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1. 发明公开

EP0688154A3 Method of and apparatus for centering integrated circuit lead frame 失效
标题翻译： Verfahren undGerätzum Zentrieren von Leiterrahmen integrierter Schaltungen
公开(公告)号：EP0688154A3
公开(公告)日：1996-07-17
申请号：EP95109040.6
申请日：1995-06-12
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mithoshi
IPC分类号： H05H13/02
CPC分类号： B23P19/10 , B23P19/12 , H01L21/68 , H01L2924/0002 , H05K13/022 , Y10T29/4913 , Y10T29/53004 , Y10T29/53178 , H01L2924/00
摘要： An IC lead frame centering method and apparatus whereby centering plates are automatically positioned to center various types of IC. With a screw driver (2) held with a hand, projections (48) of a rotating shaft (45) are inserted into driving bores (29) of a socket wrench (25), and pushed therein toward the socket wrench (25). The pressure causes the socket wrench (25) to slide on a screw rod (7) while compressing a coil spring (30). At the same time, the pressure causes the rotating shaft (45) to compress a coil spring (51), and also causes a cylindrical portion (47) of the rotating shaft (45) to move. The movement of the cylindrical portion (47) is detected by a start switch (52). Consequently, a servomotor (41) is started to drive the screw rod (7) to rotate, causing centering plates (16 and 17) to move away from each other until the centering plate 17 is detected by a mechanical origin sensor (24). The coordinate position of the centering plate (17) is recognized as a mechanical origin, and the centering plates (16 and 17) are moved from this position to a position at which the space therebetween conforms to the width of the IC, which has previously been stored in a centering position memory.
摘要翻译：一种IC引线框定心方法和装置，其中定心板自动定位成使各种类型的IC居中。在用手握住螺丝刀（2）的情况下，将旋转轴（45）的突起（48）插入到套筒扳手（25）的驱动孔（29）中，并将其推向套筒扳手（25）。压力使得套筒扳手（25）在螺旋弹簧（30）压缩的同时在螺杆（7）上滑动。同时，压力使旋转轴（45）压缩螺旋弹簧（51），并且还使得旋转轴（45）的圆筒部分（47）移动。圆筒部（47）的移动由起动开关（52）检测。因此，启动伺服电机（41）以驱动螺杆（7）旋转，使定心板（16和17）彼此远离移动，直到定心板17被机械原点传感器（24）检测到。定心板（17）的坐标位置被认为是机械原点，并且定心板（16和17）从该位置移动到它们之间的空间符合先前已经具有的IC宽度的位置被存储在定心位置存储器中。

2. 发明授权

EP0536804B1 Method of operating a press 无效
标题翻译：操作压的方法
公开(公告)号：EP0536804B1
公开(公告)日：1996-08-21
申请号：EP92118455.2
申请日：1987-12-25
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mitoshi
IPC分类号： B30B15/14 , B30B15/00 , B30B1/26 , B30B15/20 , B21D28/20
CPC分类号： B30B1/10 , B30B15/0076 , B30B15/14

3. 发明公开

EP0688154A2 Method of and apparatus for centering integrated circuit lead frame 失效
标题翻译：用于集成电路的引线框架的定心方法和装置
公开(公告)号：EP0688154A2
公开(公告)日：1995-12-20
申请号：EP95109040.6
申请日：1995-06-12
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mithoshi
IPC分类号： H05H13/02
CPC分类号： B23P19/10 , B23P19/12 , H01L21/68 , H01L2924/0002 , H05K13/022 , Y10T29/4913 , Y10T29/53004 , Y10T29/53178 , H01L2924/00
摘要： An IC lead frame centering method and apparatus whereby centering plates are automatically positioned to center various types of IC. With a screw driver (2) held with a hand, projections (48) of a rotating shaft (45) are inserted into driving bores (29) of a socket wrench (25), and pushed therein toward the socket wrench (25). The pressure causes the socket wrench (25) to slide on a screw rod (7) while compressing a coil spring (30). At the same time, the pressure causes the rotating shaft (45) to compress a coil spring (51), and also causes a cylindrical portion (47) of the rotating shaft (45) to move. The movement of the cylindrical portion (47) is detected by a start switch (52). Consequently, a servomotor (41) is started to drive the screw rod (7) to rotate, causing centering plates (16 and 17) to move away from each other until the centering plate 17 is detected by a mechanical origin sensor (24). The coordinate position of the centering plate (17) is recognized as a mechanical origin, and the centering plates (16 and 17) are moved from this position to a position at which the space therebetween conforms to the width of the IC, which has previously been stored in a centering position memory.

