Monolithically-integrated infrared sensor 有权转让
标题翻译： Monolithisch integrierter Infrarots传感器
公开(公告)号：EP1333504A2
公开(公告)日：2003-08-06
申请号：EP03075163.0
申请日：2003-01-17
申请人： Delphi Technologies, Inc.
发明人： Chavan, Abhijeet V. , Logsdon, James H. , Chilcott, Dan W. , Lee, Han-Sheng , Lambert, David K. , Vas, Timothy A.
IPC分类号： H01L35/02 , H01L35/08
CPC分类号： G01J5/14 , G01J5/12
摘要： An integrated sensor (10) comprising a thermopile transducer (12) and signal processing circuitry (4) that are combined on a single semiconductor substrate (20), such that the transducer output signal is sampled in close vicinity by the processing circuitry (14). The sensor (10) comprises a frame (18) formed of a semiconductor material that is not heavily doped, and with which a diaphragm (16) is supported. The diaphragm (16) has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles (22). Each thermopile (22) comprises a sequence of thermocouples (24), each thermocouple (24) comprising dissimilar electrically-resistive materials that define hot junctions (26) located on the diaphragm (16) and cold junctions (28) located on the frame (18). The signal processing circuitry (14) is located on the frame (18) and electrically interconnected with the thermopiles (22). The thermopiles (22) are interlaced so that the output of one of the thermopiles (22) increases with increasing temperature difference between the hot and cold junctions (26,28) thereof, while the output of the second thermopile (22) decreases with increasing temperature difference between its hot and cold junctions (26,28).
摘要翻译：包括组合在单个半导体衬底（20）上的热电堆换能器（12）和信号处理电路（4）的集成传感器（10），使得所述换能器输出信号在所述处理电路（14）附近被采样，。传感器（10）包括由不重掺杂的半导体材料形成的框架（18），并且支撑有隔膜（16）。隔膜（16）具有用于接收热（例如，红外线）辐射的第一表面，并且包括包含至少一对隔行热电堆（22）的感测层的多个层。每个热电堆（22）包括一系列热电偶（24），每个热电偶（24）包括不同的电阻材料，其限定位于隔膜（16）上的热接点（26）和位于框架上的冷接点（28） 18）。信号处理电路（14）位于框架（18）上并与热电堆（22）电互连。热电堆（22）交错，使得其中一个热电堆（22）的输出随着热连接点（26,28）之间温差的增加而增加，而第二热电堆（22）的输出随着增加其热连接点之间的温差（26,28）。

2. 发明公开

EP2365308A2 Sealed engine control module with integral ambient air pressure sensor 审中-公开
标题翻译： Versegeltes Motorsteuerungsmodul mit intregriertem Umgebungsluftdrucksensor
公开(公告)号：EP2365308A2
公开(公告)日：2011-09-14
申请号：EP11152364.3
申请日：2011-01-27
申请人： Delphi Technologies, Inc.
发明人： Borzabadi, Hamid R. , Wilcox, Ronald D. , Kuznia, Philip D. , Vas, Timothy A. , Little, Lewis Henry , Miller, David G.
IPC分类号： G01L9/00
CPC分类号： G01L19/0654 , G01L19/147
摘要： An engine control module (10) having an environmentally-sealed housing (12, 12a) includes a housing-mounted air pressure sensor (18) for providing a reliable measure of atmospheric air pressure to a control circuit (14a) mounted within the housing (12, 12a). The sensor (18) is mounted on an inboard face of the housing (12a), and includes a sensor element (18a), a body portion (18b) and a riser portion (18c). The sensor element (18a) is mounted in the body portion (18b), and the riser portion (18c) protrudes through an opening (20) in the housing (12a) to couple the sensor element (18a) to atmospheric pressure outside the housing (12, 12a). The body portion (18b) is sealingly secured to the inboard face of the housing (12a), and a set of conductor pins (26) molded into the body portion (18b) extend inward to engage a circuit board (14) enclosed by the housing (12, 12a), and thereby directly couple the sensor element (18a) to the ECM's control circuit (14a). The top of the riser portion (18c) is capped by a splash-proof lid (24) to prevent water intrusion.
摘要翻译：具有环境密封的壳体（12,12a）的发动机控制模块（10）包括壳体安装的空气压力传感器（18），用于向安装在壳体内的控制电路（14a）提供可靠的大气压力测量值 12,12a）。传感器（18）安装在壳体（12a）的内侧面上，并包括传感器元件（18a），主体部分（18b）和立管部分（18c）。传感器元件（18a）安装在主体部分（18b）中，并且提升部分（18c）通过壳体（12a）中的开口（20）突出，以将传感器元件（18a）耦合到壳体外部的大气压力（12,12a）。主体部分（18b）密封地固定在壳体（12a）的内侧面上，并且一组模制到主体部分（18b）中的导体销（26）向内延伸以与电路板（14）包围壳体（12,12a），从而将传感器元件（18a）直接耦合到ECM的控制电路（14a）。提升部分（18c）的顶部由防溅盖（24）盖住以防止水侵入。

