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61. 发明公开

EP2234130A1 CASE MOLD TYPE CAPACITOR AND METHOD FOR MANUFACTURING THE SAME 有权转让
标题翻译： VERFAHREN ZU SEINER HERSTELLUNG的FORMGEHÄUSEKONDENSATOR
公开(公告)号：EP2234130A1
公开(公告)日：2010-09-29
申请号：EP08837527.4
申请日：2008-10-02
申请人： Panasonic Corporation
发明人： KYOUDA, Takuya , TOMITA, Makoto , SAITO, Toshiharu , OKUNO, Shigeo
IPC分类号： H01G4/38 , H01G4/224
CPC分类号： H01G9/10 , H01G2/106 , H01G4/224
摘要： The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.
摘要翻译：外壳型电容器具有电容器元件，一对端子和成型树脂。该对的每个端子分别连接到电容器元件的第一电极和第二电极。电容器元件以设置在每个端子的端部的端子部分部分地暴露于外部的方式嵌入到模制树脂中。成型树脂具有环氧树脂中含有无机填料和吸湿剂的环氧树脂。

62. 发明公开

EP2205316A1 FILTERED FEEDTHROUGH ASSEMBLIES FOR IMPLANTABLE DEVICES AND METHODS OF MANUFACTURE 有权
标题翻译： FILTERED实施安排用于植入的装置和方法
公开(公告)号：EP2205316A1
公开(公告)日：2010-07-14
申请号：EP08832054.4
申请日：2008-09-10
申请人： MEDTRONIC, INC.
发明人： IYER, Rajesh V. , MILTICH, Thomas P.
IPC分类号： A61N1/375 , B23K35/02 , H05K3/34 , H01L21/48 , H01G4/35 , H01G4/236 , H01G2/10 , H01G4/224 , B23K1/00
CPC分类号： A61N1/3754 , B23K1/0016 , B23K35/02 , B23K35/0233 , B23K35/0244 , B23K2201/36 , H01G4/224 , H01G4/236 , H01G4/35 , H05K3/3447 , H05K3/3478 , Y10T29/435
摘要： A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.

63. 发明公开

EP1317759A4 LAMINATE PACKAGE FOR AN ENERGY STORAGE DEVICE 审中-公开
标题翻译：层压封装的能量储存元
公开(公告)号：EP1317759A4
公开(公告)日：2007-07-18
申请号：EP01951209
申请日：2001-07-10
申请人： CAP XX LTD
发明人： PYNENBURG RORY ALBERT JAMES
IPC分类号： H01G9/155 , H01G9/08 , H01M2/02 , H01M2/08 , H01M2/30 , H01G9/10 , H01G4/224
CPC分类号： H01G9/08 , H01M2/0207 , H01M2/0275 , H01M2/0287 , Y02E60/13 , Y10T428/13 , Y10T428/1338
摘要： A laminate package (1) for an energy storage device in the form of a supercapacitor (2) that has two terminals (3, 4). Package (1) includes an inner barrier layer (5) of polyethylene (PE) for defining a cavity (6) to contain device (2). Layer (5) has two opposed edges (9) that are sealingly engaged with each other and from between which terminals (3, 4) extend from the cavity. A sealant layer (11) of NucrelTM resin is disposed intermediate layer and terminals (3). An outer barrier layer (12) is bonded to layer (5) and has a metal layer (13) which is aluminium.

