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1. 发明公开

EP2092810A1 ANLAGE ZUR HERSTELLUNG EINER LEITERPLATTE MIT ADDITIVEN UND INTEGRIETEN UND MITTELS ULTRASCHALL KONTAKTIERTEN KUPFERELEMENTEN 有权转让
标题翻译：安装对于生产电路板，添加剂和integrieten和利用超声波接触铜元素
公开(公告)号：EP2092810A1
公开(公告)日：2009-08-26
申请号：EP07846548.1
申请日：2007-11-13
申请人： Häusermann GmbH
发明人： OBERENDER, Lothar , JANESCH, Rudolf , STRUMMER, Erich , HACKL, Johann
IPC分类号： H05K3/10 , H05K13/06 , B23K20/00
CPC分类号： H01L24/85 , B23K20/004 , B23K2201/42 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45147 , H01L2224/48472 , H01L2224/78313 , H01L2224/7855 , H01L2224/786 , H01L2224/851 , H01L2224/85205 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01058 , H01L2924/01068 , H01L2924/01078 , H01L2924/01087 , H01L2924/01327 , H01L2924/19042 , H01L2924/19043 , H05K3/103 , H05K3/222 , H05K3/328 , H05K2201/0355 , H05K2201/1028 , H05K2201/10287 , H05K2203/0285 , H01L2924/00 , H01L2924/2076 , H01L2924/00014
摘要： The invention relates to an installation for producing a circuit board comprising at least one additional electrically conductive structure that is in the form of a round or rectangular electrically conductive wiring element (4), in particular in the form of an elongate copper element or element containing copper, as an additional element, that is brought into contact by ultrasound at least on one part of the sheet on the copper film elements (2) and in another circuit board production method, is integrated into a circuit board by means of lamination. According to the invention, a horizontal and/or vertical sonotrode head with an ultrasound generator (12) is arranged on a table (15) and can be displaced in relation to said table by NC control and the wiring element (4) having a round or rectangular cross-section is guided from a roll (7) by a feed system with a notching device (12) and a separation device. The sonotrode head comprises a holding device which, during each operation, maintains the wiring element in a planar manner on the copper film surface and the sonotrode head can pivot in such a manner that the wiring elements can be stacked at an angle and the sonotrode tool can be changed manually or totally automatically and the sonotrode tool is flat and is made of titanium and/or other alloy metallic materials enabling the surface of a copper film to be partially cleaned and a passivation layer can be removed by oxidation.

2. 发明公开

EP3216326A1 LEITERPLATTE MIT MINDESTENS EINEM VIERPOLSTROM-MESSELEMENT 审中-公开
公开(公告)号：EP3216326A1
公开(公告)日：2017-09-13
申请号：EP15793704.6
申请日：2015-10-30
申请人： Häusermann GmbH
发明人： HACKL, Johann , HÖRTH, Stefan , REDL, Norbert
IPC分类号： H05K1/02 , H05K1/16 , H05K3/10
CPC分类号： H05K1/0265 , H05K1/0268 , H05K1/167 , H05K3/103
摘要： Disclosed is a circuit board (1) comprising at least one (quadrupole) current measuring element (20) consisting of at least one high-current conductor that is connected to two spaced-apart current terminals (6, 7) between which two spaced-apart measuring terminals (3, 4) are arranged; the (quadrupole) current measuring element (20) is designed as a shunt and is integrated into the structure of the circuit board (1).
摘要翻译：公开了包括至少一个（四极）电流测量元件（20）的电路板（1），所述电流测量元件由至少一个高电流导体组成，所述高电流导体连接到两个间隔开的电流端子（6,7）分开布置的测量端子（3,4）（四极）电流测量元件（20）被设计为分流器并被集成到电路板（1）的结构中。

