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51. 发明公开

EP2124517A3 Elektrisches Speichersystem mit Doppelschichtkodensatoren 有权转让
公开(公告)号：EP2124517A3
公开(公告)日：2017-05-03
申请号：EP09004638.4
申请日：2009-03-31
申请人： MAN Truck & Bus AG
发明人： Kerschl, Stefan , Kirchensteiner, Elmar
IPC分类号： H05K7/20 , B60W10/24 , B60W10/26 , B60K6/28 , B60K6/46 , B60L11/00 , B60L11/18 , B60K6/20 , B60K1/00
CPC分类号： H05K7/20945 , B60K6/20 , B60K2001/005 , B60L50/40 , B60L58/22 , B60L58/26 , B60W2510/246 , B60W2510/248 , Y02T10/7005 , Y02T10/7022 , Y02T10/7061
摘要： Ein elektrisches Speichersystem (1) mit einer Vielzahl von elektrischen Doppelschichtkondensatoren (10a, 10b, 10c), die elektrisch miteinander verbunden sind und mit einer Überwachungseinrichtung (5) zum Überwachen wenigstens eines physikalischen Zustands der Doppelschichtkondenstatoren (10a, 10b, 10c). Erfindungsgemäß ist das Speichersystem (1) in mehrere Module (2a, 2b, 2c) segmentiert, wobei jedes dieser Module (2a, 2b, 2c) eine Vielzahl von elektrisch miteinander verbundenen Doppelschichtkondensatoren (10a, 10b, 10c) aufweist und die Überwachungseinrichtung (4) eine Vielzahl von Spannungsmesseinrichtungen (4) aufweist, wobei jedes Modul (2a, 2b, 2c) mit wenigstens einer Spannungsmesseinrichtung (4a) in Verbindung steht, welche einen Spannungszustand dieses Moduls (2a, 2b, 2c) bestimmt.

52. 发明公开

EP2938956A4 METHOD FOR AIR FLOW FAULT AND CAUSE IDENTIFICATION 有权
标题翻译： VERFAHREN ZUR IDENTIFIZIERUNG VON LUFTSTRHFEERL UND URSACHEN
公开(公告)号：EP2938956A4
公开(公告)日：2016-07-27
申请号：EP12891200
申请日：2012-12-28
申请人： SCHNEIDER ELECTRIC IT CORP
发明人： BUDDE KRISTIAN
IPC分类号： F28D15/06 , G01K3/00 , G01K3/10
CPC分类号： G01N25/72 , F24F11/0012 , F24F11/022 , F24F11/30 , F24F11/32 , F24F11/39 , F24F11/72 , F24F2011/0052 , F24F2011/0093 , F24F2110/10 , G01F1/00 , G01K3/005 , G01K3/10 , G01K7/42 , H05K7/20945
摘要： Methods and systems for detecting and identifying faults in air-cooled systems are provided. The systems and methods may utilize a prediction model based on an energy balance relationship. In certain methods, one or more measured parameters associated with the air-cooled system may be compared with corresponding parameters generated by the prediction model. One or more faults may be detected and identified based upon deviations between the measured and detected system parameters.
摘要翻译：提供了用于检测和识别风冷系统故障的方法和系统。系统和方法可以利用基于能量平衡关系的预测模型。在某些方法中，可以将与空气冷却系统相关联的一个或多个测量参数与由预测模型生成的相应参数进行比较。可以基于测量和检测到的系统参数之间的偏差来检测和识别一个或多个故障。

53. 发明授权

EP2387298B1 Selecting a power path based on temperature 有权转让
标题翻译：根据温度选择电源路径
公开(公告)号：EP2387298B1
公开(公告)日：2016-03-09
申请号：EP10195016.0
申请日：2010-12-14
申请人： BlackBerry Limited
发明人： Patino, Joseph , Book, Christopher Simon
IPC分类号： H05K7/20 , G06F1/26 , H02J7/00 , G06F1/20
CPC分类号： H05K7/20945 , G06F1/203 , G06F1/206 , G06F1/263 , H02J7/0068 , Y10T307/696 , Y10T307/773

