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1. 发明公开

EP2211597A1 Wiring board and capacitor to be built into wiring board 有权
标题翻译： Leiterplatte und Kondensator zum Einbauen in eine Leiterplatte
公开(公告)号：EP2211597A1
公开(公告)日：2010-07-28
申请号：EP10158476.1
申请日：2006-02-09
申请人： NGK Spark Plug Co., Ltd.
发明人： Muramatsu, Masaki , Yuri, Shinji , Urashima, Kazuhiro , Yamamoto, Hiroshi , Seki, Toshitake , Sato, Motohiko
IPC分类号： H05K1/18 , H01G2/06 , H01L23/498
CPC分类号： H01G2/06 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/10 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A capacitor to be built into wiring board, comprising: a first electrode conductor layer (14); a second electrode conductor layer (17) opposed to the first electrode conductor layer (14); and a dielectric layer (52) that lies between the first electrode conductor layer (14) and the second electrode conductor layer (17), wherein any one of a chamfered portion (1b(t)) with chamfering dimension of not less than 0.6 mm and a radius portion (1b(r))with curvature radius of not less than 0.6 mm is formed on at least one corner on an outer peripheral edge of the capacitor to be built into wiring board.
摘要翻译：一种内置于布线板的电容器，包括：第一电极导体层（14）; 与所述第一电极导体层（14）相对的第二电极导体层（17）。以及位于所述第一电极导体层（14）与所述第二电极导体层（17）之间的电介质层（52），其中倒角部（1b（t））中的任何一个具有不小于0.6mm的倒角尺寸并且在内置于电路板的电容器的外周边缘的至少一个角上形成曲率半径不小于0.6mm的半径部分（1b（r））。

2. 发明公开

EP1691590A2 Wiring board and capacitor to be built into wiring board 有权
标题翻译：接线板和电容器要嵌入到接线板中
公开(公告)号：EP1691590A2
公开(公告)日：2006-08-16
申请号：EP06002669.7
申请日：2006-02-09
申请人： NGK Spark Plug Co., Ltd.
发明人： Muramatsu, Masaki , Yuri, Shinji , Urashima, Kazuhiro , Yamamoto, Hiroshi , Seki, Toshitake , Sato, Motohiko
IPC分类号： H05K1/14 , H05K1/18 , H05K1/02 , H01G4/224
CPC分类号： H01G2/06 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/10 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An intermediate board (200) has a board core composed of a core main body (100m) and a sub-core portion (1). The core main body (100m) is formed into a plate shape by a macromolecular material, and is formed with a sub-core housing portion (100h) which is opened and formed on a first main surface by reducing its thickness. The sub-core portion (1) is formed into a plate shape by ceramic, and is housed in the sub-core housing portion (100h) so that its thicknesswise direction matches with that of the core main body (100m). A first terminal array (5) of the board core (100) is formed in a position where it overlaps the sub-core portion (1) in orthographic projection to a reference surface parallel with a plate surface of the board core (100) . The sub-core portion (1) incorporates a laminated ceramic capacitor where a first electrode conductor layer (54), a ceramic layer (52) and a second electrode conductor layer (57) are laminated periodically in this order. The first electrode conductor layer is conductive with a first side first type terminal (5a) and a second side first type terminal (7a). The ceramic layer is composed of a dielectric layer. The second electrode conductor layer is conductive with a first side second type terminal (5b) and a second side second type terminal (7b). In the sub-core housing portion (100h), an inner edge of the cross section along a plane parallel with a plate surface of the sub-core portion (1) has a quadrate shape, and a radius portion with dimension of not less than 0.1 mm to not more than 2 mm is formed on its corners.
摘要翻译：中间板（200）具有由芯主体（100m）和子芯部（1）构成的板芯。芯主体（100m）由高分子材料形成为板状，并且形成有通过减小其厚度而在第一主表面上开口并形成的子芯容纳部（100h）。子核心部分（1）通过陶瓷形成为板状，并且以其厚度方向与核心主体（100m）的厚度方向相匹配的方式容纳在子核心壳体部分（100h）中。所述板芯（100）的第一端子阵列（5）以与所述板芯（100）的板面平行的基准面正交投影的方式形成在与所述子芯部（1）重叠的位置。子核心部分（1）结合了层压陶瓷电容器，其中第一电极导体层（54），陶瓷层（52）和第二电极导体层（57）按此顺序周期性层压。第一电极导体层与第一侧第一类型端子（5a）和第二侧第一类型端子（7a）导电。陶瓷层由电介质层构成。第二电极导体层与第一侧面第二类型端子（5b）和第二侧面第二类型端子（7b）导电。在子核心容纳部（100h）中，沿着与子核心部（1）的板面平行的平面的截面的内边缘具有方形形状，并且具有不小于在其角上形成0.1毫米至不大于2毫米。

