专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP0518701A3 Field programmable circuit module 失效
标题翻译：现场可编程电路模块
公开(公告)号：EP0518701A3
公开(公告)日：1993-04-21
申请号：EP92305443.1
申请日：1992-06-12
申请人： APTIX CORPORATION
发明人： Osann, Robert, Jr. , Shaw, George A., Jr. , Mohsen, Amr M.
IPC分类号： G06F15/60 , H05K1/00
CPC分类号： H01L23/5382 , H01L2224/49171 , H01L2924/10253 , H05K1/0289 , H05K1/112 , H05K2201/09945 , H05K2201/10689 , H05K2203/175 , H01L2924/00
摘要： The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customised pattern of bonding pads is then formed over the one or both surface of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalised pattern of bonding pads may also be formed on the surface of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearly via.
摘要翻译：本发明使用具有位于其一个或两个表面上的多个导电和可互连通孔的可编程互连基板。然后在衬底的一个或两个表面上形成定制的焊盘图案，该表面对应于期望安装在衬底上的特定表面安装封装的端子脚印。也可以在基板的表面上形成接合焊盘的一般化图案，用于通过细线电连接裸芯片的端子。所有接合焊盘通过直接电接触或通过从接合焊盘延伸到几乎通孔的导电迹线而电连接到一个或多个通孔。

2. 发明公开

EP0419232A3 Field programmable printed circuit board 失效
标题翻译：现场可编程电路板
公开(公告)号：EP0419232A3
公开(公告)日：1993-05-26
申请号：EP90310252.3
申请日：1990-09-19
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： G06F15/60 , H05K3/00 , H05K1/00 , H01L23/525
CPC分类号： G06F17/5027 , G01R31/2818 , G06F17/5068 , H01L23/525 , H01L2924/0002 , H05K1/029 , H05K1/0298 , H05K3/222 , H05K3/429 , H05K2201/10212 , H05K2201/10689 , H01L2924/00
摘要： A field programmable printed circuit board is provided which includes a multiplicity of component contacts for making electrical contact to the leads of electronic components to be mounted on the printed circuit board, a corresponding multiplicity of interconnect contacts for receipt of the leads on the package or packages of a programmable integrated circuit or circuits for interconnecting as desired the electronic components, and one or more layers of conductive traces formed on the printed circuit board, each conductive trace uniquely connecting electrically one component contact to one interconnect contact.

3. 发明公开

EP0437980A3 Custom tool printed circuit board 失效
标题翻译：定制工具印刷电路板
公开(公告)号：EP0437980A3
公开(公告)日：1993-02-24
申请号：EP90314409.5
申请日：1990-12-28
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H01L23/5382 , H01L2924/0002 , H05K1/029 , H05K1/0298 , H05K2203/175 , H01L2924/00
摘要： A printed circuit board contacts a plurality of component contacts for receipt of electronic components and a plurality of electrically conductive traces, each trace being electrically connected to a corresponding one of the component contacts. A corresponding plurality of interconnect holes is formed on a selected portion of the printed circuit board with each interconnect hole contacting uniquely a corresponding one of the plurality of electrically conductive traces. A multiplicity of custom conductive traces (106) is then formed in an interconnect region such that each of the multiplicity of conductive traces interconnects at least one of the interconnect holes to at least one other interconnect hole thereby to form an electrically conductive path between each of the interconnect holes interconnected by the custom conductive traces. A user is thus able to achieve a desired electrical function from the electronic components to be connected to the printed circuit board.
摘要翻译：印刷电路板接触多个组件触点以接收电子部件和多个导电迹线，每个迹线电连接到相应的一个部件触点。在印刷电路板的选定部分上形成相应的多个互连孔，每个互连孔唯一地接触多个导电迹线中相应的导电迹线。然后在互连区域中形成多个定制导电迹线（106），使得多个导电迹线中的每一个将至少一个互连孔互连至至少一个其它互连孔，从而在每个之间形成导电路径互连孔由定制导电迹线互连。因此，用户能够从要连接到印刷电路板的电子部件获得期望的电功能。