3. 发明公开

EP1806565A1 Sensor module 审中-公开
标题翻译： Sensormodul
公开(公告)号：EP1806565A1
公开(公告)日：2007-07-11
申请号：EP06077303.3
申请日：2006-12-22
申请人： Delphi Technologies, Inc.
发明人： Manlove, Gregory J. , Long, Stephen P. , Borzabadi, Hamid R. , Vas, Timothy A. , Hawes, Kevin J.
IPC分类号： G01D11/24 , G01P1/02
CPC分类号： G01D11/245 , G01P1/023
摘要： A sensor module (10) is provided having a compact housing (12) containing a sensor (22). A low temperature co-fired ceramic substrate (20) is located on the housing (12). The sensor (22) and signal processing circuitry (24) are located on the low temperature co-fired ceramic substrate (20). The sensor module (10) further includes a metal shield (26, 28) substantially encapsulating the sensor (22).
摘要翻译：传感器模块（10）设置有具有包含传感器（22）的紧凑壳体（12）。低温共烧陶瓷基板（20）位于壳体（12）上。传感器（22）和信号处理电路（24）位于低温共烧陶瓷基片（20）上。传感器模块（10）还包括基本上封装传感器（22）的金属屏蔽（26,28）。

4. 发明公开

EP1333504A3 Monolithically-integrated infrared sensor 有权转让
标题翻译：单片集成红外线传感器
公开(公告)号：EP1333504A3
公开(公告)日：2007-01-31
申请号：EP03075163.0
申请日：2003-01-17
申请人： Delphi Technologies, Inc.
发明人： Chavan, Abhijeet V. , Logsdon, James H. , Chilcott, Dan W. , Lee, Han-Sheng , Lambert, David K. , Vas, Timothy A.
IPC分类号： H01L35/02 , H01L35/08
CPC分类号： G01J5/14 , G01J5/12
摘要： An integrated sensor (10) comprising a thermopile transducer (12) and signal processing circuitry (4) that are combined on a single semiconductor substrate (20), such that the transducer output signal is sampled in close vicinity by the processing circuitry (14). The sensor (10) comprises a frame (18) formed of a semiconductor material that is not heavily doped, and with which a diaphragm (16) is supported. The diaphragm (16) has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles (22). Each thermopile (22) comprises a sequence of thermocouples (24), each thermocouple (24) comprising dissimilar electrically-resistive materials that define hot junctions (26) located on the diaphragm (16) and cold junctions (28) located on the frame (18). The signal processing circuitry (14) is located on the frame (18) and electrically interconnected with the thermopiles (22). The thermopiles (22) are interlaced so that the output of one of the thermopiles (22) increases with increasing temperature difference between the hot and cold junctions (26,28) thereof, while the output of the second thermopile (22) decreases with increasing temperature difference between its hot and cold junctions (26,28).

5. 发明公开

EP2365308A3 Sealed engine control module with integral ambient air pressure sensor 审中-公开
标题翻译：与intregriertem环境空气压力传感器密封发动机控制模块
公开(公告)号：EP2365308A3
公开(公告)日：2014-10-01
申请号：EP11152364.3
申请日：2011-01-27
申请人： Delphi Technologies, Inc.
发明人： Borzabadi, Hamid R. , Wilcox, Ronald D. , Kuznia, Philip D. , Vas, Timothy A. , Little, Lewis Henry , Miller, David G.
IPC分类号： G01L9/00 , G01L19/06 , G01L19/14
CPC分类号： G01L19/0654 , G01L19/147
摘要： An engine control module (10) having an environmentally-sealed housing (12, 12a) includes a housing-mounted air pressure sensor (18) for providing a reliable measure of atmospheric air pressure to a control circuit (14a) mounted within the housing (12, 12a). The sensor (18) is mounted on an inboard face of the housing (12a), and includes a sensor element (18a), a body portion (18b) and a riser portion (18c). The sensor element (18a) is mounted in the body portion (18b), and the riser portion (18c) protrudes through an opening (20) in the housing (12a) to couple the sensor element (18a) to atmospheric pressure outside the housing (12, 12a). The body portion (18b) is sealingly secured to the inboard face of the housing (12a), and a set of conductor pins (26) molded into the body portion (18b) extend inward to engage a circuit board (14) enclosed by the housing (12, 12a), and thereby directly couple the sensor element (18a) to the ECM's control circuit (14a). The top of the riser portion (18c) is capped by a splash-proof lid (24) to prevent water intrusion.

