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1. 发明公开

EP4372390A1 BUS BAR ASSEMBLY AND CURRENT MEASURING DEVICE 审中-实审
公开(公告)号：EP4372390A1
公开(公告)日：2024-05-22
申请号：EP23210204.6
申请日：2023-11-15
申请人： Smart Electronics Inc.
发明人： CHAE, Hong Il , KIM, Hyun Chang , LEE, Kwang Hoon , KIM, Won Seok , KWON, Hyuk Jae , SON, Young Min , JEONG, Hyeon Chang
IPC分类号： G01R1/20
CPC分类号： G01R1/203 , G01R31/364
摘要： The present invention discloses a bus bar assembly including: a first conductive plate composed of a plurality of parts; a second conductive plate composed of a plurality of parts; and an insulator formed between the first conductive plate and the second conductive plate, wherein a common first terminal hole is formed at one end of the first conductive plate, one end of the second conductive plate, and one end of the insulator, a common second terminal hole is formed at respective opposite ends of the first conductive plate, the second conductive plate, and the insulator, the first conductive plate includes at least one first shunt resistor, the first shunt resistor, between the parts of the first conductive plate, electrically connects a part where the first terminal hole is formed and a part where the second terminal hole is formed, the second conductive plate includes at least one second shunt resistor, the second shunt resistor, between the parts of the second conductive plate, electrically connects a part where the first terminal hole is formed and a part where the second terminal hole is formed, and sensing pins necessary for measuring a voltage drop are formed at both ends of the first shunt resistor and the second shunt resistor. According to the present invention, stable and highly reliable current measurement is possible through multiple shunt resistors based on a redundancy design.

2. 发明公开

EP4369003A1 BATTERY MONITORING METHOD AND DEVICE 审中-实审
公开(公告)号：EP4369003A1
公开(公告)日：2024-05-15
申请号：EP23209095.1
申请日：2023-11-10
申请人： Smart Electronics Inc.
发明人： CHAE, Hong Il , KIM, Hyun Chang , LEE, Kwang Hoon , KIM, Won Seok , KWON, Hyuk Jae , SON, Young Min , JEONG, Hyeon Chang
IPC分类号： G01R1/20 , G01R31/364 , G01R31/367 , G01R31/374 , G01R31/3842 , H01M10/48
CPC分类号： Y02E60/10 , G01R1/203 , G01R31/364 , H01M10/48 , G01R31/374 , G01R31/3842 , G01R31/367
摘要： The present invention provides a battery monitoring method, which is performed by a battery monitoring device, including: measuring a first voltage drop across both ends of a first shunt resistor of a bus bar electrically connected to a battery and a second voltage drop across both ends of a second shunt resistor, which is in parallel or serial connection with the first shunt resistor; calculating a first current and a second current flowing, respectively, through the first shunt resistor and the second shunt resistor using a first voltage drop value and a second voltage drop value; and determining a state of the battery using a difference between a first current value and a second current value. According to the present invention, it is possible to increase the reliability of monitoring information related to the battery's state by utilizing current values that have undergone linearity compensation and temperature compensation.

3. 发明公开

EP4296695A1 CURRENT SENSING DEVICE 审中-实审
公开(公告)号：EP4296695A1
公开(公告)日：2023-12-27
申请号：EP22756445.7
申请日：2022-02-14
申请人： Smart Electronics Inc.
发明人： LEE, Jeong Bok , KIM, Dong Choon , KIM, Dong Hwa
IPC分类号： G01R19/00 , G01R1/20 , G01R15/20 , G01R1/30 , G08C17/02 , G08C19/02
摘要： The present invention relates to a current sensing device comprising: a bus bar including a plurality of low-resistance metal portions separated from each other with a resistance portion therebetween; a printed circuit board arranged below the bus bar; a plurality of fixing pins which are joined to the metal portions of the bus bar to fix the bus bar on the printed circuit board and provide a current path between the metal portions and the printed circuit board; and at least one Hall sensor module. At least a portion of the Hall sensor module is inserted into a sensor hole formed in at least one of the low-resistance metal portions of the bus bar.

