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    • 4. 发明公开
    • LED PACKAGE WITH ENCAPSULANT HAVING PLANAR SURFACES
    • LED-GEHÄUSEMIT EINEM VERKAPSELUNGSSTOFF MIT FLACHENOBERFLÄCHEN
    • EP2859596A2
    • 2015-04-15
    • EP13730742.7
    • 2013-06-05
    • Cree, Inc.
    • LOWES, TheodoreTARSA, Eric, J.HEIKMAN, StenKELLER, BerndREIHERZER, JesseBENJAMIN, Hormoz
    • H01L33/54
    • LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.
    • 公开了紧凑且有效地发光的LED封装,并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座和LED和底座上的毯子转换材料层。 密封剂可以在底座上,在LED上,并且在密封剂内反射的光将到达转化材料,其中它被全向吸收和发射。 当与具有半球密封剂或透镜的常规包装相比时,反射光现在可以逃避密封剂,允许有效排放和更宽的排放曲线。 在某些实施例中,LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂,LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系,从而在不同应用中实现更大的灵活性。