4. 发明授权

EP0481703B1 Interconnect substrate having integrated circuit for programmable interconnection and sample testing 失效
标题翻译：与可编程连接和样本分析的集成电路连接基板
公开(公告)号：EP0481703B1
公开(公告)日：2003-09-17
申请号：EP91309424.9
申请日：1991-10-14
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： H01L23/538
CPC分类号： H01L22/22 , G01R31/2853 , G01R31/2884 , G01R31/318505 , G01R31/318538 , G11C29/30 , H01L23/5252 , H01L23/528 , H01L23/5382 , H01L2924/0002 , H05K1/0286 , H01L2924/00

5. 发明公开

EP0437980A2 Custom tool printed circuit board 失效
标题翻译： Auf Bestellung bearbeitete gedruckte Leiterplatte。
公开(公告)号：EP0437980A2
公开(公告)日：1991-07-24
申请号：EP90314409.5
申请日：1990-12-28
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H01L23/5382 , H01L2924/0002 , H05K1/029 , H05K1/0298 , H05K2203/175 , H01L2924/00
摘要： A printed circuit board contacts a plurality of component contacts for receipt of electronic components and a plurality of electrically conductive traces, each trace being electrically connected to a corresponding one of the component contacts. A corresponding plurality of interconnect holes is formed on a selected portion of the printed circuit board with each interconnect hole contacting uniquely a corresponding one of the plurality of electrically conductive traces. A multiplicity of custom conductive traces (106) is then formed in an interconnect region such that each of the multiplicity of conductive traces interconnects at least one of the interconnect holes to at least one other interconnect hole thereby to form an electrically conductive path between each of the interconnect holes interconnected by the custom conductive traces. A user is thus able to achieve a desired electrical function from the electronic components to be connected to the printed circuit board.
摘要翻译：印刷电路板接触多个组件触点以接收电子部件和多个导电迹线，每个迹线电连接到相应的一个部件触点。在印刷电路板的选定部分上形成相应的多个互连孔，每个互连孔唯一地接触多个导电迹线中相应的导电迹线。然后在互连区域中形成多个定制导电迹线（106），使得多个导电迹线中的每一个将至少一个互连孔互连至至少一个其它互连孔，从而在每个之间形成导电路径互连孔由定制导电迹线互连。因此，用户能够从要连接到印刷电路板的电子部件获得期望的电功能。

6. 发明公开

EP0419232A2 Field programmable printed circuit board 失效
标题翻译： Je nach Anwendungsgebiet programmierbare gedruckte Schaltungsplatte。
公开(公告)号：EP0419232A2
公开(公告)日：1991-03-27
申请号：EP90310252.3
申请日：1990-09-19
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： G06F15/60 , H05K3/00 , H05K1/00 , H01L23/525
CPC分类号： G06F17/5027 , G01R31/2818 , G06F17/5068 , H01L23/525 , H01L2924/0002 , H05K1/029 , H05K1/0298 , H05K3/222 , H05K3/429 , H05K2201/10212 , H05K2201/10689 , H01L2924/00
摘要： A field programmable printed circuit board is provided which includes a multiplicity of component contacts for making electrical contact to the leads of electronic components to be mounted on the printed circuit board, a corresponding multiplicity of interconnect contacts for receipt of the leads on the package or packages of a programmable integrated circuit or circuits for interconnecting as desired the electronic components, and one or more layers of conductive traces formed on the printed circuit board, each conductive trace uniquely connecting electrically one component contact to one interconnect contact.
摘要翻译：提供了现场可编程印刷电路板，其包括用于与要安装在印刷电路板上的电子部件的引线电接触的多个部件触点，用于接收封装或封装上的引线的相应多个互连触点用于根据需要互连电子部件的可编程集成电路或用于形成在印刷电路板上的一层或多层导电迹线的电路，每个导电迹线将电气单一元件触点唯一地连接到一个互连触点。

7. 发明授权

EP0419232B1 Field programmable printed circuit board and CAD method therefor 失效
标题翻译：取决于现场可编程印刷电路板和CAD方法及其
公开(公告)号：EP0419232B1
公开(公告)日：2000-07-12
申请号：EP90310252.3
申请日：1990-09-19
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： G06F17/50 , H05K3/00 , H05K1/00 , H01L23/525
CPC分类号： G06F17/5027 , G01R31/2818 , G06F17/5068 , H01L23/525 , H01L2924/0002 , H05K1/029 , H05K1/0298 , H05K3/222 , H05K3/429 , H05K2201/10212 , H05K2201/10689 , H01L2924/00

