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    • 2. 发明公开
    • Optical and thermal interface for photonic integrated circuits
    • Optische und thermische Schnittstellefürphotonische integrierte Schaltungen
    • EP2910991A1
    • 2015-08-26
    • EP15000487.7
    • 2015-02-19
    • Aurrion, Inc.
    • Fish, Gregory AlanKoch, Brian R.
    • G02B6/42G02B6/12
    • G02B6/4224G02B6/12004G02B6/1221G02B6/132G02B6/136G02B6/4204G02B6/4219G02B6/4232G02B6/4269G02B6/428Y10T29/49117
    • Described herein are photonic systems and devices including a optical interface unit (220) disposed on a bottom side (212) of a photonic integrated circuit (PIC) (200) to receive light from an emitter (201) of the PIC. A top side (211) of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature (202) corresponding to the emitter (201) is formed with the emitter to be offset by a predetermined distance value; because the emitter (201) and the alignment feature (202) are formed using a shared processing operation, the offset, i.e., predetermined distance value, may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature (202) from the bottom side, e.g., a hole (203). A heat spreader layer (250) surrounds the optical interface unit (220) and is disposed on the bottom side (212) of the PIC to spread heat from the PIC.
    • 这里描述的是光子系统和装置,其包括设置在光子集成电路(PIC)(200)的底侧(212)上的光接口单元(220))以接收来自PIC的发射器(201)的光。 PIC的顶侧(211)包括用于经由顶侧将PIC电耦合到有机衬底的倒装芯片接口。 对应于发射器(201)的对准特征(202)形成有发射器偏移预定距离值; 因为使用共享处理操作来形成发射器(201)和对准特征(202),所以偏移量,即预定的距离值,可以在类似产生的PIC之间是精确和一致的。 PIC包括从底侧(例如,孔)(203)成像对准特征(202)的处理特征。 散热器层(250)围绕光学接口单元(220)并且设置在PIC的底侧(212)上以从PIC传播热量。