4. 发明公开

EP0536804A3 Method of operating a press 无效
标题翻译：操作压力的方法
公开(公告)号：EP0536804A3
公开(公告)日：1993-08-11
申请号：EP92118455.2
申请日：1987-12-25
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mitoshi
IPC分类号： B30B15/14 , B30B15/00 , B30B1/26 , B30B15/20 , B21D28/20
CPC分类号： B30B1/10 , B30B15/0076 , B30B15/14
摘要： A method of operating a press machine having a servomotor (20) and a servo controller therefor are disclosed. The speed at which a tool secured to a ram (36) of a mechanical press machine (1) applies an impact to a workpiece for plastic working is decelerated immediately before the tool strikes against the workpiece in order to reduce the noise generated when the impact is applied. The speed and positional locus of the ram (36) are set for each step using respective setting switches provided on a panel. The servomotor (20) is program-controlled according to the data input through the respective setting switches.

5. 发明公开

EP1193738A3 Method and apparatus for manufacturing chips 有权
标题翻译：用于芯片制造方法和设备
公开(公告)号：EP1193738A3
公开(公告)日：2005-08-24
申请号：EP01122368.2
申请日：2001-09-19
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mitoshi
IPC分类号： H01L21/00 , H05K13/00
CPC分类号： H01L21/67092 , B24D5/12 , B28D1/121 , B28D5/023 , H05K3/0052 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49135 , Y10T29/5193 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191 , Y10T29/53196
摘要： The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted.
The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed [into the second cutting device 33] by the second conveying device 43 along the direction of length. [The cut wiring boards 3a] are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

6. 发明授权

EP0688154B1 Method of and apparatus for centering integrated circuit lead frame 失效
标题翻译：用于集成电路的引线框架的定心方法和装置
公开(公告)号：EP0688154B1
公开(公告)日：1999-08-18
申请号：EP95109040.6
申请日：1995-06-12
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mithoshi
IPC分类号： H05K13/02
CPC分类号： B23P19/10 , B23P19/12 , H01L21/68 , H01L2924/0002 , H05K13/022 , Y10T29/4913 , Y10T29/53004 , Y10T29/53178 , H01L2924/00

7. 发明授权

EP0569603B1 METHOD OF AUTOMATICALLY CONTROLLING PRESSING FORCE OF PRESS MACHINE AND DEVICE THEREFOR 失效
标题翻译：方法自动检查机和设备的推压力THEREFOR
公开(公告)号：EP0569603B1
公开(公告)日：1997-08-20
申请号：EP92924034.9
申请日：1992-11-30
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mitoshi
IPC分类号： B30B15/14
CPC分类号： B30B15/14 , B30B15/0041 , B30B15/0094
摘要： Control is performed so that a constant pressing force can be applied at all times when a die tool presses a work. The magnitude of a pressing force when a die tool presses a work during pressing is detected by a semiconductor strain gage (84), and the thus detected pressing force is compared with a preset pressing force by a control device. If this comparison finds a difference between the both pressing forces, then a screw bar (35) is turned by an AC servomotor (24) to adjust the length of a bottom ram (60), thus controlling a pressing force.

8. 发明授权

EP0847233B1 IC leadframe processing system 失效
标题翻译： IC引线框加工系统
公开(公告)号：EP0847233B1
公开(公告)日：2005-01-26
申请号：EP97120308.8
申请日：1997-11-19
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mitoshi
IPC分类号： H05K13/00 , H05K13/02
CPC分类号： H01L21/67236 , H01L21/67092 , H05K13/021 , H05K13/023 , Y10T29/49121 , Y10T29/515 , Y10T29/53178 , Y10T29/53261

9. 发明授权

EP0845932B1 Lead bending machine for electronic components 失效
标题翻译：引线弯曲机，用于电子元件
公开(公告)号：EP0845932B1
公开(公告)日：2003-01-02
申请号：EP97116839.8
申请日：1997-09-27
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mitoshi
IPC分类号： H05K13/00
CPC分类号： H05K13/0092 , H01L2924/0002 , H01L2924/00

10. 发明授权

EP0570589B1 Apparatus for stocking and positioning ICs 失效
标题翻译：存储和定位装置用于集成电路
公开(公告)号：EP0570589B1
公开(公告)日：1997-08-20
申请号：EP92924035.6
申请日：1992-11-30
申请人： Ishii Tool & Engineering Corporation
发明人： Ishii, Mitoshi
IPC分类号： B65G1/07 , B65G59/02 , H05K13/02 , H01L21/50
CPC分类号： H05K13/0061 , H01L21/67721 , H01L21/67736 , H01L21/67769 , Y10S414/105 , Y10S414/114
摘要： In ICs equipped with a lead frame, jigs for transferring, stocking and positioning in accordance with kinds are eliminated. ICs stacked and loaded into a cassette (4) are inserted into the center of a cassette space (35) and held. A moving table (9) is driven and moved by a servo motor (21). A push-up member (67) of an IC push-up mechanism (60) is pushed up by a distance corresponding to the thickness of one IC inside the cassette (4). A width registration device (70) centers the IC in both transverse and longitudinal directions, and positions them.

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