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1. 发明公开

EP2845234A1 LED-MODUL MIT LEITERPLATTE 有权
公开(公告)号：EP2845234A1
公开(公告)日：2015-03-11
申请号：EP13712700.7
申请日：2013-03-07
申请人： Tridonic Jennersdorf GmbH , AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： PACHLER, Peter , SZÜCS, Anna , LANGER, Gregor , SOMMER, Christian
IPC分类号： H01L33/60
CPC分类号： H01L33/46 , H01L33/60 , H01L2933/0025 , H01L2933/0058 , H05K1/021 , H05K2201/09827 , H05K2201/10106 , H05K2201/2054
摘要： The present invention relates to an LED module 10, a circuit board 1, and a method for coating the circuit board 1 that is used in an LED module 10. The circuit board 1 is used particularly for reflecting light emitted by at least one LED chip of the LED module 10. The at least one LED chip 6 is located on a carrier plate 5 in a cut-out 2 of the circuit board 1. To increase the light yield of the LED module 10, the circuit board 1 is sprayed with a highly reflective layer 4. The layer 4 can be an ink provided with reflective particles, for example, which is sprayed on using an ink jet printing method. The LED module can additionally have at least one colour conversion element 7, 8, 9, which is preferably positioned in or above the at least one cut-out 2 of the circuit board 1. Finally; positioning elements 12, 13 can improve the assembly of the LED module 10, particularly the alignment of the circuit board 1 and the carrier plate 5.
摘要翻译： LED模块10，电路板1以及涂覆在LED模块10中使用的电路板1的方法技术领域本发明涉及LED模块10，电路板1以及用于LED模块10中的电路板1的涂覆方法。电路板1特别用于反射由至少一个LED芯片 LED模块10的至少一个LED芯片6位于电路板1的切口2中的载体板5上。为了增加LED模块10的光输出，电路板1被喷射高反射层4.层4可以是设置有例如使用喷墨印刷法喷涂的反射颗粒的油墨。 LED模块还可以具有至少一个颜色转换元件7,8,9，其优选地定位在电路板1的至少一个切口2中或上方。定位元件12,13可以改善LED模块10的组装，特别是电路板1和承载板5的对准。

2. 发明公开

EP3100310A1 VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE 有权
标题翻译：一种用于生产电路板
公开(公告)号：EP3100310A1
公开(公告)日：2016-12-07
申请号：EP15708697.6
申请日：2015-01-21
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： LANGER, Gregor , DAMEJ, Mario , LUTSCHOUNIG, Ferdinand
IPC分类号： H01L33/60 , H05K1/18 , H05K3/00
CPC分类号： H05K1/0274 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2933/0058 , H01L2933/0066 , H05K1/183 , H05K3/0026 , H05K3/0044 , H05K3/0055 , H05K3/22 , H05K2201/09036 , H05K2201/10106 , H05K2201/2054 , H05K2203/308 , H01L2924/00014
摘要： The invention relates to a method for producing a circuit board comprising at least one cavity for receiving an electronic component, the walls of said cavity having a reflective, in particular specular reflector layer. The method is characterised by the following steps: providing a circuit board (1); applying a temporary protective layer (7) to at least one portion of the surface of the circuit board (1); producing the cavity (9) by penetrating the protective layer (7) in the region of said cavity (9); applying the reflector layer (11); removing the temporary protective layer (7).
摘要翻译：在去除临时保护层的。

3. 发明公开

EP2627991A1 OPTISCHER EVANESZENZFELDSENSOR 审中-公开
公开(公告)号：EP2627991A1
公开(公告)日：2013-08-21
申请号：EP11776316.9
申请日：2011-10-14
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： LANGER, Gregor , VORABERGER, Hannes
IPC分类号： G01N21/55 , G01N21/77 , G01N33/543 , G02B6/12 , G02B6/138 , G02B6/42 , G02B6/35 , G01H9/00 , G06F3/042 , C08F2/48 , H05K1/02 , H03K17/96
CPC分类号： G01N21/41 , G01N21/552 , G01N21/7703 , G01N2021/7776 , G01N2021/7783 , G02B6/138 , G06F3/0202 , G06F3/0421 , H03K17/9631 , H03K17/9638 , H05K1/0274 , H05K2201/10106 , H05K2201/10151 , Y10T29/49826
摘要： The invention relates to an optical sensor device (1), comprising a substrate (2), on which at least one light source (4), such as an LED, is arranged, from which at least one optical waveguide (7) leads to at least one receiver (5), such as a photodiode, to which an evaluating unit (6) is connected, wherein the optical waveguide (7) is accessible in a sensor region (8) for a change of the evanescent field of the optical waveguide present there; an optical layer (3) made of material that can be photopolymerized is applied to the substrate (2), wherein the optical waveguide (7) is structured by an exposure process in said optical layer, wherein the optical waveguide (7) is led to the surface (9) of the optical layer (3) in the sensor region (8).
摘要翻译：本发明涉及一种光学传感器装置（1），其包括衬底（2），至少一个光源（4）例如LED布置在所述衬底上，至少一个光波导（7）从所述衬底至少一个接收器（5），例如光电二极管，评估单元（6）连接到所述接收器（5），其中所述光波导（7）可在传感器区域（8）中进入以改变所述光学器件的所述渐逝场那里有波导; 将由可光聚合的材料制成的光学层（3）施加到基板（2），其中通过在所述光学层中的曝光工艺来构造光波导（7），其中光波导（7）被引导到传感器区域（8）中的光学层（3）的表面（9）。

