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1. 发明公开

EP1798766A3 Method for forming leadframe assemblies 审中-公开
标题翻译：一种用于形成引线框组件的方法
公开(公告)号：EP1798766A3
公开(公告)日：2008-09-17
申请号：EP06077173.0
申请日：2006-12-05
申请人： Delphi Technologies, Inc.
发明人： Djordjevic, Aleksandra , Berlin, Carl W.
IPC分类号： H01L23/498
CPC分类号： H01L23/49861 , H01L21/4846 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/00
摘要： A method for forming a leadframe assembly (22) is provided. The method includes the steps of providing a sheet (10) of leadframe material and depositing a brazing alloy (12) on a first surface of the sheet (10). The method also includes the steps of placing one or more substrates (16) on the first surface of the sheet (10) and in contact the brazing alloy (12), and heating the brazing alloy (12) to bond the substrate (16) to the first surface of the sheet (10).

2. 发明公开

EP1796444A2 Thermal conductive substrate and electronic assembly 审中-公开
标题翻译：。。。。。。。。。。。。。。。。
公开(公告)号：EP1796444A2
公开(公告)日：2007-06-13
申请号：EP06077045.0
申请日：2006-11-17
申请人： Delphi Technologies, Inc.
发明人： Fairchild, M. Ray , Djordjevic, Aleksandra , Ruiz, Javier
IPC分类号： H05K1/02
CPC分类号： H05K1/0206 , H01L23/3677 , H01L24/33 , H01L2224/32225 , H01L2924/09701 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H05K3/0061 , H05K2201/09836 , H01L2924/00
摘要： An electronics assembly (10) is provided including a circuit board substrate (20) having a top surface and a bottom surface and a plurality of thermal conductive vias (26) extending from the top surface to the bottom surface. At least one electronics package (12) is mounted to the top surface of the substrate (20). A heat sink device (30) is in thermal communication with the bottom surface of the substrate (20). Thermal conductive vias (26) are in thermal communication to pass thermal energy from the at least one electronics package (12) to the heat sink (30). At least some of the thermal conductive vias (26) are formed extending from the top surface to the bottom surface of the substrate (20) at an angle (θ).
摘要翻译：提供一种电子组件（10），其包括具有顶表面和底表面的电路板基底（20）和从顶表面延伸到底表面的多个导热通孔（26）。至少一个电子封装（12）安装到基板（20）的顶表面。散热装置（30）与衬底（20）的底表面热连通。导热通孔（26）热连通以将来自至少一个电子封装（12）的热能传递到散热器（30）。至少一些导热通孔（26）形成为以角度（R）从基板（20）的顶表面延伸到底表面。

3. 发明公开

EP2079085A2 Inductor that contains magnetic field propagation 审中-公开
标题翻译： Induktor mit Magnetfeldausbreitung
公开(公告)号：EP2079085A2
公开(公告)日：2009-07-15
申请号：EP08172026.0
申请日：2008-12-17
申请人： Delphi Technologies, Inc.
发明人： Berlin, Carl W. , Zimmerman, David W. , Djordjevic, Aleksandra
IPC分类号： H01F17/00 , H01F27/34
CPC分类号： H01F17/0013 , H01F27/346
摘要： An inductor (30,130) and method (100) of containing a magnetic field is provided. The inductor (30,130) includes a first set of layers (32,132) wound in a first predetermined direction, wherein each layer of the first set of layers (32,132) is electrically connected to one another, and a second set of layers (34,134) wound in a second predetermined direction, wherein each layer of the second set of layers (34,134) is electrically connected to one another and the first set of layers (32,132), and the second set of layers (34,134) is between a top layer (32A,132A) and a bottom layer (32B,132B), such that the top layer (32A,132A) forms a first pair with a first layer of the second set of layers (34,134), and the bottom layer (32B,132B) forms a second pair with a second layer of the second set of layers (34,134) so that the magnetic field is substantially contained, such as to remain substantially within a gap (35,135) defined between each layer of the pairs of layers.
摘要翻译：提供了一种包含磁场的电感器（30,130）和方法（100）。电感器（30,130）包括沿第一预定方向缠绕的第一组层（32,132），其中第一组层（32,132）的每个层彼此电连接，并且第二组层（34,134）缠绕在第二预定方向上，其中第二组层（34,134）的每个层彼此电连接，并且第一组层（32,132）和第二组层（34,134）位于顶层（32A）之间，132A）和底层（32B，132B），使得顶层（32A，132A）与第二组层（34,134）的第一层和底层（32B，132B）形成第一对，与第二组层（34,134）的第二层形成第二对，使得基本上包含磁场，例如基本上保持在每层层之间限定的间隙（35,135）内。