64. 发明公开

EP1691590A2 Wiring board and capacitor to be built into wiring board 有权
标题翻译：接线板和电容器要嵌入到接线板中
公开(公告)号：EP1691590A2
公开(公告)日：2006-08-16
申请号：EP06002669.7
申请日：2006-02-09
申请人： NGK Spark Plug Co., Ltd.
发明人： Muramatsu, Masaki , Yuri, Shinji , Urashima, Kazuhiro , Yamamoto, Hiroshi , Seki, Toshitake , Sato, Motohiko
IPC分类号： H05K1/14 , H05K1/18 , H05K1/02 , H01G4/224
CPC分类号： H01G2/06 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/10 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An intermediate board (200) has a board core composed of a core main body (100m) and a sub-core portion (1). The core main body (100m) is formed into a plate shape by a macromolecular material, and is formed with a sub-core housing portion (100h) which is opened and formed on a first main surface by reducing its thickness. The sub-core portion (1) is formed into a plate shape by ceramic, and is housed in the sub-core housing portion (100h) so that its thicknesswise direction matches with that of the core main body (100m). A first terminal array (5) of the board core (100) is formed in a position where it overlaps the sub-core portion (1) in orthographic projection to a reference surface parallel with a plate surface of the board core (100) . The sub-core portion (1) incorporates a laminated ceramic capacitor where a first electrode conductor layer (54), a ceramic layer (52) and a second electrode conductor layer (57) are laminated periodically in this order. The first electrode conductor layer is conductive with a first side first type terminal (5a) and a second side first type terminal (7a). The ceramic layer is composed of a dielectric layer. The second electrode conductor layer is conductive with a first side second type terminal (5b) and a second side second type terminal (7b). In the sub-core housing portion (100h), an inner edge of the cross section along a plane parallel with a plate surface of the sub-core portion (1) has a quadrate shape, and a radius portion with dimension of not less than 0.1 mm to not more than 2 mm is formed on its corners.
摘要翻译：中间板（200）具有由芯主体（100m）和子芯部（1）构成的板芯。芯主体（100m）由高分子材料形成为板状，并且形成有通过减小其厚度而在第一主表面上开口并形成的子芯容纳部（100h）。子核心部分（1）通过陶瓷形成为板状，并且以其厚度方向与核心主体（100m）的厚度方向相匹配的方式容纳在子核心壳体部分（100h）中。所述板芯（100）的第一端子阵列（5）以与所述板芯（100）的板面平行的基准面正交投影的方式形成在与所述子芯部（1）重叠的位置。子核心部分（1）结合了层压陶瓷电容器，其中第一电极导体层（54），陶瓷层（52）和第二电极导体层（57）按此顺序周期性层压。第一电极导体层与第一侧第一类型端子（5a）和第二侧第一类型端子（7a）导电。陶瓷层由电介质层构成。第二电极导体层与第一侧面第二类型端子（5b）和第二侧面第二类型端子（7b）导电。在子核心容纳部（100h）中，沿着与子核心部（1）的板面平行的平面的截面的内边缘具有方形形状，并且具有不小于在其角上形成0.1毫米至不大于2毫米。

65. 发明公开

EP0878812A1 High-voltage through-type ceramic capacitor 失效
标题翻译：高压穿心式陶瓷电容器
公开(公告)号：EP0878812A1
公开(公告)日：1998-11-18
申请号：EP98108760.4
申请日：1989-06-03
申请人： TDK Corporation
发明人： Sasaki, Setsuo , Taguchi, Teruo , Fujiwara, Isao
IPC分类号： H01G4/35 , H01G4/224
CPC分类号： H01G4/35 , H01C1/02 , H01J23/15
摘要： A high-voltage through-type ceramic capacitor which is capable of exhibiting satisfactory heat resistance sufficient to ensure good operability of the capacitor even under severe conditions and being positively small-sized while ensuring its satisfactory operation.
In one embodiment the insulating case (54) is constituted by a thermoplastic inner case member (54A) and a thermosetting outer case member (54B).
In an other embodiment the insulating case (54) comprises a thermosetting upper case member (86) of a larger diameter, and a thermoplastic lower case member (88). The ceramic dielectric (32) is encapsulated in insulating resin material (58) poured in said insulating case (54). The capacitor further includes an insulating cover (56) and a ground fitment (40) interposedly arranged between said insulating case (54) and said insulating cover (56).
摘要翻译：本发明提供一种高电压贯通型陶瓷电容器，即使在恶劣的条件下也能够确保足够的耐热性，确保电容器的良好的操作性，并且能够确保良好的动作并且小型化。在一个实施例中，绝缘壳体（54）由热塑性内壳体部件（54A）和热固性外壳体部件（54B）构成。在另一个实施例中，绝缘盒（54）包括较大直径的热固性上壳体部件（86）和热塑性下壳体部件（88）。陶瓷电介质（32）被封装在注入所述绝缘壳体（54）中的绝缘树脂材料（58）中。该电容器还包括绝缘盖（56）和插置在所述绝缘壳体（54）和所述绝缘盖（56）之间的接地附件（40）。

66. 发明公开

EP0062167A3 Electrical component centered and adjusted in a casing 失效
标题翻译：电气组件中心调整和调整
公开(公告)号：EP0062167A3
公开(公告)日：1984-03-28
申请号：EP82101702
申请日：1982-03-04
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： LINSE, HEINRICH, DIPL.-ING. , KODAL, TASSILO , KRAUS, HUBERT
IPC分类号： H01C1/028 , H01G2/10 , H01G4/224 , H01L23/02 , H05K5/00 , H05K5/02 , H01G1/02
CPC分类号： H01G2/106 , H01L2924/0002 , H05K5/0091 , H01L2924/00