4. 发明公开

EP3081056A1 VERFAHREN ZUM EINBETTEN EINER KOMPONENTE IN EINE LEITERPLATTE 有权
标题翻译：方法嵌入一个组件在一块电路板上
公开(公告)号：EP3081056A1
公开(公告)日：2016-10-19
申请号：EP14825088.9
申请日：2014-12-12
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： SCHWARZ, Timo , ZLUC, Andreas , LANGER, Gregor , STAHR, Johannes
IPC分类号： H05K1/18 , H05K3/46 , H05K1/02
CPC分类号： H05K1/183 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/2518 , H01L2224/48091 , H01L2224/48247 , H01L2224/73267 , H01L2924/181 , H05K1/0204 , H05K1/05 , H05K1/185 , H05K3/30 , H05K3/46 , H05K3/4602 , H05K3/4694 , H05K2201/10106 , H05K2203/0191 , H05K2203/1469 , H01L2924/00014 , H01L2924/00012
摘要： A method for embedding a component in a printed circuit board or an intermediate printed circuit board product, wherein the printed circuit board or the intermediate printed circuit board product has at least one insulating layer of a prepreg material and the component is fixed by the resin of the prepreg material, is characterized by the following steps: a) providing a composite (100) of the layers of the printed circuit board or the intermediate printed circuit board product (200), wherein this composite includes at least one curable prepreg material, b) producing a clearance (4) in the composite (100) for receiving the component (6) to be embedded, c) covering at least the region of the clearance (4) with a first temporary carrier layer (5) on a first side of the composite, d) positioning the component (6) to be embedded in the clearance (4) by means of the first temporary carrier layer (5), e) covering at least the region of the clearance (4) on the second side of the composite (100) with a second temporary carrier layer (9), f) pressing the composite (100) to the component (6) while curing the curable prepreg material, g) removing the temporary carrier layers (5, 9).

5. 发明公开

EP2195693A2 LEITERPLATTENELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权
标题翻译： VERFAHREN ZU DESSEN HERSTELLUNG的STARR-FLEXIBLES LEITERPLATTENELEMENT
公开(公告)号：EP2195693A2
公开(公告)日：2010-06-16
申请号：EP08782849.7
申请日：2008-09-11
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： LANGER, Gregor , STAHR, Johannes
IPC分类号： G02B6/42 , H05K1/02
CPC分类号： G02B6/43 , G02B6/138 , G02B6/4214 , H05K1/0274 , H05K3/4691 , H05K2201/09127
摘要： The invention relates to a printed circuit board element (10), comprising at least one flexible printed circuit board part (12) and at least one rigid printed circuit board part (11A, 11C; 34, 35; 37) having a component (17), which is accommodated in a cavity (14) and with a light-emitting or light-receiving part (20) projects over the edge (18) of the cavity (14), wherein the flexible printed circuit board part (12) has a flexible layer (15') made of an optical, photopolymerizable material (15), in which an optical fiber (15) is structured in alignment with the light-emitting or light-receiving part (20) of the optoelectronic component (17) by way of radiation.
摘要翻译：本发明涉及一种印刷电路板元件（10），其包括至少一个柔性印刷电路板部分（12）和至少一个具有部件（17）的刚性印刷电路板部分（11A，11C; 34,35; 37）），其容纳在空腔（14）中并且发光或光接收部分（17）突出在空腔（14）的边缘（18）上方，其中柔性印刷电路板部件（12）具有由光学可光聚合材料（15）制成的柔性层（15'），其中光纤（15）被构造成与光电子部件的发光或光接收部分（17）对齐 17）通过辐射。

6. 发明公开

EP1706770A1 LEITERPLATTENELEMENT MIT WENIGSTENS EINEM LICHT-WELLENLEITER SOWIE VERFAHREN ZUR HERSTELLUNG EINES SOLCHEN LEITERPLATTENELEMENTS 审中-公开
标题翻译：至少一个光波导电路板元件和方法用于制造这样的电路板元件
公开(公告)号：EP1706770A1
公开(公告)日：2006-10-04
申请号：EP04802021.8
申请日：2004-12-28
申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK Aktiengesellschaft
发明人： LEISING, Günther , KLAMMINGER, Arno , LANGER, Gregor , SCHMIDT, Volker , REITZER, Riika
IPC分类号： G02B6/43 , G02B6/122
CPC分类号： G02B6/43 , G02B6/12004 , G02B6/42 , G02B6/4201 , G02B2006/1213 , G02B2006/1219 , G02B2006/12195 , H01L2224/16225 , H05K1/0274
摘要： Disclosed is a printed circuit board element comprising an optical waveguide and an embedded optoelectronic element.

