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1. 发明授权

EP2733181B1 RESIN COMPOSITION FOR A SURFACE TREATMENT, AND STEEL SHEET COATED WITH SAME 审中-实审转让
公开(公告)号：EP2733181B1
公开(公告)日：2024-02-07
申请号：EP12810861.0
申请日：2012-07-13
发明人： JUNG, Yong-Gyun , KIM, Gab-Yong , KIM, Woon-Jong , CHO, Jae-Dong , KIM, Jong-Sang , KIM, Joong-Kyu , CHOI, Myoung-Hee , SONG, Yon-Kyun
IPC分类号： C09D7/40 , C09D5/25 , C09D5/24 , H01L23/373 , C09D7/61

2. 发明公开

EP4053077A1 ALUMINUM-CONTAINING SILICA SOL DISPERSED IN NITROGEN-CONTAINING SOLVENT, AND RESIN COMPOSITION 审中-公开
公开(公告)号：EP4053077A1
公开(公告)日：2022-09-07
申请号：EP21889246.1
申请日：2021-11-04
申请人： Nissan Chemical Corporation
发明人： KUROIWA, Kazuya , ONISHI, Hikaru , SUGAWARA, Yuki , SUEMURA, Naohiko
IPC分类号： C01B33/145 , C01B33/146 , C09D5/25 , H01B3/00 , C09D7/62
摘要： There is provided a silica sol dispersed in a nitrogen-containing solvent and a silica-containing resin composition (in particular, an insulating resin composition) containing a nitrogen atom-containing polymer.
A silica sol comprising silica particles containing aluminum atoms and having an average primary particle diameter of 5 to 100 nm, the silica particles being dispersed in a nitrogen-containing solvent, wherein the aluminum atoms are bonded to the surfaces of the silica particles in an amount in terms of Al 2 O 3 of 800 to 10,000 ppm/SiO 2 . The silica particles are bonded to a silane compound or a hydrolysate of the silane compound. The nitrogen-containing solvent is an amide solvent. The nitrogen-containing solvent is dimethylacetamide, dimethylformamide, N-methylpyrrolidone, or N-ethylpyrrolidone. The insulating resin composition comprising the silica sol and a nitrogen-containing polymer. The nitrogen-containing polymer is polyimide, polyamide, polyamic acid, polyamideimide, polyetherimide, or polyesterimide. An insulation-coated conductor wire produced by insulation coating of a conductor wire with the insulating resin composition.

3. 发明授权

EP3395917B1 AQUEOUS DISPERSION TYPE ELECTRODEPOSITION LIQUID FOR INSULATING-FILM FORMATION 有权转让
公开(公告)号：EP3395917B1
公开(公告)日：2020-11-04
申请号：EP16878086.4
申请日：2016-09-27
申请人： Mitsubishi Materials Corporation
发明人： ISOMURA Jyunko , IIDA Shintaro , SAKURAI Hideaki
IPC分类号： C09D179/08 , C09D5/02 , C09D5/25 , C09D5/44 , C09D7/20

4. 发明公开

EP3571253A1 UV-LED DIELECTRIC INK FOR PRINTED ELECTRONICS APPLICATIONS 审中-实审
公开(公告)号：EP3571253A1
公开(公告)日：2019-11-27
申请号：EP18741930.4
申请日：2018-01-17
申请人： Sun Chemical Corporation
发明人： LIU, Ying , REBROSOVA, Erika , MENON, Nandakumar
IPC分类号： C09D5/25 , C09D11/00 , C09D11/02 , C09D11/101 , C09D11/104

