专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明公开

EP1881749A3 Method of fabricating an electrical connecting element, and electrical connecting element 审中-公开
标题翻译：一种制造电连接部件的方法和电连接元件
公开(公告)号：EP1881749A3
公开(公告)日：2010-04-07
申请号：EP07405203.6
申请日：2007-07-13
申请人： Dyconex AG
发明人： Hauer, Marc
IPC分类号： H05K1/03 , H05K3/00 , H01R3/00
CPC分类号： H05K3/0052 , H05K1/0366 , H05K2201/0909 , H05K2203/0228 , Y10T29/49128 , Y10T29/49165 , Y10T29/49798 , Y10T428/24744 , Y10T428/254
摘要： A method of manufacturing an electrical connecting element with a predetermined breaking point is provided, the method comprising the steps of providing a core which comprises fiber reinforced material, of cutting the core at a cutting location where the predetermined breaking point is to be, and thereby creating a cut in the core, of adding at least one layer of material including a dielectric in a non-hardened state, the at least one layer at least partially covering the cut, and thereby at least partially filling the cut with dielectric material, of hardening the dielectric material, and of cutting through the layer of material at the cutting location.

62. 发明公开

EP2166826A2 A package for power converters with improved transformer operations 有权
标题翻译： GehäusefürStromwandler mit verbicultem Transformatorbetrieb
公开(公告)号：EP2166826A2
公开(公告)日：2010-03-24
申请号：EP09016073.0
申请日：1999-05-27
申请人： DET International Holding Limited
发明人： The designation of the inventor has not yet been filed
IPC分类号： H05K1/14 , H05K1/16
CPC分类号： H05K1/165 , H01F27/06 , H05K1/0203 , H05K1/0206 , H05K1/05 , H05K3/0061 , H05K7/209 , H05K2201/066 , H05K2201/086 , H05K2201/09054 , H05K2201/09063 , H05K2201/09572 , H05K2201/09745 , H05K2201/10166 , Y10T29/49165
摘要： An electronic assembly comprising:
a) an electronic board (234) having an opening therein, said electronic board (234) further including two pads (2552B) positioned on a first surface of said electronic board (234) proximate to said opening;
b) a multilayer circuit board (232) having secured thereto a transformer, said multilayer circuit board (232) positioned such that a portion of a first surface of said multilayer circuit board (232) engages the first surface of said electronic board (234) such that a portion of a core (2310) of said transformer extends into the opening of said electronic board (234), said multilayer circuit board (232) having at least two channels (2524) there through, each of said channels (2524) aligned with one of said at least two pads (2552B) of said electronic board (234); and
c) solder (2522) extending through said at least two channels (2524) in said multilayer circuit board (232), said solder (2522) bonded to the channel (2524) and to an associated pad (254B) on said electronic board (234).
摘要翻译：一种电子组件，包括：a）在其中具有开口的电子板（234），所述电子板（234）还包括位于靠近所述开口的所述电子板（234）的第一表面上的两个焊盘（2552B） b）多层电路板（232），其固定有变压器，所述多层电路板（232）定位成使得所述多层电路板（232）的第一表面的一部分与所述电子板（234）的第一表面接合，使得所述变压器的芯部（2310）的一部分延伸到所述电子板（234）的开口中，所述多层电路板（232）在其中具有至少两个通道（2524），每个所述通道（2524）与所述电子板（234）的所述至少两个焊盘（2552B）中的一个对准; 以及c）延伸穿过所述多层电路板（232）中的所述至少两个通道（2524）的焊料（2522），所述焊料（2522）结合到所述通道（2524）上并连接到所述电子板上的相关焊盘（254B）（234）。

63. 发明授权

EP1397816B1 CONTROL PANEL ASSEMBLY FOR HOME APPLIANCES AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：面板组件用于生产家用电器和方法
公开(公告)号：EP1397816B1
公开(公告)日：2009-12-23
申请号：EP02741485.3
申请日：2002-06-22
申请人： LG Electronics Inc.
发明人： SONG, Young-Han , KANG, Ki-Ho , KIM, Myong-Deok
IPC分类号： H01H13/70
CPC分类号： B29C45/1418 , B29C2045/14286 , B29L2031/286 , B29L2031/3443 , H01H13/70 , H01H2219/028 , H01H2223/00 , H01H2229/047 , H01H2231/016 , H05K5/0017 , Y10T29/417 , Y10T29/43 , Y10T29/49128 , Y10T29/49165
摘要： A control panel assemble for home appliances devised for a better external appearance and more stable operation is disclosed. The control panel assembly includes a substrate (40) provided with at lest one switch (42) for operating home appliance and at least one display element (43) for displaying the operation state, an external film (60) configured to make it possible for user to access to the switch (42) and the display element (43), and a control panel (30) allowing the substrate 40 to be installed therein, the control panel (30) injection-molded to be inserted in the external film (60) and integrated with the external film (60).

