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81. 发明公开

EP1114575A1 METHOD AND APPARATUS FOR FEEDING COMPONENT, AND METHOD AND APPARATUS FOR MOUNTING COMPONENT 有权
标题翻译：方法和设备用于将组件和组件部件的方法和装置
公开(公告)号：EP1114575A1
公开(公告)日：2001-07-11
申请号：EP99943328.7
申请日：1999-09-14
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KURIBAYASHI, Takeshi , UCHIYAMA, Hiroshi , WACHI, AkihikoMezon-itoue 210
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/0452 , H05K13/0417 , H05K13/08 , Y10T29/49126 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/49764 , Y10T29/49826 , Y10T29/5303 , Y10T29/53035 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187
摘要： A component lack at a component arrangement position designated by a mounting program at a component feed part which feeds components to be mounted is detected, whether a spare component for the lacking component to be mounted is present in a spare component feed area (16s) of the component feed part is detected, and the supply of the component to be mounted from the designated component arrangement position in the component feed part is switched to the supply of the spare component from the spare component feed area.

82. 发明公开

EP1087653A3 Apparatus for supplying chip parts and method for same 失效
公开(公告)号：EP1087653A3
公开(公告)日：2001-07-04
申请号：EP00125149.5
申请日：1995-05-17
申请人： TAIYO YUDEN CO., LTD.
发明人： Saito, Koji, c/o Taiyo Yuden Co.,Ltd. , Fukai, Kikuji, c/o Taiyo Yuden Co.,Ltd. , Yasuda, Taro, c/o Taiyo Yuden Co.,Ltd.
IPC分类号： H05K13/04
CPC分类号： B65G47/145 , H05K13/022 , H05K13/028 , H05K13/0417
摘要： An apparatus for supplying chip parts comprises a chip part supplying apparatus whereby electronic parts in a chip form accumulated at random directions are being supplied in an orderly line and a chip part feeding means which works to transfer the forefront one of the aligned chip parts onto a circuit component such as a printed circuit board is being disclosed here. Chip parts housed at random directions in a hopper are taken into a discharge channel being organized to a prescribed direction and transferred through said discharge channel before being discharged through its bottom end onto a conveying belt before being carried by said belt toward a prescribed direction. A clearance is forcefully caused between the forefront chip part and the next chip part at the stage just before the forefront chip part is picked up, said clearance occurring between the two chip parts working to separate the two chip parts completely. Said forefront chip part thus separated is being picked up by a means such as a suction head before being transferred to a circuit component including a printed circuit board.

83. 发明公开

EP1093332A2 Micro device production manufacturing system 有权
标题翻译： HerstellungssystemfürMikrokomponenten
公开(公告)号：EP1093332A2
公开(公告)日：2001-04-18
申请号：EP00112985.7
申请日：2000-06-28
申请人： DATA I/O CORPORATION
发明人： Bolotin, Lev M.
IPC分类号： H05K13/02 , H05K13/08
CPC分类号： H05K13/08 , H05K13/0417 , Y02P90/04 , Y10T29/4913
摘要： A circuit board manufacturing system is provided which includes a circuit board assembly line (30) with a feeder/programming/buffer system (50). The feeder/programming/buffer system (50) has a flexible feeder mechanism (55) for receiving unprogrammed devices in a number of different manners, a programming mechanism (70) for performing a programming operation on the unprogrammed devices at a high rate of speed, and an output buffer mechanism (75) for providing the programmed devices to the circuit board assembly line (30).
摘要翻译：提供一种电路板制造系统，其包括具有馈线/编程/缓冲系统（50）的电路板组装线（30）。馈线/编程/缓冲系统（50）具有用于以多种不同方式接收未编程设备的灵活馈线机构（55），用于以高速率对未编程设备执行编程操作的编程机构（70）以及用于将编程的设备提供给电路板组装线（30）的输出缓冲机构（75）。

84. 发明公开

EP1026933A3 Parts feeder using strip carrier 有权
标题翻译： ZuführeinrichtungmitBandträger
公开(公告)号：EP1026933A3
公开(公告)日：2001-03-21
申请号：EP00300537.8
申请日：2000-01-25
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Sumida, Hiroto, Lion's Mansion 2-bankan 307 , Tanaka, Kunio , Nagaya, Toshihiko , Fujita, Tomonori
IPC分类号： H05K13/04
CPC分类号： H05K13/0417
摘要： A parts feeder is provided which is designed to pick up parts carried by a strip carrier. The strip carrier is moved intermittently to a pickup station and has storage chambers arrayed in a lengthwise direction thereof. The storage chambers has openings and stores therein the parts each of which has formed on ends thereof electrodes having at least a magnetic portion. A magnet which has a non-pole face oriented to the strip carrier is disposed at the pickup station for magnetically keeping each of the parts in a desired orientation within one of the storage chambers.
摘要翻译：提供了一种零件进给器，其被设计成拾取由带状载体承载的部件。带状载体间歇地移动到拾取站，并且具有沿其长度方向排列的储存室。存储室具有开口并且在其中存储各自在其端部上形成有至少具有磁性部分的电极的部分。具有取向于带状载体的非极面的磁体设置在拾取站处，用于将每个部件以期望的方向磁性地保持在一个存储室内。

