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1. 发明公开

EP1339270A2 Method of manufacturing metal clad laminate for printed circuit board 审中-公开
标题翻译： Verfahren zur Herstellung eines metallkaschierten Laminatsfüreine Leiterplatte
公开(公告)号：EP1339270A2
公开(公告)日：2003-08-27
申请号：EP03251090.1
申请日：2003-02-24
申请人： SMART Electronics, Inc.
发明人： Yoo, Byuong Kuk , Baik, Eun Song , Song, Jong Seok , Cho, Rae Ook
IPC分类号： H05K3/38 , B32B15/08
CPC分类号： H05K3/381 , B32B15/08 , B32B37/04 , B32B37/08 , B32B38/0012 , B32B2037/0092 , B32B2038/0016 , B32B2311/00 , B32B2327/12 , B32B2457/08 , H05K1/034 , H05K3/382
摘要： The present invention relates to a method of manufacturing a metal clad laminate for printed circuit board, characterized by direct adhesion of a conductive metal foil without use of a thermosetting resin having low melting points, an adherent film or an adhesive. The method includes forming fine protrusions on at least one surface of a fluorine-based resin insulation layer, roughening one surface of a conductive metal foil, laminating the fluorine-based resin insulation layer having fine protrusions on the roughened metal foil so that the roughened surface of the metal foil and the protrusion-formed surface of the insulation layer face each other to form a laminated body, and compressing the laminated body under vacuum, pressure and heat. The method of manufacturing the metal clad laminate by directly adhering the conductive metal foil with a single dielectric structure has advantages in terms of lower manufacturing costs compared to conventional dual dielectric structures, and very stable operation of the metal clad laminate in high frequency regions due to minimized variations of electrical and mechanical properties. Thus, the present method is effective in manufacturing the printed circuit board usable in the high frequency regions.
摘要翻译：本发明涉及一种制造印刷电路板用金属包覆层压板的方法，其特征在于，不使用具有低熔点的热固性树脂，粘附膜或粘合剂直接粘附导电金属箔（1）。该方法包括在氟基树脂绝缘层（2）的至少一个表面上形成微细突起，使导电金属箔（1）的一个表面粗糙化，将具有微细突起的氟基树脂绝缘层（2）层压在使金属箔（1）的粗糙面和绝缘层（2）的突起形成面相对地形成层叠体，在真空下压制层压体和热。通过用单个电介质结构直接粘接导电金属箔来制造金属覆层叠层的方法与传统的双电介质结构相比具有较低制造成本的优点，以及由于金属覆层层压板在高频区域中的非常稳定的操作最小化电气和机械性能的变化。因此，本方法在制造可用于高频区域的印刷电路板方面是有效的。

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