3. 发明公开

EP1985163A1 BIEGBARE LEITERPLATTE MIT ZUSÄTZLICHEM FUNKTIONALEM ELEMENT UND EINER KERBFRÄSUNG UND HERSTELLVERFAHREN UND ANWENDUNG 有权转让
标题翻译：有额外的功能元件及其制造方法和应用KERBFRÄSUNG柔性电路板
公开(公告)号：EP1985163A1
公开(公告)日：2008-10-29
申请号：EP07702782.9
申请日：2007-01-16
申请人： Häusermann GmbH
发明人： JANESCH, Rudolf , STRUMMER, Erich , HACKL, Johann
IPC分类号： H05K3/00 , H05K1/00
CPC分类号： H05K1/0281 , H05K1/0203 , H05K1/0263 , H05K1/0278 , H05K3/0017 , H05K3/0044 , H05K3/0058 , H05K3/328 , H05K3/4691 , H05K2201/0191 , H05K2201/09036 , H05K2201/1028 , H05K2201/2009 , H05K2203/302
摘要： The invention relates to a multifunctional printed circuit board for use as rigid/flexible or semi-flexible printed circuit board in the form of a through-hole printed circuit board or multilayer printed circuit board or flexible printed circuit board. At least one additional functional element is fastened in at least some sections on a copper foil by ultrasound or friction welding in a planar manner, thereby producing an intermetal compound. A notch is milled into said section allowing the printed circuit board to be bent like a rigid/flexible printed circuit board or semi-flexible printed circuit board. When two notches are milled, the printed circuit board can be bent twice by approximately 45° by a total of 90°. The invention also relates to a method for producing multifunctional printed circuit boards which comprise at least one additional functional element and a milled notch.

4. 发明授权

EP1985163B1 BIEGBARE LEITERPLATTE MIT ZUSÄTZLICHEM FUNKTIONALEM ELEMENT UND EINER KERBFRÄSUNG UND HERSTELLVERFAHREN UND ANWENDUNG 有权转让
标题翻译：有额外的功能元件及其制造方法和应用KERBFRÄSUNG柔性电路板
公开(公告)号：EP1985163B1
公开(公告)日：2016-04-27
申请号：EP07702782.9
申请日：2007-01-16
申请人： Häusermann GmbH
发明人： JANESCH, Rudolf , STRUMMER, Erich , HACKL, Johann
IPC分类号： H05K3/00 , H05K1/00
CPC分类号： H05K1/0281 , H05K1/0203 , H05K1/0263 , H05K1/0278 , H05K3/0017 , H05K3/0044 , H05K3/0058 , H05K3/328 , H05K3/4691 , H05K2201/0191 , H05K2201/09036 , H05K2201/1028 , H05K2201/2009 , H05K2203/302

5. 发明授权

EP2092810B1 ANLAGE ZUR HERSTELLUNG EINER LEITERPLATTE MIT ADDITIVEN UND INTEGRIETEN UND MITTELS ULTRASCHALL KONTAKTIERTEN KUPFERELEMENTEN 有权转让
标题翻译：安装对于生产电路板，添加剂和integrieten和利用超声波接触铜元素
公开(公告)号：EP2092810B1
公开(公告)日：2013-12-25
申请号：EP07846548.1
申请日：2007-11-13
申请人： Häusermann GmbH
发明人： OBERENDER, Lothar , JANESCH, Rudolf , STRUMMER, Erich , HACKL, Johann
IPC分类号： H05K3/10 , H05K3/22 , H05K3/32 , B23K20/00
CPC分类号： H01L24/85 , B23K20/004 , B23K2201/42 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45147 , H01L2224/48472 , H01L2224/78313 , H01L2224/7855 , H01L2224/786 , H01L2224/851 , H01L2224/85205 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01058 , H01L2924/01068 , H01L2924/01078 , H01L2924/01087 , H01L2924/01327 , H01L2924/19042 , H01L2924/19043 , H05K3/103 , H05K3/222 , H05K3/328 , H05K2201/0355 , H05K2201/1028 , H05K2201/10287 , H05K2203/0285 , H01L2924/00 , H01L2924/2076 , H01L2924/00014
摘要： The invention relates to an installation for producing a circuit board comprising at least one additional electrically conductive structure that is in the form of a round or rectangular electrically conductive wiring element (4), in particular in the form of an elongate copper element or element containing copper, as an additional element, that is brought into contact by ultrasound at least on one part of the sheet on the copper film elements (2) and in another circuit board production method, is integrated into a circuit board by means of lamination. According to the invention, a horizontal and/or vertical sonotrode head with an ultrasound generator (12) is arranged on a table (15) and can be displaced in relation to said table by NC control and the wiring element (4) having a round or rectangular cross-section is guided from a roll (7) by a feed system with a notching device (12) and a separation device. The sonotrode head comprises a holding device which, during each operation, maintains the wiring element in a planar manner on the copper film surface and the sonotrode head can pivot in such a manner that the wiring elements can be stacked at an angle and the sonotrode tool can be changed manually or totally automatically and the sonotrode tool is flat and is made of titanium and/or other alloy metallic materials enabling the surface of a copper film to be partially cleaned and a passivation layer can be removed by oxidation.

