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2. 发明公开

EP3170043A1 3D PHOTONIC INTEGRATION WITH LIGHT COUPLING ELEMENTS 审中-公开
标题翻译： PHOTONISCHE 3D整合麻省理工学院
公开(公告)号：EP3170043A1
公开(公告)日：2017-05-24
申请号：EP15822242.2
申请日：2015-07-14
申请人： Biond Photonics Inc.
发明人： KLAMKIN, Jonathan , RISTIC, Sasa
IPC分类号： G02B6/13
CPC分类号： H01S5/0224 , G02B6/12002 , G02B6/12004 , G02B6/124 , G02B6/13 , G02B6/14 , G02B6/34 , G02B6/4214 , G02B2006/12061 , G02B2006/12078 , G02B2006/12104 , G02B2006/12121 , G02B2006/12147 , H01S3/107 , H01S5/0085 , H01S5/021 , H01S5/02292 , H01S5/026 , H01S5/0287 , H01S5/1032 , H01S5/1085 , H01S5/141 , H01S5/142 , H01S5/4062
摘要： Methods for realizing integrated lasers and photonic integrated circuits on complimentary metal-oxide semiconductor (CMOS)-compatible silicon (Si) photonic chips, potentially containing integrated electronics, are disclosed. The integration techniques rely on light coupling with integrated light coupling elements such as turning mirrors, lenses, and surface grating couplers. Light is coupled from between two or more substrates using the light coupling elements. The technique can realize integrated lasers on Si where a gain flip chip (the second substrate) is bonded to a Si chip (the first substrate) and light is coupled between a waveguide in the gain flip chip to a Si waveguide by way of a turning mirror or grating coupler in the flip chip and a grating coupler in the Si chip. Integrated lenses and other elements such as spot-size converters can also be incorporated to alter the mode from the gain flip chip to enhance the coupling efficiency to the Si chip. The light coupling integration technique also allows for the integration of other components such as modulators, amplifiers, and photodetectors. These components can be waveguide-based or non-waveguide based, that is to say, surface emitting or illuminating.
摘要翻译：公开了在可能包含集成电子器件的互补金属氧化物半导体（CMOS）兼容硅（Si）光子芯片上实现集成激光器和光子集成电路的方法。集成技术依赖于与诸如转向镜，透镜和表面光栅耦合器的集成光耦合元件的光耦合。光使用光耦合元件从两个或更多个基板之间耦合。该技术可以实现Si上的集成激光器，其中增益倒装芯片（第二基板）被结合到Si芯片（第一基板），并且光通过转动将光耦合在增益倒装芯片中的波导到Si波导倒装芯片中的镜面或光栅耦合器以及Si芯片中的光栅耦合器。还可以集成透镜和诸如点尺寸转换器的其它元件来改变来自增益倒装芯片的模式，以增强与Si芯片的耦合效率。光耦合集成技术还允许其它组件如调制器，放大器和光电探测器的集成。这些组件可以是基于波导或非波导的，也就是表面发射或照明。

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