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    • 90. 发明公开
    • Testing and transporting semiconductor chips
    • Prüfungund Transportierung von halbleitenden芯片
    • EP1073325A2
    • 2001-01-31
    • EP00306049.8
    • 2000-07-17
    • LUCENT TECHNOLOGIES INC.
    • Akerson, Jeffrey JohnSeitzer, Philip WilliamVasudevan, Keelathur N.
    • H05K13/08H05K13/04
    • H01L24/86H01L21/67132H01L21/67271H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/0102H01L2924/01023H01L2924/01033H01L2924/12042H01L2924/14H05K13/0417H05K13/08H01L2924/00
    • An apertured, punched plastic carrier tape with a pressure sensitive adhesive backing is loaded with ICs. The tape is wound on supply and take-up reels of a cassette. The cassette is adapted to be driven by a tape handler located in the factory or at a customer location where testing of the ICs takes place. The tape handler includes the necessary active components (e.g., a tape indexing mechanism, a chip ejector, etc.) for driving the tape and removing chips from it. As such the cassette has at least two cavities adapted to receive the indexing mechanism that advances the carrier tape in a controlled fashion and a chip ejector mechanism that, in conjunction with a pick-and place tool, allows IC chips to be removed from the carrier tape. In addition, the cassette has at least one window that permits access to the topside of the chips in the tape for the purpose of performing various electrical tests (e.g., via an electrical probe) or vision tests (e.g. via a camera) and/or to permit bad chips to be removed from the tape. In one embodiment, a first cassette contains chips as yet unknown as being either good or bad, and if a chip tests as bad, it may be replaced with a good chip (e.g., via a pick-and-place tool). In another embodiment, a second cassette contains only known-good chips that serve as the source of good replacement chips accessed by the pick-and-place tool. In yet another embodiment, the cassette includes a plurality of windows: one for performing the aforementioned tests, one for removing/replacing chips, and optionally one for viewing an identification marker on the backside of each chip (e.g., via a pattern recognition system).
    • 带有压敏粘合剂背衬的多孔冲孔塑料载带装载IC。 磁带缠绕在磁带盒的电源和卷带盘上。 盒式磁带适用于位于工厂或客户位置的磁带处理器,其中进行IC的测试。 磁带处理器包括用于驱动磁带并从中移除芯片的必要的有源组件(例如,磁带分度机构,芯片喷射器等)。 因此,盒具有至少两个适于接收以受控方式前进载带的分度机构的空腔和与拾取和放置工具相结合的芯片推出机构,允许IC芯片从载体移除 胶带。 另外,盒具有至少一个窗口,其允许访问磁带中的芯片的上侧,以进行各种电测试(例如,经由电探针)或视觉测试(例如经由相机)和/或 以允许坏的芯片从磁带上移除。 在一个实施例中,第一盒包含未知的芯片,不论是好还是坏,如果芯片测试不好,则可以用良好的芯片(例如通过拾取和放置工具)代替。 在另一个实施例中,第二盒仅包含已知好的芯片,其用作由拾取和放置工具访问的良好替换芯片的源。 在另一个实施例中,盒包括多个窗口:一个用于执行上述测试,一个用于去除/替换芯片,以及可选地用于观看每个芯片背面的识别标记(例如,经由模式识别系统) 。