6. 发明公开

EP2092806A2 LEITERPLATTE MIT ADDITIVEN UND INTEGRIERTEN UND MITTELS ULTRASCHALL KONTAKTIERTEN KUPFERELEMENTEN UND HERSTELLVERFAHREN UND ANWENDUNG 有权转让
标题翻译：一种用于生产电路板，添加剂和集成和利用超声波接触铜元素
公开(公告)号：EP2092806A2
公开(公告)日：2009-08-26
申请号：EP07846547.3
申请日：2007-11-09
申请人： Häusermann GmbH
发明人： OBERENDER, Lothar , JANESCH, Rudolf , STRUMMER, Erich , HACKL, Johann
IPC分类号： H05K1/02 , H05K3/10 , B23K20/10 , H05K3/32
CPC分类号： H01L24/85 , B23K20/004 , B23K2201/42 , H01L24/45 , H01L24/78 , H01L2224/45015 , H01L2224/45147 , H01L2224/78313 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01058 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H05K1/0209 , H05K1/0263 , H05K3/103 , H05K3/222 , H05K3/328 , H05K3/4641 , H05K3/4652 , H05K2201/0355 , H05K2201/0382 , H05K2201/1028 , H05K2201/10287 , H05K2203/0285 , H01L2224/48 , H01L2924/00
摘要： The invention relates to a circuit board (1) comprising at least one additional electrically conductive structure that is in the form of a round or rectangular electrically conductive wiring element (3), in particular in the form of an elongate copper element or element containing copper, that is brought into contact with copper film elements by ultrasound on at least one part on the surface on the copper film elements (4) and is integrated into the circuit board by means of a lamination process. The at least one elongate wiring element has a cross-section that is deformed by means of a specifically formed sonotrode in a contact area that is flat in parts, such that the contact surfaces are at least 20%, in particular more than 30% and more particularly more than 50% greater in a non-deformed contact surface. The wiring element is further deformed in the cross-section in an approximately triangular like manner or in a trapezoidal manner thus increasing the contact surface. Also, the elongate wiring element in brought into contact at defined intervals in a flat manner on a conductive film element that is arranged therebelow.