64. 发明公开

EP2001050A4 METHOD FOR MANUFACTURING SUBSTRATE HAVING ELECTRIC COMPONENT 有权
标题翻译：一种用于生产衬底，电气元件
公开(公告)号：EP2001050A4
公开(公告)日：2009-12-02
申请号：EP07739611
申请日：2007-03-26
申请人： SONY CHEM & INF DEVICE CORP
发明人： TANIGUCHI MASAKI , FURUTA KAZUTAKA
IPC分类号： H01L25/04 , H01L25/18 , H05K1/18
CPC分类号： H05K1/141 , B30B5/02 , H01L24/75 , H01L25/16 , H01L25/162 , H01L2224/16 , H01L2224/75315 , H01L2224/75316 , H01L2224/7598 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/19105 , H05K1/181 , H05K1/183 , H05K3/3436 , H05K2201/10378 , H05K2201/2018 , H05K2203/1572 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： A simple method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate 20 and electric components 31 and 32 are connected together to a first face of a base substrate 10, the number of steps for the connection is reduced to shorten the producing time. When electric components 32 and 33 are to be connected to a second face 14, the base substrate 10 is supported by the supporting substrate 20, and the electric components 31 and 32 and connected to the first face 13 do not contact a processing table 51 and therefore they undergo no damage. Thus, according to the present invention, an electric component-mounted substrate 1 having high reliability can be produced in a short time.

65. 发明公开

EP1928220A3 Wiring board and method of manufacturing the same 审中-公开
标题翻译：线路板及其制造方法
公开(公告)号：EP1928220A3
公开(公告)日：2009-09-30
申请号：EP07023248.3
申请日：2007-11-30
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Muramatsu, Shigetsugu , Kusuma, Yasuhiko
IPC分类号： H05K3/40 , H05K3/24
CPC分类号： H05K3/4007 , H05K1/111 , H05K3/0044 , H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/4644 , H05K2201/0367 , H05K2201/0376 , H05K2201/09736 , H05K2203/025 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board includes: an uppermost wiring layer (4) formed on a prescribed number of underlying wiring layers (2), a portion (6) of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer (5) covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.
摘要翻译：布线板包括：在规定数量的下层布线层（2）上形成的最上层布线层（4），最上层布线层的一部分（6）露出并用作与要安装的元件连接的焊盘 ; 和覆盖最上布线层的绝缘树脂层（5），其中最上布线层的部分的厚度大于其它部分的厚度。

66. 发明公开

EP2086299A1 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board 审中-公开
标题翻译：一种多层印刷电路板组件和制造多层印刷电路板组件的方法
公开(公告)号：EP2086299A1
公开(公告)日：2009-08-05
申请号：EP09156837.8
申请日：2000-05-25
申请人： IBIDEN CO., LTD.
发明人： Asai, Motoo , Wang, Dongdong , Mori, Takahiro
IPC分类号： H05K3/46
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board comprising: a core substrate having through holes for connecting the upper and lower surfaces to each other and having a structure that interlayer resin insulating layers and conductor circuits are alternately laminated on said core substrate, wherein
through holes having different diameters are formed in said core substrate.
摘要翻译：一种多层印刷电路板，包括：具有通孔的上表面和下表面连接到海誓山盟和具有结构做了层间树脂绝缘层和导体电路交替层叠在所述核心基板，worin通过具有不同的孔的核心基板直径在形成在所述核心基板。