4. 发明公开

EP1563517A1 FUSIBLE RESISTOR AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译： MELTING电阻及其制造方法
公开(公告)号：EP1563517A1
公开(公告)日：2005-08-17
申请号：EP02746177.1
申请日：2002-07-09
申请人： Smart Electronics, Inc.
发明人： KIM, Young Sun , KANG, Doo Won , AHN, Gyu Jin , NOH, Jin Seok
IPC分类号： H01C7/13
CPC分类号： H01C7/13
摘要： A fusible resistor and method of fabricating the same is provided. The fusible resistor has a very low resistance of 20 to 470mΩ by depositing thin films as a fusible element made of a material with low resistivity such as copper having a temperature coefficient of over 2,000 ppm/°C. The fusible resistor comprises a resistor body, a fusible element layer formed to surround the resistor body, caps formed to surround ends of the fusible element layer, lead wires attached to the caps, and an insulating layer for insulating the fusible element layer and the caps from outside. The thus-fabricated fusible resistor performs all functions of a use without generating excessive heat.

5. 发明公开

EP1339270A2 Method of manufacturing metal clad laminate for printed circuit board 审中-公开
标题翻译： Verfahren zur Herstellung eines metallkaschierten Laminatsfüreine Leiterplatte
公开(公告)号：EP1339270A2
公开(公告)日：2003-08-27
申请号：EP03251090.1
申请日：2003-02-24
申请人： SMART Electronics, Inc.
发明人： Yoo, Byuong Kuk , Baik, Eun Song , Song, Jong Seok , Cho, Rae Ook
IPC分类号： H05K3/38 , B32B15/08
CPC分类号： H05K3/381 , B32B15/08 , B32B37/04 , B32B37/08 , B32B38/0012 , B32B2037/0092 , B32B2038/0016 , B32B2311/00 , B32B2327/12 , B32B2457/08 , H05K1/034 , H05K3/382
摘要： The present invention relates to a method of manufacturing a metal clad laminate for printed circuit board, characterized by direct adhesion of a conductive metal foil without use of a thermosetting resin having low melting points, an adherent film or an adhesive. The method includes forming fine protrusions on at least one surface of a fluorine-based resin insulation layer, roughening one surface of a conductive metal foil, laminating the fluorine-based resin insulation layer having fine protrusions on the roughened metal foil so that the roughened surface of the metal foil and the protrusion-formed surface of the insulation layer face each other to form a laminated body, and compressing the laminated body under vacuum, pressure and heat. The method of manufacturing the metal clad laminate by directly adhering the conductive metal foil with a single dielectric structure has advantages in terms of lower manufacturing costs compared to conventional dual dielectric structures, and very stable operation of the metal clad laminate in high frequency regions due to minimized variations of electrical and mechanical properties. Thus, the present method is effective in manufacturing the printed circuit board usable in the high frequency regions.
摘要翻译：本发明涉及一种制造印刷电路板用金属包覆层压板的方法，其特征在于，不使用具有低熔点的热固性树脂，粘附膜或粘合剂直接粘附导电金属箔（1）。该方法包括在氟基树脂绝缘层（2）的至少一个表面上形成微细突起，使导电金属箔（1）的一个表面粗糙化，将具有微细突起的氟基树脂绝缘层（2）层压在使金属箔（1）的粗糙面和绝缘层（2）的突起形成面相对地形成层叠体，在真空下压制层压体和热。通过用单个电介质结构直接粘接导电金属箔来制造金属覆层叠层的方法与传统的双电介质结构相比具有较低制造成本的优点，以及由于金属覆层层压板在高频区域中的非常稳定的操作最小化电气和机械性能的变化。因此，本方法在制造可用于高频区域的印刷电路板方面是有效的。

6. 发明公开

EP4057301A1 CIRCUIT PROTECTION DEVICE 审中-公开
公开(公告)号：EP4057301A1
公开(公告)日：2022-09-14
申请号：EP22158307.3
申请日：2022-02-23
申请人： Smart Electronics, Inc.
发明人： KANG, Doo Won , MUN, Hwang Je , SHIN, A Lam
IPC分类号： H01C7/12
摘要： The present invention relates to a circuit protection device including: a device comprising a heating element configured to comprise a body and a pair of electrodes formed on the body, and a pair of lead wires connected, respectively, to the pair of electrodes; and a case having an independent accommodating space formed therein to accommodate at least the heating element, wherein the case includes at least one heat insulating layer disposed in the vicinity of the accommodating space.

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