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    • 77. 发明公开
    • Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit
    • 晶圆级透镜阵列,其制造晶圆级透镜阵列,透镜模块和摄像单元的过程
    • EP2298544A2
    • 2011-03-23
    • EP10176861.2
    • 2010-09-15
    • FUJIFILM Corporation
    • Yamada, DaisukeSakaki, Takeshi
    • B29D11/00
    • B29D11/00307G02B3/0012
    • Disclosed are a wafer-level lens array, a method of manufacturing a wafer-level lens array, a lens module, and an imaging unit capable of preventing the permeation of air into a substrate unit or a lens unit to be molded when a wafer-level lens array having the substrate unit and the lens units integrated with each other is molded. There is provided a method of integrally manufacturing a wafer-level lens array including a substrate unit and a plurality of lens units arranged on the substrate unit using a transfer mold (102) having a plurality of concave portions (102A) corresponding to at least the plurality of lens units (10) provided in a surface thereof. The method includes: supplying a resin to each concave portion, the amount of resin supplied being more than the volume of the concave portion; and performing molding to integrate the resin overflowing from the concave portions, thereby forming the substrate unit (1).
    • 公开了一种晶圆级透镜阵列,制造晶片级透镜阵列,透镜模块的方法,以及成像能够防止空气的渗入一个基板单元或透镜单元的单元要被模制时的晶片 具有基板部和海誓山盟集成透镜单元级透镜阵列被成型。 本发明提供的整体制造晶圆级透镜阵列,其包括基板单元和使用具有凹部的多个(102A)传递模制(102)布置在所述基板单元上的透镜单元的多个方法对应于至少所述 的在其表面上设置透镜单元(10),多个。 该方法包括:提供树脂,以各凹部,树脂供给比所述凹部的体积更量; 并进行成型的树脂从所述凹部溢出,从而形成基片单元(1)集成。