3. 发明授权

EP2211597B1 Wiring board and capacitor to be built into wiring board 有权
标题翻译： PCB和冷凝器安装在一印刷电路板
公开(公告)号：EP2211597B1
公开(公告)日：2011-12-21
申请号：EP10158476.1
申请日：2006-02-09
申请人： NGK Spark Plug Co., Ltd.
发明人： Muramatsu, Masaki , Yuri, Shinji , Urashima, Kazuhiro , Yamamoto, Hiroshi , Seki, Toshitake , Sato, Motohiko
IPC分类号： H05K1/18 , H01G2/06 , H01L23/498
CPC分类号： H01G2/06 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/10 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An intermediate board (200) has a board core composed of a core main body (100m) and a sub-core portion (1). The core main body (100m) is formed into a plate shape by a macromolecular material, and is formed with a sub-core housing portion (100h) which is opened and formed on a first main surface by reducing its thickness. The sub-core portion (1) is formed into a plate shape by ceramic, and is housed in the sub-core housing portion (100h) so that its thicknesswise direction matches with that of the core main body (100m). A first terminal array (5) of the board core (100) is formed in a position where it overlaps the sub-core portion (1) in orthographic projection to a reference surface parallel with a plate surface of the board core (100) . The sub-core portion (1) incorporates a laminated ceramic capacitor where a first electrode conductor layer (54), a ceramic layer (52) and a second electrode conductor layer (57) are laminated periodically in this order. The first electrode conductor layer is conductive with a first side first type terminal (5a) and a second side first type terminal (7a). The ceramic layer is composed of a dielectric layer. The second electrode conductor layer is conductive with a first side second type terminal (5b) and a second side second type terminal (7b). In the sub-core housing portion (100h), an inner edge of the cross section along a plane parallel with a plate surface of the sub-core portion (1) has a quadrate shape, and a radius portion with dimension of not less than 0.1 mm to not more than 2 mm is formed on its corners.

4. 发明授权

EP1691590B1 Wiring board 有权
公开(公告)号：EP1691590B1
公开(公告)日：2010-11-03
申请号：EP06002669.7
申请日：2006-02-09
申请人： NGK Spark Plug Co., Ltd.
发明人： Muramatsu, Masaki , Yuri, Shinji , Urashima, Kazuhiro , Yamamoto, Hiroshi , Seki, Toshitake , Sato, Motohiko
IPC分类号： H05K1/18 , H01G4/224
CPC分类号： H01G2/06 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/10 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An intermediate board (200) has a board core composed of a core main body (100m) and a sub-core portion (1). The core main body (100m) is formed into a plate shape by a macromolecular material, and is formed with a sub-core housing portion (100h) which is opened and formed on a first main surface by reducing its thickness. The sub-core portion (1) is formed into a plate shape by ceramic, and is housed in the sub-core housing portion (100h) so that its thicknesswise direction matches with that of the core main body (100m). A first terminal array (5) of the board core (100) is formed in a position where it overlaps the sub-core portion (1) in orthographic projection to a reference surface parallel with a plate surface of the board core (100) . The sub-core portion (1) incorporates a laminated ceramic capacitor where a first electrode conductor layer (54), a ceramic layer (52) and a second electrode conductor layer (57) are laminated periodically in this order. The first electrode conductor layer is conductive with a first side first type terminal (5a) and a second side first type terminal (7a). The ceramic layer is composed of a dielectric layer. The second electrode conductor layer is conductive with a first side second type terminal (5b) and a second side second type terminal (7b). In the sub-core housing portion (100h), an inner edge of the cross section along a plane parallel with a plate surface of the sub-core portion (1) has a quadrate shape, and a radius portion with dimension of not less than 0.1 mm to not more than 2 mm is formed on its corners.