67. 发明公开

EP4435810A2 MULTILAYER ELECTRONIC COMPONENT 审中-公开
公开(公告)号：EP4435810A2
公开(公告)日：2024-09-25
申请号：EP24158361.6
申请日：2024-02-19
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： An, So Jung , Choi, Hyung Jong , Park, Jung Won , Lee, Yoo Jeong , Won, Kwang Yeun , Sung, Woo Kyung , Jeon, Byung Jun , Lee, Chul Seung
IPC分类号： H01G2/06 , H01G4/224 , H01G4/30 , H01G4/232
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30 , H01G2/065 , H01G4/224
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

68. 发明公开

EP4421834A2 MULTILAYER ELECTRONIC COMPONENT 审中-公开
公开(公告)号：EP4421834A2
公开(公告)日：2024-08-28
申请号：EP24153927.9
申请日：2024-01-25
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Ryoo, Hye Won , Kim, Kyung Sik , Baik, Seung In , Choi, Min Young , Lee, Jong Hwan , Kwon, Hyung Soon
IPC分类号： H01G4/12 , H01G4/224 , H01G4/30
CPC分类号： H01G4/30 , H01G4/1227 , H01G4/224 , H01G4/1209
摘要： A multilayer electronic component includes a body including dielectric layers and internal electrodes; and an external electrode disposed on the body. The body includes a capacitance forming portion including the dielectric layers and the internal electrodes in a first direction, and a cover portion disposed on both end-surfaces of the capacitance forming portion in the first direction. One of the dielectric layers includes a first acceptor element containing Al, a second acceptor element containing at least one of Mg, Mn, or V, and Ti. The one of the dielectric layers and the cover portion include a plurality of dielectric grains, and a ratio (G1/G2) of an average size (G1) of the plurality of dielectric grains included in the one of the dielectric layers relative to an average size (G2) of the plurality of dielectric grains included in the cover portion satisfies 1.00 ≤ G1/G2

69. 发明公开

EP4418291A2 MULTILAYER CERAMIC COMPONENT COMPRISING GRAPHENE OXIDE INTERMEDIATE LAYER BETWEEN THE BODY AND THE EXTERNAL ELECTRODES 审中-公开
公开(公告)号：EP4418291A2
公开(公告)日：2024-08-21
申请号：EP24152093.1
申请日：2024-01-16
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Kang, Dongwoo
IPC分类号： H01G4/232 , H01G4/224 , H01G4/30
CPC分类号： H01G4/30 , H01G4/224 , H01G4/232
摘要： A multilayer electronic component (100) includes a body (110) including a dielectric layer (111) and internal electrodes (121, 122), external electrodes (131, 132) disposed on the body (110), and a coating film (141, 142) disposed on at least a portion of an external surface of the body (110), wherein the coating film (141, 142) is disposed to contact at least a portion of the dielectric layer (111) and includes a graphene oxide layer.

70. 发明公开

EP4390991A2 MULTILAYER CERAMIC CAPACITOR (MLCC) WITH LATERAL DIELECTRIC LAYERS OF DIFFERENT CRYSTAL SIZES 审中-公开
公开(公告)号：EP4390991A2
公开(公告)日：2024-06-26
申请号：EP23203994.1
申请日：2023-10-17
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Hong, Hyuk Jin , Song, Young Hoon
IPC分类号： H01G4/12 , H01G4/224 , H01G4/30
CPC分类号： H01G4/1227 , H01G4/30 , H01G4/224 , H01G4/1218
摘要： A multilayer ceramic capacitor (100a, 100d) includes a body (110) including a capacitance region (116) in which at least one first internal electrode (121) and at least one second internal electrode (122) are alternately stacked in a first direction (T) with at least one dielectric layer (111) interposed therebetween; and first (131) and second external electrodes (132) disposed on the body (110) to be spaced apart from each other with the capacitance region (116) interposed therebetween in a second direction (L), different from the first direction, and respectively connected to the at least one first internal electrode (121) and the at least one second internal electrode (122), wherein the body further includes a plurality of margin regions disposed with the capacitance region interposed therebetween in a third direction, different from the first and second directions, wherein each of the plurality of margin regions (114) includes a second margin region (114b) and a first margin region (114a) disposed between the second margin region (114b) and the capacitance region (116), and wherein a size of a crystal grain (GRAIN2) in the second margin region (114b) is larger than a size of a crystal grain (GRAIN1) in the first margin region (114a).

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