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1. 发明公开

EP1995777A1 Transistor package with wafer level dielectric isolation 审中-公开
标题翻译： Transistorgehäusemit dielektrischer Isolierung der Waferebene
公开(公告)号：EP1995777A1
公开(公告)日：2008-11-26
申请号：EP08154902.4
申请日：2008-04-21
申请人： Delphi Technologies, Inc.
发明人： Myers, Bruce A. , Peugh, Darrel E. , Elmoursi, Alaa A. , Van Steenkiste, Thomas H. , Zhao, Zhibo , Gillespie, Bryan A.
IPC分类号： H01L23/492
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/3677 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/15312 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A low cost transistor package (10) is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die (12), high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer (16) is fixed to a silicon transistor die (12), for coupling to a heat conducting buffer (26) and attachment to a substrate (24). The dielectric layer (16) is fixed to the die (12) by growing the dielectric layer (16), depositing the dielectric layer (16), or applying the dielectric layer (16) using a plasma spray. In an aspect, a conductive layer (14) is formed to the silicon transistor die (12) by a thermal or kinetic spray process, and the dielectric layer (16) is applied to the conductive layer (14). The dielectric layer (16) may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die (12).
摘要翻译：为高功率应用提供了低成本晶体管封装（10）。该封装为硅晶体管管芯（12）提供高导热性和耗散性，高电流承载能力和隔离性以及高功率和热循环寿命性能和可靠性。电介质层（16）被固定到硅晶体管管芯（12）上，用于耦合到导热缓冲器（26）并连接到衬底（24）。通过生长电介质层（16），沉积电介质层（16）或使用等离子体喷涂来施加电介质层（16），将电介质层（16）固定到管芯（12）。在一个方面中，通过热或动力学喷涂工艺将硅导体层（14）形成到硅晶体管管芯（12）上，并且介电层（16）被施加到导电层（14）。介电层（16）也可以在晶体管制造之前或之后建立。电和热互连有利地从硅晶体管管芯（12）的相对侧定位。

2. 发明公开

EP1887098A3 High performance kinetic spray nozzle 审中-公开
标题翻译：高性能动力喷雾喷嘴
公开(公告)号：EP1887098A3
公开(公告)日：2008-08-20
申请号：EP07113208.8
申请日：2007-07-26
申请人： Delphi Technologies, Inc.
发明人： Zhao, Zhibo , Gillispie, Bryan A. , Han, Taeyoung , Elmoursi, Alaa A. , Patel, Nilesh B.
IPC分类号： C23C4/12 , B05D1/12 , B05B7/14
CPC分类号： C23C24/04 , B05B1/044 , B05B7/1486 , B05B7/1613
摘要： A nozzle assembly (48) for a kinetic spray system includes a convergent portion (72) , a throat portion (82) , and a divergent portion (76) , each cooperating together to define a passage (66) therethrough for passing a mixture of powder particles (22) suspended in a flow of a high pressure heated gas. The nozzle assembly (48) further includes an extension portion (86) attached to the divergent portion (76) and extending to a distal end (88) a pre-determined length (L) from the divergent portion (76) of the nozzle assembly (48) . The extension portion (86) permits a dragging force exerted on the powder particles (22) by the flow of high pressure heated gas to act upon the powder particles (22) for a longer duration of time, thereby permitting the powder particles (22) to accelerate to a greater velocity than has been previously achievable.
摘要翻译：用于动力喷雾系统的喷嘴组件（48）包括会聚部分（72），喉部分（82）和扩散部分（76），每个部分协作在一起以限定穿过其中的通道（66），以使粉末颗粒（22）悬浮在高压加热气流中。喷嘴组件（48）还包括附接到扩张部分（76）并从喷嘴组件的扩散部分（76）延伸到远端（88）的预定长度（L）的延伸部分（86）（48）。延伸部分86允许通过高压加热气体的流动施加在粉末颗粒22上的拖曳力作用在粉末颗粒22上更长的时间，由此允许粉末颗粒22与粉末颗粒22接触，加速到比以前更快的速度。