6. 发明授权

EP1677089B1 Integrated pressure sensor and method of manufacture 有权转让
标题翻译：集成压力传感器及其制造方法
公开(公告)号：EP1677089B1
公开(公告)日：2008-03-26
申请号：EP05077861.2
申请日：2005-12-12
申请人： Delphi Technologies, Inc.
发明人： Borzabadi, Hamid R. , Koglin, Dennis M. , Long, Stephen P. , Vas, Timothy A.
IPC分类号： G01L19/04 , G01L9/00
CPC分类号： G01L9/0051 , G01L9/045 , G01L19/069

7. 发明公开

EP1677089A1 Integrated pressure sensor and method of manufacture 有权转让
标题翻译： Integrierter Drucksensor和Herstellungsverfahren
公开(公告)号：EP1677089A1
公开(公告)日：2006-07-05
申请号：EP05077861.2
申请日：2005-12-12
申请人： Delphi Technologies, Inc.
发明人： Borzabadi, Hamid R. , Koglin, Dennis M. , Long, Stephen P. , Vas, Timothy A.
IPC分类号： G01L19/04 , G01L9/00
CPC分类号： G01L9/0051 , G01L9/045 , G01L19/069
摘要： A technique for manufacturing an integrated pressure sensor (150) includes a number of steps. Initially, a substrate (200) with conductive electrical traces located on first and second sides of the substrate (200) is provided. A plurality of compensation circuits (100) are positioned in an array on the first side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the first side of the substrate (200). A plurality of pressure sensors (10) are positioned on the second side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the second side of the substrate (200). Each one of the sensors (10) is associated with one of the compensation circuits (100) to form a plurality of pressure sensor-compensation circuit pairs. The substrate (200) includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits (100) provides temperature compensation for an associated one of the sensors (10). The sensor-compensation circuit pairs are calibrated and singulated for final packaging.
摘要翻译：一种用于制造集成压力传感器（150）的技术包括多个步骤。首先，提供具有位于衬底（200）的第一和第二侧上的导电电迹线的衬底（200）。多个补偿电路（100）以与衬底（200）的第一侧上的一个或多个导电电迹线电接触的方式位于衬底（200）的第一侧上的阵列中。多个压力传感器（10）位于基板（200）的第二侧上，与基板（200）的第二侧上的一个或多个导电电迹线电接触。传感器（10）中的每一个与补偿电路（100）中的一个相关联，以形成多个压力传感器 - 补偿电路对。衬底（200）包括用于电连接传感器 - 补偿电路对中的每一个的导电通路。每个补偿电路（100）为相关联的一个传感器（10）提供温度补偿。对传感器补偿电路对进行校准和分组，以进行最终的封装。

8. 发明公开

EP1398298A3 Process of making an all-silicon microphone 审中-公开
标题翻译：一种用于有机硅电容传声器的制备方法
公开(公告)号：EP1398298A3
公开(公告)日：2015-06-24
申请号：EP03077437.6
申请日：2003-08-04
申请人： Delphi Technologies, Inc.
发明人： Freeman, John E. , Baney, William J. , Betzner, Timothy M. , Chilcott, Dan W. , Christenson, John C. , Vas, Timothy A. , Queen, George M. , Long, Stephen P.
IPC分类号： B81C1/00 , H04R19/00 , H04R31/00
CPC分类号： H04R31/00 , B81B2201/0257 , B81B2203/0127 , B81C1/00666 , H04R19/005 , H04R31/006 , Y10T29/43 , Y10T29/435 , Y10T29/49005
摘要： A process of forming a capacitive audio transducer (10), preferably having an all-silicon monolithic construction that includes capacitive plates (22,24) defined by doped single-crystal silicon layers (18,62). The capacitive plates (22,24) are defined by etching the single-crystal silicon layers (18,62), and the capacitive gap (30) therebetween is accurately established by wafer bonding, yielding a transducer (10) that can be produced by high-volume manufacturing practices.

9. 发明授权

EP1333504B1 Monolithically-integrated infrared sensor 有权转让
标题翻译：单片集成红外线传感器
公开(公告)号：EP1333504B1
公开(公告)日：2013-04-24
申请号：EP03075163.0
申请日：2003-01-17
申请人： Delphi Technologies, Inc.
发明人： Chavan, Abhijeet V. , Logsdon, James H. , Chilcott, Dan W. , Lee, Han-Sheng , Lambert, David K. , Vas, Timothy A.
IPC分类号： G01J5/12 , G01J5/14
CPC分类号： G01J5/14 , G01J5/12

10. 发明授权

EP1983324B1 Dual pressure sensor apparatus 有权转让
标题翻译：设备与两个压力传感器
公开(公告)号：EP1983324B1
公开(公告)日：2011-10-19
申请号：EP08153904.1
申请日：2008-04-01
申请人： Delphi Technologies, Inc.
发明人： Kuznia, Philip D. , Vas, Timothy A. , Delrymple, Derek A.
IPC分类号： G01L9/06 , G01L15/00
CPC分类号： G01L15/00 , G01L19/141

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式