85. 发明授权

EP0751702B1 Tape feeder 失效
标题翻译：对于皮带给料装置
公开(公告)号：EP0751702B1
公开(公告)日：1999-03-24
申请号：EP96110065.8
申请日：1996-06-21
申请人： SANYO ELECTRIC CO. LTD
发明人： Kanai, Takeshi
IPC分类号： H05K13/04
CPC分类号： H05K13/0417

86. 发明授权

EP0658080B1 Method of placing a component on a strip-shaped support and device for placing a component on a strip-shaped support 失效
标题翻译：施加到带状载体和装置的组件，其用于在支撑条带施加部件的方法
公开(公告)号：EP0658080B1
公开(公告)日：1999-03-17
申请号：EP94203523.9
申请日：1994-12-05
申请人： Koninklijke Philips Electronics N.V.
发明人： Vos, Jan
IPC分类号： H05K13/00 , H05K13/04
CPC分类号： H05K13/022 , H05K13/003 , H05K13/0417 , Y10T29/4913 , Y10T29/49131 , Y10T29/5136

87. 发明公开

EP0893948A2 Tape connecting method, member, and tool 失效
标题翻译： Verfahren zur Verbindung eines Bandes，Verbindungsteil und Werkzeug
公开(公告)号：EP0893948A2
公开(公告)日：1999-01-27
申请号：EP98305374.5
申请日：1998-07-06
申请人： FUJI MACHINE Mfg. Co., Ltd. , Meiwa Inc.
发明人： Asai,Koichi , c/o Fuji Machine Mfg. Co. Ltd. , Ooe, Kunio, c/o Fuji Machine Mfg. Co. Ltd. , Hyodo, Yoshifusa, c/o Meiwa Inc.
IPC分类号： H05K13/04 , H05K13/00
CPC分类号： H05K13/00 , H05K13/0417 , Y10T24/1664 , Y10T24/497 , Y10T29/49835 , Y10T29/49922 , Y10T29/49954 , Y10T29/53174 , Y10T29/53709 , Y10T29/539 , Y10T29/53943 , Y10T403/55 , Y10T403/551 , Y10T403/559 , Y10T403/7152 , Y10T428/197
摘要： A method of connecting respective one end portions (37, 38) of two carrier tapes (10), to each other, each of the two tapes having pockets at a first pitch and tape-feed holes (32) at a second pitch, each of the pockets accommodating an electric component, the method including the steps of aligning a tape connecting member (40) which includes a flat main portion (42) having tape-feed holes (44) at a third pitch equal to the second pitch, and caulking projections (50, 52) projecting perpendicularly from the main portion, with the respective one end portions of the two tapes, such that tape-feed holes of the connecting member are aligned with respective tape-feed holes of the two tapes, causing at least two caulking projections of the connecting member to penetrate through respective thickness of the two tapes, so that the main portion of the connecting member contacts respective one major surfaces (30) of the two tapes, and caulking respective portions (53, 55) of the two caulking projections that penetrate out of the respective other surfaces (29) of the two tapes, so that the respective one end portions of the two tapes are connected to each other.
摘要翻译：将两个载带（10）的相应的一个端部（37,38）彼此连接的方法，每个两个带以第一间距具有凹口，并以第二间距连接带馈送孔（32），每个所述方法包括以下步骤：使包括具有等于第二间距的第三间距的带馈送孔（44）的平坦主体部分（42）的带连接部件（40）对准，以及与主要部分垂直突出的铆接突起（50,52）与两个带的相应的一个端部部分相连接，使得连接部件的送带孔与两个带的相应的送带孔对齐，连接构件的至少两个铆接突起穿过两个带的相应厚度，使得连接构件的主要部分与两个带的一个主表面（30）相接触，并且将相应的部分（53,55）两个填缝工程两个带的相应的其它表面（29）之间穿透的两个磁条，使得两个磁带的相应的一个端部彼此连接。