8. 发明公开

EP0973108A2 Field programmable printed circuit board 失效
标题翻译：取决于现场可编程印刷电路板
公开(公告)号：EP0973108A2
公开(公告)日：2000-01-19
申请号：EP99119839.1
申请日：1990-09-19
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： G06F17/50 , H05K3/00 , H05K1/00 , H01L23/525
CPC分类号： G06F17/5027 , G01R31/2818 , G06F17/5068 , H01L23/525 , H01L2924/0002 , H05K1/029 , H05K1/0298 , H05K3/222 , H05K3/429 , H05K2201/10212 , H05K2201/10689 , H01L2924/00
摘要： A field programmable printed circuit board is provided which includes a multiplicity of component contacts for making electrical contact to the leads of electronic components to be mounted on the printed circuit board, a corresponding multiplicity of interconnect contacts for receipt of the leads on the package or packages of a programmable integrated circuit or circuits for interconnecting as desired the electronic components, and one or more layers of conductive traces formed on the printed circuit board, each conductive trace uniquely connecting electrically one component contact to one interconnect contact.

9. 发明公开

EP0518701A2 Field programmable circuit module 失效
标题翻译： Anwender程序员Schaltungsmodul。
公开(公告)号：EP0518701A2
公开(公告)日：1992-12-16
申请号：EP92305443.1
申请日：1992-06-12
申请人： APTIX CORPORATION
发明人： Osann, Robert, Jr. , Shaw, George A., Jr. , Mohsen, Amr M.
IPC分类号： G06F15/60 , H05K1/00
CPC分类号： H01L23/5382 , H01L2224/49171 , H01L2924/10253 , H05K1/0289 , H05K1/112 , H05K2201/09945 , H05K2201/10689 , H05K2203/175 , H01L2924/00
摘要： The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customised pattern of bonding pads is then formed over the one or both surface of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalised pattern of bonding pads may also be formed on the surface of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearly via.
摘要翻译：本发明使用具有位于其一个或两个表面上的多个导电和可互连通孔的可编程互连基板。然后在衬底的一个或两个表面上形成定制的焊盘图案，该表面对应于期望安装在衬底上的特定表面安装封装的端子脚印。也可以在基板的表面上形成接合焊盘的一般化图案，用于通过细线电连接裸芯片的端子。所有接合焊盘通过直接电接触或通过从接合焊盘延伸到几乎通孔的导电迹线而电连接到一个或多个通孔。

10. 发明公开

EP0481703A3 Interconnect structure for use with programming elements and test devices 失效
标题翻译：与编程元件和测试设备一起使用的互连结构
公开(公告)号：EP0481703A3
公开(公告)日：1992-08-05
申请号：EP91309424.9
申请日：1991-10-14
申请人： APTIX CORPORATION
发明人： Mohsen, Amr M.
IPC分类号： G06F15/60 , H01L23/538
CPC分类号： H01L22/22 , G01R31/2853 , G01R31/2884 , G01R31/318505 , G01R31/318538 , G11C29/30 , H01L23/5252 , H01L23/528 , H01L23/5382 , H01L2924/0002 , H05K1/0286 , H01L2924/00
摘要： An interconnect substrate has formed thereon a first plurality of conductive leads (108-1...108-J) and a second plurality of conductive leads (109-1...109-K). A plurality of cells (106-1,1...106-J,K) are formed in the substrate, each cell having a number of bonding pads (107-1...107-M) formed on the surface of the substrate above the region of the substrate in which the cell is formed, thereby to allow a plurality of integrated circuit chips and electrical components to be attached to the substrate and electrically connected to the cells. Devices and programming elements in the substrate or in integrated circuits mounted on the substrate allow selected connections to be formed between selected ones of the conductive leads to be connected electrically thereby to allow selected components mounted on the substrate to be electrically interconnected. Other devices in the substrate or in integrated circuits mounted on the substrate allow testing of the components mounted on the substrate to determine their performance and the checking of the integrity of the connections formed between conductive leads.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式