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61. 发明授权

EP2294632B1 OPTOELEKTRONISCHE VORRICHTUNG ZUR REDUZIERUNG VON ABSCHATTUNGSEFFEKTEN DER ELEKTRODEN DURCH KONZENTRATOREN 有权
公开(公告)号：EP2294632B1
公开(公告)日：2020-12-02
申请号：EP09772002.3
申请日：2009-06-25
申请人： OSRAM Opto Semiconductors GmbH
发明人： BRICK, Peter , MUSCHAWECK, Julius , FRANK, Joachim
IPC分类号： H01L33/58 , H01L31/054 , H01L33/38 , H01L31/0224

62. 发明公开

EP3731277A1 LIGHT EMITTING DEVICE 审中-公开
公开(公告)号：EP3731277A1
公开(公告)日：2020-10-28
申请号：EP19191010.8
申请日：2019-08-09
申请人： Seoul Viosys Co., Ltd
发明人： OH, Se Hee , KANG, Min Woo , KIM, Jong Kyu , KIM, Hyun A
IPC分类号： H01L27/15 , H01L33/38
摘要： A light emitting device is disclosed. The light emitting device includes: a first light emitting cell disposed in a first region on a substrate and including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a second light emitting cell disposed in a second region on the substrate to be spaced apart from the first light emitting cell and including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a first conductive pattern disposed in the first region and including contact portions electrically connected to the first conductivity type semiconductor layers; and a connection pattern including contact portions electrically connected to the second conductivity type semiconductor layer of the first light emitting cell and contact portions electrically connected to the first conductivity type semiconductor layer of the second light emitting cell, wherein, at an edge of the first region facing the second light emitting cell, one contact portion of the first conductive pattern is disposed between the contact portions of the connection pattern electrically connected to the second conductivity type semiconductor layer of the first light emitting cell, and one contact portion of the first conductive pattern is open outwards.

63. 发明授权

EP2388838B1 Light emitting diode chip having wavelength converting layer and method of fabricating the same, and package having the light emitting diode chip and method of fabricating the same 有权
公开(公告)号：EP2388838B1
公开(公告)日：2020-09-16
申请号：EP11159040.2
申请日：2011-03-21
申请人： Seoul Semiconductor Co., Ltd.
发明人： Jung, Jung Hwa , Kim, Bang Hyun
IPC分类号： H01L33/50 , H01L33/38

64. 发明授权

EP2650590B1 Light emitting package 有权转让
公开(公告)号：EP2650590B1
公开(公告)日：2020-08-05
申请号：EP13162721.8
申请日：2013-04-08
申请人： LG Innotek Co., Ltd.
发明人： Oh, Nam Seok , Cho, Young Jun , Choi, Kwang Kyu , Moon, Young Min , Moon, Sun Mi
IPC分类号： F21K99/00 , G02F1/1335 , F21V8/00 , G09G3/34 , H01L33/62 , F21S43/14 , H01L33/48 , H01L33/38 , F21S43/15 , F21S43/19 , F21S43/237 , F21S43/249 , F21S43/245

65. 发明公开

EP3680932A1 DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
公开(公告)号：EP3680932A1
公开(公告)日：2020-07-15
申请号：EP18849878.6
申请日：2018-09-04
申请人： Seoul Semiconductor Co., Ltd.
发明人： TAKEYA, Motonobu , SON, Sung Su , LEE, Jong Ik , HONG, Seung Sik
IPC分类号： H01L25/075 , H01L33/38 , H01L33/58 , H01L33/62 , H01L33/56 , H01L33/00 , H01L33/48 , G09F13/22
摘要： The present invention relates to a display device and a method for manufacturing the same. A display device according to an embodiment of the present invention may comprise: multiple light-emitting modules having multiple signal lines and multiple common lines arranged therein, and having multiple light-emitting diodes mounted on the respective upper sides thereof, the multiple light-emitting diodes being electrically connected to the multiple signal lines and the multiple common lines, respectively; a motherboard to which the multiple light-emitting modules are coupled; and an adhesion part which is electroconductive and couples each of the multiple light-emitting modules to the motherboard, wherein: multiple signal line terminals electrically connected to the multiple signal lines, and multiple common line terminals electrically connected the multiple common lines are formed on the lower sides of the multiple light-emitting modules, respectively; and multiple board signal line terminals are formed and positioned to correspond to the multiple signal line terminals formed on the multiple light-emitting modules, and multiple board common line terminals are formed and positioned to correspond to the multiple common line terminals, on the upper surface of the motherboard.

66. 发明授权

EP3048650B1 LIGHT EMITTING DEVICE 有权转让
公开(公告)号：EP3048650B1
公开(公告)日：2020-06-24
申请号：EP16152479.8
申请日：2016-01-22
申请人： LG Innotek Co., Ltd.
发明人： JUNG, Sung Dal , LEE, Jong Sub , SONG, Hyun Don
IPC分类号： H01L33/38 , H01L33/40

67. 发明公开

EP3657542A1 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：EP3657542A1
公开(公告)日：2020-05-27
申请号：EP19197688.5
申请日：2019-09-17
申请人： LG Display Co., Ltd.
发明人： KANG, HanSaem
IPC分类号： H01L25/075 , H01L25/16 , H01L33/38
摘要： A display device (100) and a method of manufacturing the same are provided. A display device (100) includes: a substrate (110), a pixel circuit (PC) on the substrate (110), the pixel circuit (PC) including: a gate electrode (GE), a drain electrode (DE), and a source electrode (SE), a vertical LED element (150) on the substrate (110), the vertical LED element (150) including: a first electrode (151), an active layer (152) under the first electrode (151), and a second electrode (153) under the active layer (152), an encapsulation film (155) surrounding the vertical LED element (150), the encapsulation film (155) exposing a portion of a side of the second electrode (153), a first connection electrode (PE) electrically connected to the first electrode (151), and a second connection electrode (CE) electrically connected to the second electrode (153).

69. 发明授权

EP3166152B1 SEMICONDUCTOR LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING ITS SUBSTRATE 有权
公开(公告)号：EP3166152B1
公开(公告)日：2020-04-15
申请号：EP16199881.0
申请日：2004-08-18
申请人： Nichia Corporation
发明人： TANAKA, Hisanori , HOSOKAWA, Yasunobu , SHIBUTANI, Yuuki
IPC分类号： H01L33/00 , H01L33/20 , H01L21/20 , H01L33/22 , H01L33/38

70. 发明授权

EP2782147B1 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT 有权
公开(公告)号：EP2782147B1
公开(公告)日：2020-03-11
申请号：EP13819520.1
申请日：2013-07-18
申请人： Semicon Light Co., Ltd.
发明人： JEON, Soo Kun , PARK, Eun Hyun , KIM, Yong Deok
IPC分类号： H01L33/46 , H01L33/38

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