5. 发明公开

EP1691590A3 Wiring board and capacitor to be built into wiring board 有权
标题翻译： Leiterplatte und Kondensator zum Einbauen in eine Leiterplatte
公开(公告)号：EP1691590A3
公开(公告)日：2006-10-18
申请号：EP06002669.7
申请日：2006-02-09
申请人： NGK Spark Plug Co., Ltd.
发明人： Muramatsu, Masaki , Yuri, Shinji , Urashima, Kazuhiro , Yamamoto, Hiroshi , Seki, Toshitake , Sato, Motohiko
IPC分类号： H05K1/14 , H05K1/18 , H05K1/02 , H01G4/224
CPC分类号： H01G2/06 , H01L23/49822 , H01L23/49838 , H01L23/50 , H01L24/10 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K3/4602 , H05K2201/10674 , H05K2201/10712 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An intermediate board (200) has a board core composed of a core main body (100m) and a sub-core portion (1). The core main body (100m) is formed into a plate shape by a macromolecular material, and is formed with a sub-core housing portion (100h) which is opened and formed on a first main surface by reducing its thickness. The sub-core portion (1) is formed into a plate shape by ceramic, and is housed in the sub-core housing portion (100h) so that its thicknesswise direction matches with that of the core main body (100m). A first terminal array (5) of the board core (100) is formed in a position where it overlaps the sub-core portion (1) in orthographic projection to a reference surface parallel with a plate surface of the board core (100) . The sub-core portion (1) incorporates a laminated ceramic capacitor where a first electrode conductor layer (54), a ceramic layer (52) and a second electrode conductor layer (57) are laminated periodically in this order. The first electrode conductor layer is conductive with a first side first type terminal (5a) and a second side first type terminal (7a). The ceramic layer is composed of a dielectric layer. The second electrode conductor layer is conductive with a first side second type terminal (5b) and a second side second type terminal (7b). In the sub-core housing portion (100h), an inner edge of the cross section along a plane parallel with a plate surface of the sub-core portion (1) has a quadrate shape, and a radius portion with dimension of not less than 0.1 mm to not more than 2 mm is formed on its corners.
摘要翻译：中间板（200）具有由芯主体（100m）和副芯部（1）构成的板芯。芯主体（100m）通过高分子材料形成为板状，并且形成有通过减小其厚度而在第一主表面上开口形成的子芯收纳部（100h）。副芯部（1）通过陶瓷形成为板状，并且被容纳在副芯容纳部（100h）中，使其厚度方向与芯主体（100m）的厚度方向一致。板芯（100）的第一端子阵列（5）形成在与子芯部分（1）重叠的位置，在正交投影中与平行于板芯（100）的板表面的参考表面重叠。子芯部分（1）包括层叠的陶瓷电容器，其中第一电极导体层（54），陶瓷层（52）和第二电极导体层（57）按顺序周期性地层叠。第一电极导体层通过第一侧第一型端子（5a）和第二侧第一型端子（7a）导电。陶瓷层由电介质层构成。第二电极导体层通过第一侧第二类型端子（5b）和第二侧面第二类型端子（7b）导电。在子芯收纳部（100h）中，沿着与副芯部（1）的板面平行的平面的横截面的内缘为正方形，尺寸为不小于 0.1mm至不大于2mm的角形成。

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