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1. 发明公开

EP1355759A2 BONDING TOOL WITH POLYMER COATING 有权
标题翻译：与聚合物涂层连接工具
公开(公告)号：EP1355759A2
公开(公告)日：2003-10-29
申请号：EP02703272.1
申请日：2002-01-29
申请人： KULICKE & SOFFA INVESTMENTS, INC
发明人： SONNENREICH, Benjamin , ROBINZON, Sigalit
IPC分类号： B23K20/10
CPC分类号： H01L24/78 , B23K20/004 , B23K2201/32 , H01L2224/78301 , H01L2224/78302 , H01L2224/78309 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01016 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01057 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2224/48 , H01L2224/45099
摘要： A bonding tool (300) for bonding a wire to a substrate. The bonding tool (300) has a body portion (302), a working tip coupled to one end of the body portion (302), an orifice extending along a longitudinal axis of the body (302) and the working tip, and a polymer coating (320) disposed over at least a portion of a surface of the orifice.

2. 发明公开

EP1187696A2 MONITORING SYSTEM FOR DICING SAWS 审中-公开
标题翻译：监测系统板切割锯
公开(公告)号：EP1187696A2
公开(公告)日：2002-03-20
申请号：EP00992257.6
申请日：2000-11-30
申请人： KULICKE & SOFFA INVESTMENTS, INC
发明人： WEISSHAUS, Ilan , LICHT, Oded, Yehoshua
IPC分类号： B23D59/00
CPC分类号： B28D5/0064
摘要： A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where the monitor measures at least one of a feedback control current and a feedback control voltage output from the dicing saw. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.

3. 发明公开

EP1393353A2 ULTRA FINE PITCH CAPILLARY 审中-公开
标题翻译：具有超精细接触距离连接工具
公开(公告)号：EP1393353A2
公开(公告)日：2004-03-03
申请号：EP02731946.6
申请日：2002-05-29
申请人： KULICKE & SOFFA INVESTMENTS, INC
发明人： PERLBERG, Gil , ATZMON, Ziv , SONNENREICH, Benjamin , BAHALUL, Arie
IPC分类号： H01L21/00
CPC分类号： H01L24/85 , B23K20/004 , B23K2201/32 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/78302 , H01L2224/85 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2224/48 , H01L2924/00
摘要： A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section, ii) a working face with a first annular chamfer formed at an outside portion of an end of the working tip and, iii) a second annular chamfer formed at an inside portion of the end of the working tip. The first and second annular chamfer adjacent one another and a substantially cylindrical axial passage coupled to an upper portion of the second annular chamfer. The bonding tool is formed from a material containing at least 80 % ZrO2 by weight.

4. 发明公开

EP1381489A1 CONTROLLED ATTENUATION CAPILLARY 有权
标题翻译：毛细管控减震
公开(公告)号：EP1381489A1
公开(公告)日：2004-01-21
申请号：EP02794704.3
申请日：2002-02-26
申请人： KULICKE & SOFFA INVESTMENTS, INC
发明人： MILLER, Amir , PERLBERG, Gil
IPC分类号： B23K20/00
CPC分类号： H01L24/85 , B23K20/005 , B23K20/106 , B23K2201/32 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73265 , H01L2224/78301 , H01L2224/78302 , H01L2224/78308 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/20752 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要： A controlled attenuation bonding tool for bonding a fine wire to a substrate. In one embodiment, the bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section. In another embodiment, the bonding tool comprises a planar area along at least a portion of a length of a cylindrical portion.

5. 发明公开

EP1115565A1 COMPOSITE WIRE WITH NOBLE METAL CLADDING 审中-公开
标题翻译： VERBUNDDRAHT MIT EINER EDELMETALLBESCHICHTUNG
公开(公告)号：EP1115565A1
公开(公告)日：2001-07-18
申请号：EP99948286.2
申请日：1999-09-16
申请人： Kulicke & Soffa Investments, Inc.
发明人： SEUNTIENS, Jeffrey, M.
IPC分类号： B32B15/02 , B21F19/00
CPC分类号： H01L24/48 , B21C37/042 , H01B1/02 , H01L24/43 , H01L24/45 , H01L2224/4312 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48247 , H01L2224/48455 , H01L2224/4847 , H01L2924/00011 , H01L2924/01005 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01202 , H01L2924/01204 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/0102 , H01L2924/01004 , H01L2924/013 , H01L2924/00 , H01L2924/00014 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01006
摘要： Composite wires characterized by a noble metal annulus welded to a wire core comprising an electrically-conductive, non-noble metal. Methods of forming the composite wire and semiconductor packaging having at least one lead bonded to the composite wire are also disclosed.
摘要翻译：复合导线，其中贵金属环形空间被焊接到导电的非贵重金属线芯上。还公开了形成复合线的方法和具有与复合线接合的至少一个引线的半导体封装。

