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    • 75. 发明公开
    • SUBSTRATE WITH BUILT-IN COMPONENT, AND MANUFACTURING METHOD FOR SAME
    • 亚特兰大EINER EINGEBAUTEN KOMPONENTE UND HERSTELLUNGSVERFAHRENDAFÜR
    • EP2958408A1
    • 2015-12-23
    • EP13874923.9
    • 2013-02-12
    • Meiko Electronics Co., Ltd.
    • SHIMADA, HiroshiTODA, MitsuakiMATSUMOTO, Tohru
    • H05K3/46
    • H05K3/20C23F1/00H05K1/0298H05K1/185H05K1/188H05K3/22H05K3/4611H05K2201/0195H05K2201/0355H05K2201/09009H05K2201/10636H05K2203/11Y02P70/611
    • A device embedded substrate (15) includes an insulating layer (12) including an insulating resin material, an electric or electronic device (4) embedded in the insulating layer (12), a metal film (9) coating at least one face of the device (4), and a roughened portion (10) formed by roughening at least part of the surface of the metal film (9). Preferably, the device embedded substrate (15) further includes: a conductive layer (6) pattern-formed at least on a bottom face (7), the bottom face (7) being one face of the insulating layer (12); and a bonding agent (3) made of a material different from the insulating layer (12) and joining the conductive layer (6) and a mounting face (8), the mounting face (8) being one face of the device (4). The metal film (9) is formed only on a face opposite to the mounting face (8), and the bonding agent (3) has a thickness smaller than a thickness from the metal film (9) to a top face (11), the top face (11) being the other face of the insulating layer (12).
    • 一种器件嵌入式衬底(15)包括绝缘层(12),其包括绝缘树脂材料,嵌入在绝缘层(12)中的电子或电子器件(4),金属膜(9) 以及通过使金属膜(9)的至少一部分表面粗糙化而形成的粗糙部(10)。 优选地,所述器件嵌入式衬底(15)还包括:至少在底面(7)上图案形成的导电层(6),所述底面(7)是所述绝缘层(12)的一个面; 以及由与所述绝缘层(12)不同的材料制成并且将所述导电层(6)和安装面(8)接合的接合剂(3),所述安装面(8)是所述装置(4)的一个面, 。 金属膜(9)仅形成在与安装面(8)相反的面上,粘接剂(3)的厚度比从金属膜(9)到顶面(11)的厚度小, 所述顶面(11)是所述绝缘层(12)的另一面。
    • 76. 发明公开
    • ELECTRONIC DEVICE AND ELECTROMAGNETIC NOISE CONTROL METHOD
    • ELEKTRONISCHE VORRICHTUNG UND ELEKTROMAGNETISCHESRAUSCHUNTERDRÜCKUNGSVERFAHREN
    • EP2911489A1
    • 2015-08-26
    • EP12886954.2
    • 2012-10-22
    • Mitsubishi Electric Corporation
    • KIMATA, HiroyukiISHIZAKA, SatoruANZAI, ToshioFUJIMARU, KeitaTODA, Yoko
    • H05K9/00
    • H05K7/1427H05K3/22H05K9/0062H05K9/0064Y10T29/49126
    • An electronic device (100) comprises a plurality of printed circuit boards (130) having signal GNDs (131), a metal bar (140) which electrically connects to the respective signal GNDs (131) of the plurality of printed circuit boards (130), and a card basket (110) which houses the plurality of printed circuit boards (130) and the metal bar (140) and serves as a frame GND. The electronic device (100) also comprises a dielectric (150) between the card basket (110 and the metal bar (140). The metal bar (140), the card basket (110), and the dielectric (150) constitute a noise control capacitor (159) having specific frequency characteristics. By the specific frequency characteristics, the noise control capacitor (159) releases electromagnetic noise occurring in the respective signal GNDs (131) to an outside and shields external noise generated outside.
    • 电子设备(100)包括具有信号GND(131)的多个印刷电路板(130),与多个印刷电路板(130)中的相应信号GND(131)电连接的金属棒(140) ,以及容纳多个印刷电路板(130)和金属棒(140)并用作框架GND的卡筐(110)。 电子设备(100)还包括在卡筐(110和金属棒)之间的电介质(150),金属棒(140),卡筐(110)和电介质(150)构成噪声 具有特定频率特性的控制电容器(159),通过特定的频率特性,噪声控制电容器(159)将各信号GND(131)中产生的电磁噪声释放到外部,并遮蔽外部产生的噪声。