88. 发明公开

EP0872920A2 Continuous electronic stamping with offset carrier 失效
标题翻译： Kontinueierliches Stanzen vonAnschlüssenmit Verschiebung desTrägers
公开(公告)号：EP0872920A2
公开(公告)日：1998-10-21
申请号：EP98106254.0
申请日：1998-04-06
申请人： Autosplice, Inc.
发明人： Bianca, Giuseppe , Bogursky, Robert M.
IPC分类号： H01R23/72
CPC分类号： H01R12/57 , H01H15/005 , H01H15/102 , H01R12/7094 , H01R13/03 , H01R31/08 , H01R43/16 , H05K3/222 , H05K3/3426 , H05K13/003 , H05K13/0417 , Y02P70/613
摘要： A continuous stamping of plated metal components, with carrier links (21) between their ends, for surface mount soldering. A strip of components is formed which can be individually easily separated at severance regions between the adjacent components. The severance regions are located in the carrier links between the components. Preferably, the carrier links are offset. Advantages include: less material required , lower cost for selective plating, adjustable pin length in the die, flat stamping, tip plating for better electrical contact, and scrapless end product.
摘要翻译：电镀金属部件的连续冲压，其端部之间具有载体连接件（21），用于表面安装焊接。形成一组部件，其可以在相邻部件之间的分离区域中单独容易地分离。分离区域位于组件之间的载体链路中。优选地，载波链路被偏移。优点包括：更少的材料需要，更低的选择性电镀成本，模具中的可调节销长度，平面冲压，尖端电镀以更好的电接触，以及无终端产品。

89. 发明公开

EP0859543A3 Verfahren zur Zuführung von Bauelementen zu einem Bestückungsautomaten sowie Zuführeinheit und Bestückungsautomat zur Durchführung des Verfahrens 失效
标题翻译：一种用于供给部件到自动贴片机和进给单元放机执行该方法的方法
公开(公告)号：EP0859543A3
公开(公告)日：1998-10-21
申请号：EP98102459.9
申请日：1998-02-12
申请人： Zevatech Trading AG
发明人： Gfeller, Martin , Christen, Otto , Grunder, Emil
IPC分类号： H05K13/04
CPC分类号： H05K13/0417 , B23P19/001
摘要： Bei einem Verfahren zur Zuführung von Bauelementen, die in einem mit einer periodischen Abfolge von einzelnen Taschen versehenen Band (23) untergebracht sind, mittels einer Zuführeinheit (1) zu einem Bestückungsautomaten, bei welchem Verfahren das auf einer Spule (21) aufgewickelte Band (23) in der Zuführeinheit (1) von der Spule (21) abgewickelt und die in den Taschen befindlichen Bauelemente nacheinander zu einer Entnahmestelle (13) transportiert werden, wo sie von dem Bestückungsautomaten aus der jeweiligen Tasche des Bandes entnommen werden können, wird eine einfache Bauteileversorgung ohne Bestückungsleistungsverlust dadurch erreicht, dass vor dem Ende eines von einer ersten Spule in der Zuführeinheit (1) abgewickelten ersten Bandes bei laufendem Bestückungsvorgang das Bandende des ersten Bandes und der Bandanfang eines auf einer zweiten Spule aufgewickelten zweiten Bandes mittels eines Spleisses miteinander verbunden werden, dass in der Zuführeinheit (1) die erste Spule gegen die zweite Spule ausgetauscht wird, und dass nach dem Auslaufen des ersten Bandes selbsttätig die in den Taschen des zweiten Bandes befindlichen Bauelemente von der Zuführeinheit (1) nacheinander zu der Entnahmestelle (13) transportiert werden.
摘要翻译：在印刷电路板组件的制造中使用的电子元件被提供固定到载带（22）具有口袋并形成的组件。口袋由顶部覆盖带（23）包围。将合并的胶带被供应线轴（21），并且由通过一单元（5）那样的引线通过与引导到磁带分离阶段（12）和成分去除单元（13）供给到装配机。滑阀定位在一个支架（33），并且容易与所述带的端部被接合到更换胶带除去。

90. 发明公开

EP0840996A1 VERPACKUNG FÜR EIN ELEKTRONISCHES BAUELEMENT 失效
标题翻译：包装用于电子元件
公开(公告)号：EP0840996A1
公开(公告)日：1998-05-13
申请号：EP96927519.0
申请日：1996-07-24
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： WILDE, Rüdiger
IPC分类号： B65D73 , B65D85 , H05K13
CPC分类号： H05K13/0417
摘要： A package for electronic components (10), in particular a strip-shaped package, has a closable depression (2) into which the electronic components may be placed so that their connections (11) lie free. One side wall (6) of the depression (3) is shaped to form a shock-absorbing spring element, for example by sinuously folding the side wall. The base (9) of the side wall (6) is lower than the bottom (5) of the depression (3). In the disclosed package, all side walls of the depressions are shaped to be shock-absorbing.

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