5. 发明公开

EP3569654A1 EPOXY RESIN COMPOSITION 有权
公开(公告)号：EP3569654A1
公开(公告)日：2019-11-20
申请号：EP18738880.6
申请日：2018-01-09
申请人： Sumitomo Seika Chemicals Co., Ltd.
发明人： FUKUDA, Noriaki , HARISAKI, Ryota , YAMAMOTO, Katsumasa
IPC分类号： C08L63/00 , C08G59/32 , C09D5/25 , C09D7/40 , C09D163/00 , C09J11/08 , C09J163/00 , C09K3/10 , H01L21/312 , H01L23/29 , H01L23/31 , H05K1/03
摘要： Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

6. 发明授权

EP2279648B1 THICK FILM HIGH TEMPERATURE THERMOPLASTIC INSULATED HEATING ELEMENT 有权
公开(公告)号：EP2279648B1
公开(公告)日：2018-09-05
申请号：EP09735779.2
申请日：2009-04-21
申请人： Datec Coating Corporation
发明人： OLDING, Timothy Russell , RUGGIERO, Mary Ann
IPC分类号： H05B3/10 , C08L71/10 , C08L79/08 , C09D5/25 , H05B3/20
CPC分类号： H05B3/265 , C08G2650/40 , C08L71/00 , C08L79/08 , C08L81/02 , H05B2203/011 , H05B2203/013 , H05B2203/017 , H05B2203/028 , C08L2666/20
摘要： The present invention provides an integrated thick film heating element on a substrate made from high temperature melt-flowable thermoplastic polymer/powder additive formulations which form an electrically insulating thermoplastic dielectric coating on the substrate, and electrically resistive lead free films and electrically conductive film formulations that are deposited and fired to form an integrated thick film heating element on a substrate at a processing temperature well below 600° C. This thick film heating element is formed on a substrate material coated first with the electrically insulating, filled melt flowable high temperature thermoplastic polymer/powder composite layer on which is deposited the electrically resistive lead free thick film that is capable of operating over a wide range of power densities for consumer and industrial heating element applications, with suitable electrical insulation properties under temperature cycling to for example 250° C.

7. 发明公开

EP2735379A4 INSULATING FILM-COATED METAL FOIL 审中-公开
标题翻译：用绝缘薄膜被覆的金属薄膜
公开(公告)号：EP2735379A4
公开(公告)日：2015-03-18
申请号：EP12814565
申请日：2012-07-19
申请人： NIPPON STEEL & SUMIKIN MAT CO
发明人： OGURA TOYOSHI , YAMADA NORIKO , KUBO YUJI , ITO SAWAKO
IPC分类号： B05D7/24 , B32B9/00 , B32B15/08 , B32B27/00 , C09D5/25 , C09D7/12 , C09D183/04 , C23C26/00
CPC分类号： H01B3/00 , C08G77/16 , C08G77/58 , C08K5/05 , C09D183/14 , C23C18/04 , C23C18/1216 , C23C18/122 , C23C18/1241 , C23C18/1283 , C23C26/00 , C23C30/00 , H01B13/06 , C08L83/04
摘要： An insulating film-coated metal foil having on one or both surfaces thereof an organic-inorganic hybrid layer containing dimethylsiloxane and a metalloxane comprising a metal other than Si. Relative to the concentration [Si] 1/4t of the Si at a depth of 1/4t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer, the concentration [Si] 3/4t of the Si at a depth of 3/4t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer satisfies [Si] 1/4t

8. 发明公开

EP2757121A2 Curable composition 审中-公开
标题翻译：可固化组合物
公开(公告)号：EP2757121A2
公开(公告)日：2014-07-23
申请号：EP14001378.0
申请日：2010-12-06
申请人： Showa Denko K.K.
发明人： Ooga, Kazuhiko , Azuma, Ritsuko
IPC分类号： C08G18/81 , C08G18/83 , C08F290/06 , C09D5/25 , C09D175/16 , H05K3/28
CPC分类号： H05K1/0346 , C08G18/3212 , C08G18/718 , C08G18/8019 , C08G18/8116 , C09D175/16 , H05K3/287
摘要： The present invention provides a curable composition comprising:
(component A) a compound having a structural unit derived from a dimerdiol and having, as an end group, a group represented by formula (1):