7. 发明公开

EP2151148A2 VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE MIT EINER KAVITÄT FÜR DIE INTEGRATION VON BAUTEILEN UND LEITERPLATTE UND ANWENDUNG 有权转让
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE MIT EINERKAVITÄTFÜRDIE集成VON BAUTEILEN UND LEITERPLATTE UND ANWENDUNG
公开(公告)号：EP2151148A2
公开(公告)日：2010-02-10
申请号：EP08735271.2
申请日：2008-04-16
申请人： Häusermann GmbH
发明人： JANESCH, Rudolf , STRUMMER, Erich , HACKL, Johann
IPC分类号： H05K3/00 , H01L23/13 , B23K20/00 , G06K19/077 , H01L25/065
CPC分类号： B23K20/10 , B23K2201/42 , H01L2224/16225 , H05K1/183 , H05K3/0044 , H05K3/284 , H05K3/321 , H05K3/328 , H05K2201/09036 , H05K2201/09072 , H05K2201/10515 , H05K2201/10636 , H05K2201/10674 , H05K2201/10689 , H05K2203/0285 , Y02P70/611
摘要： The invention relates to a method for producing a circuit board (1) having at least one inner layer (4, 5, 6, 7) and at least one cavity (10) in at least one of the two surfaces for receiving at least one first electronic component (13), the cavity being covered toward the top at least partially by a second component (19) soldered in place, and the first component being connected in the cavity to at least two electrical contacts (14, 15) having corresponding electrical contacts (11, 12) of an inner layer (6) of the circuit board, said electrical contacts being produced by a non-thermal contacting method.
摘要翻译：本发明涉及一种用于制造电路板（1）的方法，所述电路板（1）在至少一个所述两个表面中具有至少一个内层（4,5,6,7）和至少一个空腔（10），用于接收至少一个第一电子部件（13），所述空腔至少部分地由焊接在适当位置的第二部件（19）覆盖，并且所述第一部件在所述空腔中连接到至少两个电触点（14,15），所述至少两个电触点具有对应的电路板的内层（6）的电触点（11,12），所述电触点通过非热接触方法产生。

8. 发明公开

EP1980143A1 LEITERPLATTE MIT ZUSÄTZLICHEN FUNKTIONALEN ELEMENTEN SOWIE HERSTELLVERFAHREN UND ANWENDUNG 有权转让
标题翻译：额外的功能元件及其制造方法和应用电路板
公开(公告)号：EP1980143A1
公开(公告)日：2008-10-15
申请号：EP07702783.7
申请日：2007-01-16
申请人： Häusermann GmbH
发明人： JANESCH, Rudolf , STRUMMER, Erich , HACKL, Johann
IPC分类号： H05K3/32 , H05K3/22 , H05K1/02
CPC分类号： H05K3/328 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K1/0203 , H05K1/0204 , H05K1/0263 , H05K3/222 , H05K3/4015 , H05K3/4611 , H05K3/4652 , H05K2201/0352 , H05K2201/1028 , H05K2201/10416 , H05K2203/0285 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a multifunctional printed circuit board comprising at least one additional functional element in the form of a round or rectangular conductor which is at least partially fastened on an electrically conducting strip conductor structure by ultrasound or friction welding in a mechanical and electrical and thermally conducting and planar manner and in such a fashion that an intermetal compound is formed. The invention also relates to a method for producing said printed circuit board, to its use as a wiring element for complex structures that is suitable for high current conduction and to uses for a specific thermal management.

9. 发明公开

EP3257335A1 VERFAHREN ZUR HERSTELLUNG EINER DURCHKONTAKTIERUNG BEI EINER MEHRLAGEN-LEITERPLATTE 审中-公开
标题翻译：用于在多层PCB上产生接触的方法
公开(公告)号：EP3257335A1
公开(公告)日：2017-12-20
申请号：EP16706131.6
申请日：2016-02-06
申请人： Häusermann GmbH
发明人： HACKL, Johann , REDL, Norbert , HÖRTH, Stefan
IPC分类号： H05K1/02 , H05K3/42 , H05K3/40
CPC分类号： H05K3/429 , H05K1/0204 , H05K1/0207 , H05K3/4046 , H05K2201/09581 , H05K2201/0969 , H05K2201/09809 , H05K2201/10416
摘要： Method for producing a plated-through hole between conductor tracks which are arranged at the top and at the bottom in a multilayer printed circuit board which is composed of a printed circuit board material and comprises at least one copper profile which is embedded in the composite of the multilayer printed circuit board, wherein the plated-through hole is produced by the following method steps: producing a first bore with a first bore diameter through the multilayer printed circuit board by drilling through the top and the bottom conductor track and the embedded copper profile; filling the first bore with an insulating filling material; producing a second bore coaxially in relation to the first bore with a second, smaller bore diameter than the bore diameter of the first bore; lining the bore wall of the second bore with an electrically conductive material and in this way making electrical contact with the top and bottom conductor tracks.