7. 发明公开

EP1255280A2 Apparatus and method for dicing semiconductor wafers 审中-公开
标题翻译： Vorrichtung und Verfahren zum Zerteilen von Halbleiterscheiben
公开(公告)号：EP1255280A2
公开(公告)日：2002-11-06
申请号：EP02003300.7
申请日：2002-02-25
申请人： KULICKE & SOFFA INVESTMENTS, INC
发明人： Manor, Ran
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/0093 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/50 , B28D1/221 , B28D5/0011 , B28D5/022 , B28D5/029 , B28D5/04 , H01L21/67092 , H01S5/0201
摘要： A method and apparatus for singulating semiconductor wafers is described. The method comprises the steps of aiming a laser beam at a layer placed over the substrate; absorbing energy from the laser beam into the layer; forming scribe lines in the layer by scanning the laser beam across the layer; and cutting through the substrate along the scribe lines with a saw blade to singulate the wafer. The apparatus includes a laser placed over the coating layer of the substrate, and a saw blade mounted over a surface of the substrate. The coating layer has a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate has a second absorption coefficient less than the first absorption coefficient. Energy from the laser beam is absorbed into the coating layer to form scribe lines therein, and the saw blade cuts through the substrate along the scribe lines.
摘要翻译：描述了用于分离半导体晶片的方法和装置。该方法包括以下步骤：将激光束瞄准位于衬底上的层; 从激光束吸收能量到层中; 通过扫描穿过该层的激光束在该层中形成划线; 并用锯片沿划线切割基片，以切割晶片。该设备包括放置在基板的涂层上的激光器和安装在基板的表面上的锯片。涂层相对于激光的波长具有第一吸收系数，并且半导体衬底具有小于第一吸收系数的第二吸收系数。来自激光束的能量被吸收到涂层中以在其中形成划线，并且锯条沿着划线切穿基板。

8. 发明公开

EP1189722A1 EFFICIENT ENERGY TRANSFER CAPILLARY 有权
标题翻译：高效能量传输毛细管
公开(公告)号：EP1189722A1
公开(公告)日：2002-03-27
申请号：EP01928947.9
申请日：2001-04-27
申请人： KULICKE & SOFFA INVESTMENTS, INC
发明人： MILLER, Amir
IPC分类号： B23K20/00 , B23K20/10
CPC分类号： H01L24/85 , B23K20/005 , B23K20/106 , H01L24/45 , H01L24/78 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78302 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01067 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要： A bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section (302) having a first diameter; a second cylindrical section (312) coupled to an end of the first cylindrical section, the second cylindrical section having a second diameter less than the first diameter; and a tapered section (306) coupled to an end of the second cylindrical section.

9. 发明公开

EP1129480A1 SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION 审中-公开
标题翻译： ER ER ER ER ER ER ER ER ER ER ER ER ER ER ER ER ER ER ER ER ER
公开(公告)号：EP1129480A1
公开(公告)日：2001-09-05
申请号：EP99954731.8
申请日：1999-10-05
申请人： KULICKE & SOFFA INVESTMENTS, INC
发明人： MURDESHWAR, Nikhil , EILLIS, Timothy, W. , RHEAULT, Christian , ESHELMAN, Mark, A.
IPC分类号： H01L21/60 , H01L23/498
CPC分类号： H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
摘要： Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
摘要翻译：具有未绝缘部分的铜电路的电子封装用涂层保护，其涂层厚度适合于无焊剂焊接，并且当与另一金属表面接合以在表面之间获得金属对金属接触时足够脆弱。

10. 发明公开

EP1115892A1 WIRE-BONDING ALLOY COMPOSITES 审中-公开
标题翻译： DRAHTBUNDLEGIERUNGSZUSAMMENSETZUNG
公开(公告)号：EP1115892A1
公开(公告)日：2001-07-18
申请号：EP99969125.6
申请日：1999-09-14
申请人： Kulicke & Soffa Investments, Inc.
发明人： ELLIS, Timothy, W.
IPC分类号： C22C5/02 , H01H1/02 , C22C9/00 , C22C21/00
CPC分类号： H01L24/43 , C22C5/02 , C22C9/00 , H01L24/45 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01037 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01052 , H01L2924/01055 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/30107 , Y10T428/1216 , Y10T428/12222 , H01L2924/00015 , H01L2224/48 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/01201 , H01L2924/01204 , H01L2924/013 , H01L2924/00013
摘要： A metal alloy composite comprising a phase of a highly-conductive base metal in the from of a matrix and a phase of another metal positioned within the matrix, the base metal being present in a major amount and the other metal being present in a minor amount, the metal alloy composite being capable of being formed into a very thin wire for use in a semiconductor application which includes a terminal assembly comprising an electrically conductive terminal in conductive contact with a conductive member and another electrically conductive terminal in conductive contact with a semiconductor, said terminals being joined by said alloy composite wire, examples of the base metal being gold, copper, and aluminum.
摘要翻译：一种金属合金复合体，其包含基体中的高导电性基体金属相和位于基体内的另一种金属的相，所述贱金属以大量存在，另一种金属以少量存在该金属合金复合体能够形成为用于半导体应用的非常细的导线，其包括端子组件，该端子组件包括与导电部件导电接触的导电端子和与半导体导电接触的另一个导电端子，所述端子由所述合金复合线连接，所述基体金属的实例为金，铜和铝。

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