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1. 发明公开

EP1705969A2 Electronic assembly having a substrate laminated within a backplate cavity 审中-公开
标题翻译：电子邮件中的Elektronischer Aufbau mit een Ausnehmung einerRückplattelaminiertem Substrat
公开(公告)号：EP1705969A2
公开(公告)日：2006-09-27
申请号：EP06075073.4
申请日：2006-01-11
申请人： Delphi Technologies, Inc.
发明人： Mandel, Larry M. , Garner, Timothy D. , Baker, Andrew R.
IPC分类号： H05K3/00
CPC分类号： B30B5/02 , B30B15/024 , B30B15/065 , H01L24/75 , H01L2224/75303 , H01L2224/75315 , H01L2224/758 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/15787 , H05K1/0306 , H05K3/0061 , H05K3/386 , H05K2203/0278 , H05K2203/068 , H01L2924/00
摘要： An electronic assembly (100) includes a backplate (102), a substrate (106) and a pressure sensitive adhesive (PSA) (104). The backplate (102) includes a cavity (103) and the substrate (106) includes a plurality of interconnected electrical components (107). The substrate (106) is positioned within the cavity (103) and a wall height of the cavity (103) is greater than a combined thickness of the substrate (106) and the adhesive (104), which bonds the substrate (106) to the backplate (102).
摘要翻译：电子组件（100）包括背板（102），基板（106）和压敏粘合剂（PSA）（104）。背板（102）包括空腔（103），并且基板（106）包括多个互连的电气部件（107）。衬底（106）被定位在空腔（103）内并且空腔（103）的壁高度大于衬底（106）和粘合剂（104）的组合厚度，其将衬底（106）接合到背板（102）。

2. 发明公开

EP1720043A1 Apparatus and method for measuring wind and rain 审中-公开
标题翻译： Wetter- / Umgebungskommunikationsknoten
公开(公告)号：EP1720043A1
公开(公告)日：2006-11-08
申请号：EP06075883.6
申请日：2006-04-13
申请人： Delphi Technologies, Inc.
发明人： Koors, Mark A. , Baker, Andrew R. , Hansen, Mark C.
IPC分类号： G01W1/02 , G01P5/04
CPC分类号： G01P5/04 , G01P13/02 , G01W1/02 , G01W1/14
摘要： An apparatus and method for measuring wind and rain related information is disclosed. The apparatus comprises a dome shaped portion which is exposed to wind and rain. This dome shaped portion is mounted to a rod, which is mounted to the inside of a housing through a flexible diaphragm. This diaphragm cooperates with sensor electrodes arranges on a rigid plate within the housing. The change in capacity between the diaphragm and the sensor electrodes is determined and evaluated to produce information about the wind direction, corresponding to a capacitance change in certain sectors of the sensing electrodes, and the wind speed, corresponding to the amount of capacitance change. Pulse shaped capacitance changes are interpreted as rain drops allowing to determine by integration the amount of rainfall.
摘要翻译：公开了一种用于测量风雨相关信息的装置和方法。该装置包括暴露于风和雨的圆顶形部分。该圆顶形部分安装到杆上，该杆通过柔性隔膜安装到壳体的内部。该隔膜与传感器电极协作布置在壳体内的刚性板上。确定和评估隔膜和传感器电极之间的容量变化，以产生对应于感测电极的某些扇区中的电容变化的风向的信息和对应于电容量变化量的风速。脉冲电容变化被解释为雨滴，允许通过积分确定降雨量。

3. 发明公开

EP1705969A3 Electronic assembly having a substrate laminated within a backplate cavity 审中-公开
标题翻译：电子结构与层压在返回盘基片的凹部
公开(公告)号：EP1705969A3
公开(公告)日：2008-07-02
申请号：EP06075073.4
申请日：2006-01-11
申请人： Delphi Technologies, Inc.
发明人： Mandel, Larry M. , Garner, Timothy D. , Baker, Andrew R.
IPC分类号： H05K3/00
CPC分类号： B30B5/02 , B30B15/024 , B30B15/065 , H01L24/75 , H01L2224/75303 , H01L2224/75315 , H01L2224/758 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/15787 , H05K1/0306 , H05K3/0061 , H05K3/386 , H05K2203/0278 , H05K2203/068 , H01L2924/00
摘要： An electronic assembly (100) includes a backplate (102), a substrate (106) and a pressure sensitive adhesive (PSA) (104). The backplate (102) includes a cavity (103) and the substrate (106) includes a plurality of interconnected electrical components (107). The substrate (106) is positioned within the cavity (103) and a wall height of the cavity (103) is greater than a combined thickness of the substrate (106) and the adhesive (104), which bonds the substrate (106) to the backplate (102).

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