67. 发明公开

EP2081419A2 Printed circuit board and method of manufacturing printed circuit board 有权
标题翻译： Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
公开(公告)号：EP2081419A2
公开(公告)日：2009-07-22
申请号：EP09156903.8
申请日：2000-09-01
申请人： Ibiden Co., Ltd.
发明人： Inagaki, Yasushi c/o Ogaki-kita-kojou, Ibiden Co., Ltd. , Asai, Motoo c/o Ogaki-kita-kojou Ibiden Co., Ltd. , Wang, Dongdong c/o Ogaki-kita-kojou, Ibiden Co., Ltd., , Yabashi, Hideo c/o Ogaki-kita-kojou Ibiden Co., Ltd., , Shirai, Seiji c/o Ogaki-kita-kojou, Ibiden Co., Ltd.,
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
摘要翻译：芯片电容器（20）设置在印刷电路板（10）的芯基板（30）中。这使得可以缩短IC芯片（90）和芯片电容器（20）之间的距离并减小环路电感。由于通过以多层方式设置第一树脂基板（30a），第二树脂基板（30b）和第三树脂基板（30c）构成芯基板（30），所以芯基板（30）能够获得足够的强度。

68. 发明公开

EP2077703A1 Printed circuit board and method of manufacturing printed circuit board 有权
标题翻译：印刷电路板和制造印刷电路板的方法
公开(公告)号：EP2077703A1
公开(公告)日：2009-07-08
申请号：EP09156862.6
申请日：2000-09-01
申请人： IBIDEN CO., LTD.
发明人： Inagaki, Yasushi , Asai, Motoo , Wang, Dongdong , Yabashi, Hideo , Shirai, Seiji
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

69. 发明公开

EP2077702A2 Wiring board and manufacturing method thereof and wiring board assembly 审中-公开
标题翻译： Leiterplatte und Herstellungsverfahrendafürund Leiterplattenanordnung
公开(公告)号：EP2077702A2
公开(公告)日：2009-07-08
申请号：EP08166020.1
申请日：2008-10-07
申请人： Fujitsu Ltd.
发明人： Sugane, Mitsuhiko, Fujitsu Advanced Technologies Limited
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K3/421 , H05K2201/09063 , H05K2201/09509 , H05K2201/09845 , H05K2203/1178 , Y10T29/49155 , Y10T29/49165
摘要： A wiring board has a substrate having a first surface and a second surface opposite to the first surface, at least one wiring layer being formed between the first surface and the second surface. A non-through hole is formed in the substrate with a depth from the first surface to reach the wiring layer, an inner surface of the non-through hole being plated. A vent hole is formed in the substrate to extend between an end of the non-through hole and the second surface of the substrate. A plated portion of the non-through hole is connected to the wiring layer. An inner diameter of the vent hole is smaller than an inner diameter of the plated portion of the non-through hole.
摘要翻译：布线板具有具有与第一表面相对的第一表面和第二表面的基板，在第一表面和第二表面之间形成至少一个布线层。在基板上形成有从第一表面到达布线层的深度的非贯通孔，非通孔的内表面被电镀。在基板中形成通气孔，以在非通孔的端部和基板的第二表面之间延伸。非通孔的电镀部分连接到布线层。通气孔的内径小于非通孔的镀层部分的内径。

70. 发明公开

EP1923488A3 A process for manufacturing a multilayer printed circuit board 审中-公开
标题翻译：一种制造多层印刷电路板的方法
公开(公告)号：EP1923488A3
公开(公告)日：2009-05-27
申请号：EP08152453.0
申请日：1999-09-14
申请人： Ibiden Co., Ltd.
发明人： En, Honchin , Nakai, Tohru , Oki, Takeo , Hirose, Naohiro , Noda, Kouta
IPC分类号： H05K3/18 , H05K3/46 , H05K1/09 , C25D5/18 , C23C18/34
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A process for manufacturing a multilayer printed circuit board comprises a step for providing openings in an interlayer insulating layer (4002), and a step for filling up the openings with a plating metal to construct via holes (4007) and, at the same time, build up an upper-layer conductor layer (4005). The electroplating is performed using an aqueous solution containing a metal ion and 0.1 to 1.5 mmol/L of at least one additive selected from the group consisting of thioureas, cyanides and polyalkylene oxides as a plating solution.
摘要翻译：用于制造多层印刷电路板的工艺包括在层间绝缘层（4002）中提供开口的步骤以及用电镀金属填充开口以构建通孔（4007）的步骤，并且同时，建立上层导体层（4005）。电镀使用含有金属离子和0.1至1.5mmol / L的至少一种选自硫脲，氰化物和聚亚烷基氧化物的添加剂的水溶液作为电镀液来进行。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式