7. 发明授权

EP2845234B1 VERFAHREN ZUM BESCHICHTEN EINER LEITERPLATTE EINES LED-MODULS 有权
公开(公告)号：EP2845234B1
公开(公告)日：2018-07-11
申请号：EP13712700.7
申请日：2013-03-07
申请人： Tridonic Jennersdorf GmbH , AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： PACHLER, Peter , SZÜCS, Anna , LANGER, Gregor , SOMMER, Christian
IPC分类号： H01L33/60
CPC分类号： H01L33/46 , H01L33/60 , H01L2933/0025 , H01L2933/0058 , H05K1/021 , H05K2201/09827 , H05K2201/10106 , H05K2201/2054

8. 发明授权

EP2195693B1 STARR-FLEXIBLES LEITERPLATTENELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权
标题翻译： STARR柔性电路板元件与方法研究
公开(公告)号：EP2195693B1
公开(公告)日：2017-02-15
申请号：EP08782849.7
申请日：2008-09-11
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： LANGER, Gregor , STAHR, Johannes
IPC分类号： H05K1/02 , G02B6/43 , G02B6/138 , H05K3/46
CPC分类号： G02B6/43 , G02B6/138 , G02B6/4214 , H05K1/0274 , H05K3/4691 , H05K2201/09127

9. 发明公开

EP2789215A2 VERFAHREN ZUM HERSTELLEN EINER LEITERPLATTE UNTER ENTFERNUNG EINES TEILBEREICHS DERSELBEN SOWIE VERWENDUNG EINES DERARTIGEN VERFAHRENS 审中-公开
标题翻译：一种用于生产电路板的拆卸同一地区，这种程序使用下列的一部分
公开(公告)号：EP2789215A2
公开(公告)日：2014-10-15
申请号：EP12816428.2
申请日：2012-12-03
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： LEITGEB, Markus , WEIDINGER, Gerald , LANGER, Gregor , KARPOVYCH, Volodymyr
IPC分类号： H05K3/46 , B32B38/10
CPC分类号： H05K3/46 , H05K3/0044 , H05K3/4691 , H05K2201/09127 , H05K2203/0191 , H05K2203/0264 , H05K2203/107 , Y10T29/49156
摘要： The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner. Also disclosed is a use of such a method for producing a multilayer circuit board (1) and especially for creating voids in such a circuit board (1).
摘要翻译：本发明涉及一种用于制造电路板涉及移除的子区域的物。在所述方法中，至少两个层或所述电路板（1）互相连接的层片粘附力，子区域（6），以通过提供一种层被去除，从被连接到在电路板的相邻帘布层防治（7）的 -preventing或粘接防止材料，和子区域（6）要除去的边缘区域（8）被从所述电路板（1）的相邻的区域分离。。根据本发明，一个裂缝的形成和/或分离从所述电路板（1）被删除在一个子区域被启动或在该层上的子区域（6）（7）的防附着或粘结防止材料，并且所述子区域（6）要除去然后除去，从而能够去除的子区域（6），以从一个简单和可靠的电路板（1）被移除，并且如果必要的自动化，方式。所以圆盘游离缺失是用于制造多层电路基板用中使用的搜索方法（1）和尤其是用于谋求电路板产生空隙爱（1）。

10. 发明公开

EP3127405A1 VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE MIT ZUMINDEST EINER OPTOELEKTRONISCHEN KOMPONENTE 有权
标题翻译：一种用于生产电路板，至少一个光电组件
公开(公告)号：EP3127405A1
公开(公告)日：2017-02-08
申请号：EP15715131.7
申请日：2015-03-25
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： LANGER, Gregor
IPC分类号： H05K1/18 , H05K1/02 , G02B6/43
CPC分类号： H05K1/188 , G02B6/43 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2224/48091 , H01L2224/48227 , H05K1/0206 , H05K1/0209 , H05K1/0274 , H05K2201/10106 , H05K2201/10121 , H05K2201/10522 , H01L2924/00014
摘要： The invention relates to a method for producing a circuit board having at least one optoelectronic component, which method is characterized by the following steps: a) applying a transparent curable adhesive layer (1) to a carrier layer (2), b) placing at least one optoelectronic component (3) onto the adhesive layer (1) by means of an optically relevant side (4) of the component, c) curing the adhesive layer (1) into a window element (1'), d) embedding the component (3) in a circuit-board composite, e) structuring the carrier layer (2) in order to at least partially expose the window element (1') and to contact the component (3).
摘要翻译：本发明涉及一种用于制造具有至少一个光电部件，该方法是通过以下步骤为特征的电路基板：a）将一个透明的可固化粘合剂层（1）到载体层（2）中，b）在将（4）组分，c）该粘合剂层的固化（1）插入的窗元件（1“）中，d）嵌入至少一个光电部件（3）到粘合剂层（1）由光学相关侧的方式在电路板的复合，E成分（3））构成所述载体层（2）（以至少部分地露出窗元件（1“）和接触部件3）。

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