10. 发明公开

EP3240099A1 VERFAHREN ZUR HERSTELLUNG EINES ELEKTRONISCHEN GERÄTES IN DER FORM EINES SPRITZGUSSTEILS MIT EINGELEGTER LEITERPLATTE 审中-公开
标题翻译：制造具有插入导体板的注射器部件形式的电子器件的方法
公开(公告)号：EP3240099A1
公开(公告)日：2017-11-01
申请号：EP17000570.6
申请日：2017-04-05
申请人： Häusermann GmbH
发明人： Hörth, Stefan , Jarisch, Christoph , Janesch, Rudolf
IPC分类号： H01M10/48 , H01M10/42 , H05K5/06 , B29C45/14
CPC分类号： H01M10/48 , B29C45/14655 , B29K2105/0047 , B29K2995/0013 , H01M10/425
摘要： Es wird ein Verfahren zur Herstellung eines elektronischen Gerätes (1) in der Form eines Spritzgußteils mit eingelegter Leiterplatte (2) mit elektronischen Bauteilen (4, 5) genannt, wobei die Leiterplatte (2) in das Spritzgußwerkzeug eingelegt wird und zumindest von einer Seite formschlüssig mit einem thermoplastischen Spritzguß mit elektrischen Isoliereigenschaften und thermisch gut leitenden Eigenschaften angeformt wird und das thermoplastische Spritzgußmaterial ein mit BN und/oder AIN Teilchen gefülltes Polymer ist und eine ästhetische Anmutung zur Bildung des Gehäuses (3) aufweist und die Leiterplatte (2) im Bereich der Anformungsseite eine Oberflächenstruktur aufweist und derart das Spritzgußmaterial mittels Einlegespritzguß einen derart hohen Haftverbund erreicht, daß bei einer Erwärmung des elektronischen Gerätes (1) im Bereich des Überganges der Leiterplatte (2) zum Polymer die Formschlüssigkeit zumindest bis 120°C erhalten bleibt und derart eine gute Wärmeableitung gewährleistet ist. Weiters wird ein elektronisches Gerät (1) hergestellt nach dem Verfahren genannt und die Anwendung eines derart hergestellten Gerätes mit integrierter Wärmeableitung zur Kühlung elektrischer bzw. elektronischer Bauteile (4, 5) mit hoher Wärmentwicklung, wie beispielsweise LEDs (4) oder Leistungsbauteile.
摘要翻译：一种制造电子器件的方法，（1）在与插入的电路板（2）与电子元件的注射成型部件的形式（4，5）的简称，其特征在于，所述电路板（2）被插入到注塑模具中，并至少从一侧的形状配合与电绝缘性和良好的热传导性质和热塑性塑料注射成型材料填充有BN和/或AlN的粒状聚合物的热塑性塑料注射成型法形成，具有美学外观中的区域中的壳体（3）和印刷电路板（2）的形成 Anformungsseite具有表面结构，因此通过嵌件注塑成型的注塑成型的材料达到如此高的粘结强度，在所述电子装置的加热（1）在所述电路板的所述过渡区域（2）的形状配合保持在至少高达120℃的聚合物和这样的好 Wärmeab 线得到保证。此外，电子设备（1）是根据调用的过程，并以这种方式产生的装置的具有集成散热片具有高发热应用用于冷却电气或电子元件（5 4）中制备，诸如LED（4）或功率元件。

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