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1. 发明公开

EP3893606A1 DEVICE SEALING METHOD 审中-公开
公开(公告)号：EP3893606A1
公开(公告)日：2021-10-13
申请号：EP19893991.0
申请日：2019-12-02
申请人： Lan Technical Service Co., Ltd.
发明人： MATSUMOTO, Yoshiie
IPC分类号： H05B33/02 , H05B33/04 , H05B33/06 , H05B33/10 , H01L51/50
摘要： This electronic device sealing method includes: preparing a device substrate that has a cavity for forming a device, an edgeformed higher than the cavity so as to surround the cavity, and an electrode extraction groove at (a portion of) the edge; preparinga cover substrate; forming an electronic device in the cavity of the device substrate; forming in the groove a lead-out wiring led outfrom the electronic device; forming an inorganic material thin film on surfaces of the device substrate and of a cover glass, at leasta surface of the edge of the device substrate and at a portion, of the surface of the cover substrate, to which the edge of the devicesubstrate is joined,; and joining the device substrate and the cover substrate with the inorganic material thin film therebetween.

2. 发明授权

EP0285446B1 Apparatus for surface treatment of synthetic organic polymer mouldings 失效
标题翻译：表面处理合成有机聚合物模具的设备
公开(公告)号：EP0285446B1
公开(公告)日：1992-09-30
申请号：EP88302960.5
申请日：1988-03-31
申请人： AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY , LAN TECHNICAL SERVICE CO., LTD. , SUMITOMO CHEMICAL COMPANY, LIMITED
发明人： Katoh, Koichiroh Industrial Products Research Ins. , Matsumoto, Yoshiie Lan Technical Service Co., Ltd. , Shinonaga, Hideo
IPC分类号： B29C59/16
CPC分类号： B29C59/16 , B29C2035/0827 , B29K2023/12 , B29K2995/0041

3. 发明公开

EP3736134A1 METHOD FOR BONDING SUBSTRATE, TRANSPARENT SUBSTRATE LAMINATE, AND DEVICE PROVIDED WITH SUBSTRATE LAMINATE 审中-实审转让
公开(公告)号：EP3736134A1
公开(公告)日：2020-11-11
申请号：EP18897427.3
申请日：2018-12-21
申请人： Lan Technical Service Co., Ltd. , Suga, Tadatomo
发明人： MATSUMOTO,Yoshiie , SUGA, Tadatomo
IPC分类号： B32B37/26 , B29C65/02 , B32B9/00 , C03C27/10 , C23C14/08 , C23C14/46 , C23C16/455 , H01L51/50 , H05B33/04 , H05B33/10
摘要： [Summary]
Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.

5. 发明公开

EP2837490A4 METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDING POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE, POLYMER FILM LAMINATE, AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE 有权转让
标题翻译：法的聚合物膜和聚合物膜，METHOD FOR的聚合物膜ON无机材料，聚合物膜和层压板的层压板的衬底中聚合物薄膜无机材料与底物结合BINDING
公开(公告)号：EP2837490A4
公开(公告)日：2016-02-24
申请号：EP13776372
申请日：2013-04-09
申请人： SUGA TADATOMO , LAN TECHNICAL SERVICE CO LTD
发明人： SUGA TADATOMO , MATSUMOTO YOSHIIE
IPC分类号： B29C65/00 , B23K20/00 , B29L9/00
CPC分类号： B32B15/08 , B29C59/14 , B29C65/1432 , B29C65/1467 , B29C66/028 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72325 , B29C66/72326 , B29C66/73161 , B29C66/7373 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29C66/73941 , B29C66/74 , B29C66/7461 , B29C66/74611 , B29C66/7465 , B29C66/8221 , B29C66/83241 , B29C66/83413 , B32B15/09 , B32B17/064 , B32B27/08 , B32B27/281 , B32B27/36 , B32B37/0076 , B32B37/02 , B32B37/182 , B32B37/203 , B32B37/24 , B32B38/00 , B32B2037/0092 , B32B2037/243 , B32B2250/03 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2307/546 , B32B2309/68 , B32B2310/0881 , B32B2457/20 , B32B2457/206 , C08J5/12 , Y10T156/10 , Y10T428/31681 , B29K2067/003 , B29K2079/08 , B29K2067/00 , B29K2067/006
摘要： The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

6. 发明公开

EP1227360A2 Method and device for connecting display panel substrates 审中-公开
标题翻译： Verfahren und Vorrichtung zum Verbinden von Bildschirmsubstraten
公开(公告)号：EP1227360A2
公开(公告)日：2002-07-31
申请号：EP02250456.7
申请日：2002-01-23
申请人： Lan Technical Service Co., Ltd
发明人： Matsumoto, Yoshiie, Lan Technical Service Co., Ltd
IPC分类号： G02F1/1339
CPC分类号： G02F1/1339 , G02F2001/133354
摘要： A method for connecting display panel substrates comprises the following steps. Firstly, a first substrate (10) and a second substrate (12), whereon sealant material (14) is disposed so as to form a waste region (30) in the inner side region of the edges of the first and second substrates, are aligned in position and held. Thereupon, a spacer (20, 24, 26) having a thickness substantially equal to a prescribed cell gap (d) is inserted into the waste region between the first and second substrates. Next, the cell gap is determined by pressing the first and second substrates. The sealant material is then hardened, whereupon the spacer is withdrawn. In this connecting process for fabricating a display panel, the cell gap can be set readily and precisely to a high degree of accuracy.
摘要翻译：用于连接显示面板基板的方法包括以下步骤。首先，在第一基板和第二基板的边缘的内侧区域中设置密封材料（14）以形成废弃区域（30）的第一基板（10）和第二基板（12）是排列在一起并保持。因此，具有基本上等于规定单元间隙（d）的厚度的间隔物（20,24,26）被插入第一和第二基板之间的废物区域中。接下来，通过按压第一和第二基板来确定单元间隙。然后将密封剂材料硬化，然后取出间隔物。在用于制造显示面板的连接过程中，可以容易且精确地设置单元间隙以高精度地设置。