wherein R 1 represents H or CH 3 and R 2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end of the compound;
(component B) a non-silicon-containing monofunctional (meth)acryloyl group-containing compound;
(component C) a photopolymerization initiator; and
(component D) a silane coupling agent.
摘要翻译：本发明提供一种固化性组合物，其含有（成分A）具有来自二聚二醇的结构单元且末端具有下述式（1）所示的基团的化合物，式中，R 1表示H或CH 3，R 2表示在该化合物的末端具有2至12个碳原子的烃基; （B成分）不含硅的单官能（甲基）丙烯酰基化合物; （C成分）光聚合引发剂; 和（组分D）硅烷偶联剂。

9. 发明公开

EP2514781A1 POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME 有权
标题翻译：聚合物维生素HABRARE ZUSAMMENSETZUNG DAMIT
公开(公告)号：EP2514781A1
公开(公告)日：2012-10-24
申请号：EP10837530.4
申请日：2010-12-06
申请人： Showa Denko K.K.
发明人： OOGA, Kazuhiko , AZUMA, Ritsuko
IPC分类号： C08G18/81 , C08G18/83 , C08F290/06 , C09D5/25 , C09D175/16 , H05K3/28
CPC分类号： H05K1/0346 , C08G18/3212 , C08G18/718 , C08G18/8019 , C08G18/8116 , C09D175/16 , H05K3/287
摘要： Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1):

wherein R 1 represents H or CH 3 and R 2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2):

wherein R 3 s each independently represent CH 3 or CH 2 CH 3 , and R 4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof. The structure having the structural unit derived from a dimerdiol is preferably represented by formula (3):
摘要翻译：提供一种可聚合化合物，光固化组合物和用于安装电路板的光固化防潮绝缘涂层材料，其减少环境影响，在低照射剂量下表面固化性优异，并且对基材材料具有高粘合性。根据本发明的化合物具有衍生自二聚二醇的结构单元，并且具有作为端基的由式（1）表示的基团：其中R 1表示H或CH 3，R 2表示具有2〜 12个碳原子。优选地，化合物具有作为端基的由式（1）表示的基团和由式（2）表示的基团：其中R 3各自独立地表示CH 3或CH 2 CH 3，并且R 4表示烃基在其末端具有3至9个碳原子。具有来自二聚二醇的结构单元的结构优选由式（3）表示：

10. 发明授权

EP1546270B1 PROCEDE DE FABRICATION D'UN DIISOCYANATE MODIFIE, PROCEDE DE FABRICATION D'UN VERNIS D'EMAILLAGE AUTOLUBRIFIANT, PROCEDE DE FABRICATION D'UN CONDUCTEUR ELECTRIQUE EMAILLE 有权
标题翻译：用于生产改性二异氰酸酯，用于生产自润滑磁漆，用于生产涂料ISOLATED电导体
公开(公告)号：EP1546270B1
公开(公告)日：2007-06-20
申请号：EP03773793.9
申请日：2003-09-19
申请人： Essex Nexans Europe
发明人： STUDER, Virgine , SCHILDKNECHT, Laurent , PIECHACZYK, Arnaud
IPC分类号： C09D5/25 , C09D179/08 , H01B3/30
CPC分类号： H01B3/40 , C08G18/2825 , C08G18/79 , C08G18/8064 , C09D179/08 , H01B3/302 , H01B3/305 , H01B3/306 , H01B3/421 , H01B3/427
摘要： The invention relates to a method of producing a modified diisocyanate to which is fixed an aliphatic pendant chain comprising at least 15 carbon atoms, said modified diisocyanate being obtained by reacting an isocyanate functional group of a triisocyanate with a terminal functional group of an aliphatic chain. The invention also relates to a method of producing a self-lubricating enamelling varnish and a method of producing an enamelled electrical conductor.

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