4. 发明公开

EP2034808A2 Embedded resistor and capacitor circuit and method of fabricating same 审中-公开
标题翻译： Eingebetteter Widerstand und Kondensatorkreislauf und Herstellungsverfahrendafür
公开(公告)号：EP2034808A2
公开(公告)日：2009-03-11
申请号：EP08159937.5
申请日：2008-07-08
申请人： Delphi Technologies, Inc.
发明人： Djordjevic, Aleksandra , Berlin, Carl W.
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K1/092 , H05K1/167 , H05K3/1291 , H05K2201/0355 , H05K2203/1126 , H05K2203/171
摘要： An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor.
摘要翻译：提供了一种嵌入式电阻和电容电路及其制造方法。电路包括基板，层叠在基板上的导电箔，以及设置在导电箔上的厚膜介电材料。在电介质材料上形成一个或多个厚膜电极，并且形成至少部分地接触厚膜电极的厚膜电阻器。电极由电极和导电箔形成。电极用作电阻和电容器的终端。

5. 发明公开

EP2034808A3 Embedded resistor and capacitor circuit and method of fabricating same 审中-公开
标题翻译：嵌入式电阻器和电容器的电路，及其制造方法
公开(公告)号：EP2034808A3
公开(公告)日：2011-04-06
申请号：EP08159937.5
申请日：2008-07-08
申请人： Delphi Technologies, Inc.
发明人： Djordjevic, Aleksandra , Berlin, Carl W.
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K1/092 , H05K1/167 , H05K3/1291 , H05K2201/0355 , H05K2203/1126 , H05K2203/171
摘要： An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor.

6. 发明公开

EP1796444A3 Thermal conductive substrate and electronic assembly 审中-公开
标题翻译：导热基板和电子组件
公开(公告)号：EP1796444A3
公开(公告)日：2008-11-05
申请号：EP06077045.0
申请日：2006-11-17
申请人： Delphi Technologies, Inc.
发明人： Fairchild, M. Ray , Djordjevic, Aleksandra , Ruiz, Javier
IPC分类号： H05K1/02
CPC分类号： H05K1/0206 , H01L23/3677 , H01L24/33 , H01L2224/32225 , H01L2924/09701 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H05K3/0061 , H05K2201/09836 , H01L2924/00
摘要： An electronics assembly (10) is provided including a circuit board substrate (20) having a top surface and a bottom surface and a plurality of thermal conductive vias (26) extending from the top surface to the bottom surface. At least one electronics package (12) is mounted to the top surface of the substrate (20). A heat sink device (30) is in thermal communication with the bottom surface of the substrate (20). Thermal conductive vias (26) are in thermal communication to pass thermal energy from the at least one electronics package (12) to the heat sink (30). At least some of the thermal conductive vias (26) are formed extending from the top surface to the bottom surface of the substrate (20) at an angle (θ).

7. 发明公开

EP1798766A2 Method for forming leadframe assemblies 审中-公开
标题翻译： Verfahren zur Bildung von Leiterrahmenanordnungen
公开(公告)号：EP1798766A2
公开(公告)日：2007-06-20
申请号：EP06077173.0
申请日：2006-12-05
申请人： Delphi Technologies, Inc.
发明人： Djordjevic, Aleksandra , Berlin, Carl W.
IPC分类号： H01L23/495
CPC分类号： H01L23/49861 , H01L21/4846 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/00
摘要： A method for forming a leadframe assembly (22) is provided. The method includes the steps of providing a sheet (10) of leadframe material and depositing a brazing alloy (12) on a first surface of the sheet (10). The method also includes the steps of placing one or more substrates (16) on the first surface of the sheet (10) and in contact the brazing alloy (12), and heating the brazing alloy (12) to bond the substrate (16) to the first surface of the sheet (10).
摘要翻译：提供了一种用于形成引线框架组件（22）的方法。该方法包括以下步骤：提供引线框架材料的片材（10）并且在片材（10）的第一表面上沉积钎焊合金（12）。该方法还包括以下步骤：将一个或多个基底（16）放置在片材（10）的第一表面上并接触钎焊合金（12），并加热钎焊合金（12）以将基底（16）到片材（10）的第一表面。

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