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1. 发明授权

EP1665361B1 METHOD FOR ENCAPSULATING LIGHT EMITTING DIODES 有权转让
公开(公告)号：EP1665361B1
公开(公告)日：2020-03-25
申请号：EP04783941.0
申请日：2004-09-13
申请人： Cree, Inc.
发明人： LEUNG, Michael, S. , TARSA, Eric, J. , IBBETSON, James
IPC分类号： H01L21/56 , H01L33/50 , H01L23/00

2. 发明公开

EP2038939A1 EFFICIENT EMITTING LED PACKAGE AND METHOD FOR EFFICIENTLY EMITTING LIGHT 有权转让
标题翻译：随着对高效发光效率的光辐射和方法LEDS HOUSING
公开(公告)号：EP2038939A1
公开(公告)日：2009-03-25
申请号：EP07777104.6
申请日：2007-05-16
申请人： CREE, INC.
发明人： LEUNG, Michael, S. , KELLER, Bernd , IBBETSON, James , TARSA, Eric, J.
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , F21K9/60 , F21K9/64 , F21V7/0008 , F21V7/0033 , F21V7/22 , F21V13/04 , F21V29/773 , F21Y2115/10 , H01L33/60
摘要： An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector directing at least some of the LED light toward the conversion material; the conversion material down-converting the wavelength of at least some of the reflected LED light. A method for emitting light from an LED package comprising providing an LED, reflector and conversion material, and emitting light from said LED, at least some of the LED light emitted toward the reflector. The method further comprises reflecting at least some of the LED light toward the conversion material, and converting at least some of said reflected LED light at the conversion material. At least some of the converted reflected LED light is emitted by the LED package.
摘要翻译： LED为一个LED封装包括发光LED的光，并且远程于所述转换材料的LED用于降频转换的LED的光的波长。该封装还包括反射器将至少一些所述LED的光的朝向转换材料，所述转换材料下转换中的至少一些反射LED光的波长。一种用于从LED到LED封装发射光方法包括：提供上，反射器和转换材料，并且从LED所述发射光，至少一些朝向反射器发射的发光二极管的光。该方法还包括反射的至少一些向所述转换材料LED光，并转换，至少一些所述的反射在转换材料的LED的光。至少一些转化的反射LED光由LED封装发出。

3. 发明授权

EP2038939B1 EFFICIENT EMITTING LED PACKAGE AND METHOD FOR EFFICIENTLY EMITTING LIGHT 有权转让
标题翻译：随着对高效发光效率的光辐射和方法LEDS HOUSING
公开(公告)号：EP2038939B1
公开(公告)日：2016-07-13
申请号：EP07777104.6
申请日：2007-05-16
申请人： Cree, Inc.
发明人： LEUNG, Michael, S. , KELLER, Bernd , IBBETSON, James , TARSA, Eric, J.
IPC分类号： F21K99/00 , F21V7/00 , H01L33/50 , F21V13/04 , H01L33/60
CPC分类号： H01L33/507 , F21K9/60 , F21K9/64 , F21V7/0008 , F21V7/0033 , F21V7/22 , F21V13/04 , F21V29/773 , F21Y2115/10 , H01L33/60

4. 发明公开

EP1665361A2 CONNECTOR 有权转让
标题翻译：连接器
公开(公告)号：EP1665361A2
公开(公告)日：2006-06-07
申请号：EP04783941.0
申请日：2004-09-13
申请人： CREE, INC.
发明人： LEUNG, Michael, S. , TARSA, Eric, J. , IBBETSON, James
IPC分类号： H01L21/56
摘要： A light emitting diode (LED) is disclosed comprising a plurality of semiconductor layers with a first contact on the bottom surface of the semiconductor layers and a second contact on the top surface of the semiconductor layer. A coating is included that comprises a cured binder and a conversion material that at least partially covers the semiconductor layers, wherein the second contact extends through the coating and is exposed on the same plane as the top surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light. In other embodiments first and second contacts are accessible from one side of the LED. A coating is included that comprises a cured binder and a conversion material. The coating at least partially covers the semiconductor layers, with the first and second contacts extending through the coating and exposed on the same plane as a surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light.
摘要翻译：一种用于涂覆多个半导体器件（55）的方法和装置（50），所述半导体器件特别适用于用包含转换颗粒的涂覆材料（70）涂覆LED（55）。根据本发明的一种方法包括提供具有形成腔体（68）的模具。多个半导体器件（55）安装在模具形成空腔（68）内，并且可固化涂层材料（70）被注入或以其他方式引入到模具中以填充模具形成空腔（68）并且至少部分地覆盖半导体设备（55）。涂层材料（70）被固化，使得半导体器件（55）至少部分嵌入固化的涂层材料中。将具有嵌入的半导体器件的固化涂层材料（70）从形成空腔（68）中移除。半导体器件（55）被分离，使得每个半导体器件至少部分地被固化涂层材料（70）的一层覆盖。根据本发明的用于涂覆多个半导体器件的装置（50）的一个实施例包括具有布置成保持半导体器件（55）的形成空腔（68）的分子壳体（51），形成空腔（68）也是布置成使得耐用涂层材料（70）可以注入并填充形成空腔（68）以至少部分地覆盖半导体器件（55）。

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