3. 发明公开

EP1365637A2 Copper circuit formed by kinetic spray 审中-公开
标题翻译： Kupferschaltung hergestellt mittels kinetischesSprühverfahren
公开(公告)号：EP1365637A2
公开(公告)日：2003-11-26
申请号：EP03076330.4
申请日：2003-05-05
申请人： Delphi Technologies, Inc.
发明人： Elmoursi, Alaa A. , Lautzenhiser, Frans P. , Campbell, Albert B. , Smith, John R.
IPC分类号： H05K3/10 , H05K3/24
CPC分类号： H05K3/102 , C23C24/04 , H05K1/092 , H05K3/245 , H05K2203/1344 , H05K2203/1518 , Y10T428/24926
摘要： The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer. Furthermore, the invention also concerns a process for forming a copper-based circuit, wherein the process includes the steps of providing an electrically insulative substrate, forming a bond layer including silver over select portions of the substrate according to a desired shape of the circuit, and depositing copper on the bond layer by the steps of introducing copper particles into a pressurized carrier gas, forming the pressurized carrier gas and the copper particles into a supersonic jet, and directing the jet toward the bond layer formed over the substrate such that the jet has a velocity sufficient to cause plastic deformation of the copper particles onto the bond layer, thereby forming an electrically conductive layer on the bond layer.
摘要翻译：本发明涉及一种铜基电路，其具有电绝缘性基板（60），根据电路的期望形状在基板（60）的选择部分上形成包含银的接合层（62），以及导电层，包括沉积在接合层（62）上的铜（101）的塑性变形颗粒。此外，本发明还涉及一种用于形成铜基电路的方法，其中该方法包括以下步骤：提供电绝缘衬底（60），在衬底（60）的选定部分上形成包含银的接合层（62）根据期望的电路形状，并且通过将铜颗粒（100）引入加压载气中的步骤，在接合层（62）上沉积铜（101），形成加压载气和铜颗粒（100）进入超音速射流，并将射流引导到形成在衬底（60）上方的接合层（62），使得射流具有足以使铜颗粒（101）塑性变形到接合层（62）上的速度，从而在接合层上形成导电层。

4. 发明公开

EP1887098A2 High performance kinetic spray nozzle 审中-公开
标题翻译： KinetischeHochleistungssprühdüse
公开(公告)号：EP1887098A2
公开(公告)日：2008-02-13
申请号：EP07113208.8
申请日：2007-07-26
申请人： Delphi Technologies, Inc.
发明人： Zhao, Zhibo , Gillispie, Bryan A. , Han, Taeyoung , Elmoursi, Alaa A. , Patel, Nilesh B.
IPC分类号： C23C4/12 , B05D1/12 , B05B7/14
CPC分类号： C23C24/04 , B05B1/044 , B05B7/1486 , B05B7/1613
摘要： A nozzle assembly (48) for a kinetic spray system includes a convergent portion (72) , a throat portion (82) , and a divergent portion (76) , each cooperating together to define a passage (66) therethrough for passing a mixture of powder particles (22) suspended in a flow of a high pressure heated gas. The nozzle assembly (48) further includes an extension portion (86) attached to the divergent portion (76) and extending to a distal end (88) a pre-determined length (L) from the divergent portion (76) of the nozzle assembly (48) . The extension portion (86) permits a dragging force exerted on the powder particles (22) by the flow of high pressure heated gas to act upon the powder particles (22) for a longer duration of time, thereby permitting the powder particles (22) to accelerate to a greater velocity than has been previously achievable.
摘要翻译：用于动力喷雾系统的喷嘴组件（48）包括会聚部分（72），喉部部分（82）和发散部分（76），每个共同部分协作以限定穿过其中的通道（66）悬浮在高压加热气体流中的粉末颗粒（22）。喷嘴组件（48）还包括附接到发散部分（76）并从喷嘴组件（76）的扩散部分（76）延伸到远端（88）的预定长度（L）的延伸部分（86）（48）。延伸部分（86）允许通过高压加热气体的流动施加在粉末颗粒（22）上的拖曳力，以在更长的时间内作用于粉末颗粒（22），从而允许粉末颗粒（22）加速到比以前可以实现的更大的速度。

5. 发明公开

EP1365637A3 Copper circuit formed by kinetic spray 审中-公开
标题翻译：通过动态喷涂生产的铜电路
公开(公告)号：EP1365637A3
公开(公告)日：2005-07-13
申请号：EP03076330.4
申请日：2003-05-05
申请人： Delphi Technologies, Inc.
发明人： Elmoursi, Alaa A. , Lautzenhiser, Frans P. , Campbell, Albert B. , Smith, John R.
IPC分类号： H05K3/10 , H05K3/24 , C23C24/04
CPC分类号： H05K3/102 , C23C24/04 , H05K1/092 , H05K3/245 , H05K2203/1344 , H05K2203/1518 , Y10T428/24926
摘要： The invention concerns a copper-based circuit having an electrically insulative substrate (60), a bond layer (62) including silver formed over select portions of the substrate (60) according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper (101) deposited on the bond layer (62). Furthermore, the invention also concerns a process for forming a copper-based circuit, wherein the process includes the steps of providing an electrically insulative substrate (60), forming a bond layer (62) including silver over select portions of the substrate (60) according to a desired shape of the circuit, and depositing copper (101) on the bond layer (62) by the steps of introducing copper particles (100) into a pressurized carrier gas, forming the pressurized carrier gas and the copper particles (100) into a supersonic jet, and directing the jet toward the bond layer (62) formed over the substrate (60) such that the jet has a velocity sufficient to cause plastic deformation of the copper particles (101) onto the bond layer (62), thereby forming an electrically conductive layer on the bond layer.

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