7. 发明公开

EP0461843A2 Methods of modifying metallic surfaces 失效
标题翻译： Verfahren zur Modifikation von metallischenOberflächen。
公开(公告)号：EP0461843A2
公开(公告)日：1991-12-18
申请号：EP91305230.4
申请日：1991-06-11
申请人： AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY , LAN TECHNICAL SERVICE CO., LTD. , SEN LIGHTS CORPORATION
发明人： Katoh, Koichiroh, c/o Ind. Products Research Inst. , Matsumoto, Yoshiie, c/o LAN TECH. SERVICE CO., LTD , Kikuchi, Kiyoshi, c/o SEN Lights Corporation
IPC分类号： C23G5/00 , B08B7/00 , C09J5/02 , B05D3/06 , C23C8/10
CPC分类号： B05D3/062 , B05D2202/00 , C09J5/02 , C09J2400/166 , C23G5/00 , H05K3/382 , H05K3/44
摘要： In a method of modifying a metallic surface having a poor adhesion to a material to be provided thereon before the material is provided on the surface of the metal, the surface of the metal is first irradiated with ultraviolet light having a 253.7 nm-wavelength, or with that having a 253.7 nm-wavelength and a 184.9 nm-wavelength.
摘要翻译：在将材料设置在金属表面之前，在对其上提供的材料进行改性的金属表面改性方法中，首先用253.7nm波长的紫外线照射金属表面，或具有253.7nm波长和184.9nm波长的波长。

8. 发明公开

EP3171390A4 THIN SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR TRANSPORTING SUBSTRATE 审中-实审转让
公开(公告)号：EP3171390A4
公开(公告)日：2018-03-14
申请号：EP15821437
申请日：2015-07-16
申请人： LAN TECHNICAL SERVICE CO LTD , SUGA TADATOMO
发明人： SUGA TADATOMO , MATSUMOTO YOSHIIE
IPC分类号： H01L21/18 , H01L21/683 , H01L51/50
CPC分类号： H01L51/003 , B32B7/06 , B32B17/064 , B32B2379/08 , B65G49/061 , C03C17/002 , C03C19/00 , C03C27/10 , C03C2218/31 , H01L21/185 , H01L21/6835 , H01L51/0096 , H01L51/50 , H01L51/524 , H01L51/56 , H01L2221/68318 , H01L2221/6835 , H01L2227/326
摘要： [Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate. [Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.

9. 发明公开

EP2672507A4 BONDING-SBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY 有权转让
标题翻译：装订基板的制造方法，结合底，底物结合的方法，结合底生产设备和基片装置
公开(公告)号：EP2672507A4
公开(公告)日：2015-03-18
申请号：EP12741936
申请日：2012-01-30
申请人： SUGA TADATOMO , BONDTECH CO LTD , TAIYO YUDEN KK , LAN TECHNICAL SERVICE CO LTD
发明人： YAMAUCHI AKIRA , KONDOU RYUICHI , MATSUMOTO YOSHIIE , SUGA TADATOMO
IPC分类号： H01L21/02 , B23K1/20 , B23K20/00 , B23K20/14 , B23K20/16 , B23K20/24 , B32B7/04 , B32B38/08 , H01J37/317 , H01L21/20 , H01L21/302 , H01L21/67 , H01L21/762 , H01L23/14 , H01L23/15 , H01L23/525
CPC分类号： B32B38/08 , B23K1/20 , B23K20/24 , B23K2201/36 , B32B7/04 , H01J37/317 , H01J2237/08 , H01J2237/202 , H01J2237/3165 , H01L21/02046 , H01L21/2007 , H01L21/302 , H01L21/67092 , H01L21/67115 , H01L21/76251 , H01L23/147 , H01L23/5252 , H01L2924/0002 , Y10T428/265 , Y10T428/31678 , H01L2924/00
摘要： [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

10. 发明公开

EP2672507A1 BONDING-SBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY 有权转让
标题翻译：接合基板制造方法，接合基板，基板接合方法，接合基板制造装置及基板组装
公开(公告)号：EP2672507A1
公开(公告)日：2013-12-11
申请号：EP12741936.4
申请日：2012-01-30
申请人： Suga, Tadatomo , Bondtech Co., Ltd. , Taiyo Yuden Co., Ltd. , Lan Technical Service Co., Ltd.
发明人： YAMAUCHI Akira , KONDOU Ryuichi , MATSUMOTO Yoshiie
IPC分类号： H01L21/02 , B23K20/00 , B23K20/14 , B23K20/16 , B23K20/24 , H01L23/15
CPC分类号： B32B38/08 , B23K1/20 , B23K20/24 , B23K2201/36 , B32B7/04 , H01J37/317 , H01J2237/08 , H01J2237/202 , H01J2237/3165 , H01L21/02046 , H01L21/2007 , H01L21/302 , H01L21/67092 , H01L21/67115 , H01L21/76251 , H01L23/147 , H01L23/5252 , H01L2924/0002 , Y10T428/265 , Y10T428/31678 , H01L2924/00
摘要： [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
摘要翻译： [问题]提供具有广泛应用的基板键合技术。 [解决方法]在接合面上形成硅薄膜，使用高能粒子/金属粒子对与基板的界面进行表面处理。

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