54. 发明公开

EP2869443A1 POWER CONVERTER 有权
标题翻译：电力转换器
公开(公告)号：EP2869443A1
公开(公告)日：2015-05-06
申请号：EP12880159.4
申请日：2012-06-29
申请人： Toshiba Mitsubishi-Electric Industrial Systems Corporation
发明人： FUJII, Yosuke , TAKAHASHI, Nobuhiro
IPC分类号： H02M1/00 , F28D15/02 , H02M7/48
CPC分类号： H05K7/20336 , F28D15/0275 , F28D15/06 , F28F23/02 , H02M1/32 , H02M2001/327 , H05K7/20936 , H05K7/20945
摘要： A power conversion apparatus (1) includes an electrical circuit (3) including a heat source (31), a heat pipe cooler (9) in which a refrigerant is enclosed, the heat pipe cooler (9) cooling the heat source (31), freeze determination means (25) for determining whether the refrigerant is frozen, and an output limitation means (22) for limiting output when the freeze determination means (25) determines that the refrigerant is frozen.
摘要翻译：本发明的电力转换装置（1）具有：包含热源（31）的电路（3）;封入有制冷剂的热管冷却器（9）;冷却热源（31）的热管冷却器（9），用于确定制冷剂是否冻结的制冷确定装置（25）以及用于当制冷确定装置（25）确定制冷剂被冻结时限制输出的输出限制装置（22）。

55. 发明公开

EP2782433A3 Power conversion apparatus 有权转让
公开(公告)号：EP2782433A3
公开(公告)日：2015-05-06
申请号：EP14171862.7
申请日：2012-07-25
申请人： Hitachi Automotive Systems, Ltd.
发明人： Kuwano, Morio , Hara, Yosei , Hamada, Haruki
IPC分类号： H05K7/20 , H05K7/14 , B60L11/00 , H02M7/00 , B60L3/00 , B60L11/14 , B60L15/00 , B60L15/20
CPC分类号： H05K7/209 , B60L3/003 , B60L3/0061 , B60L11/005 , B60L11/14 , B60L15/007 , B60L15/2009 , B60L2210/40 , B60L2220/14 , B60L2240/36 , B60L2240/423 , B60L2240/443 , B60L2240/525 , B60L2270/145 , H01L2224/33 , H01L2224/48247 , H01L2224/73265 , H02M7/003 , H05K7/1432 , H05K7/20218 , H05K7/2089 , H05K7/20927 , H05K7/20945 , Y02T10/642 , Y02T10/645 , Y02T10/70 , Y02T10/7022 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275
摘要： The invention relates to a
power conversion apparatus, comprising:
a power semiconductor module 300 that has a power semiconductor element to convert a direct current into an alternating current; a flow channel formation body 12 that forms a flow channel through which a cooling medium flows, wherein the power semiconductor module 300 has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion with the power semiconductor element therebetween, the flow channel formation body 12 has a top surface that faces the first heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween and a bottom surface that faces the second heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween, at the opposite side of the top surface with the power semiconductor module 300 therebetween, the flow channel formation body 12 is manufactured by a manufacturing method to cast a predetermined material in a mold, a surface of the side is a tapered surface 914 to facilitate separations with the mold, and surfaces of the top surface and the bottom surface having respectively an regular clearance 916 with respect to the first heat dissipation portion and the second heat dissipation portion.

56. 发明公开

EP2782433A2 Power conversion apparatus 有权转让
标题翻译：电力转换装置
公开(公告)号：EP2782433A2
公开(公告)日：2014-09-24
申请号：EP14171862.7
申请日：2012-07-25
申请人： Hitachi Automotive Systems, Ltd.
发明人： Kuwano, Morio , Hara, Yosei , Hamada, Haruki
IPC分类号： H05K7/14 , B60L11/14 , H02M7/00 , H05K7/20
CPC分类号： H05K7/209 , B60L3/003 , B60L3/0061 , B60L11/005 , B60L11/14 , B60L15/007 , B60L15/2009 , B60L2210/40 , B60L2220/14 , B60L2240/36 , B60L2240/423 , B60L2240/443 , B60L2240/525 , B60L2270/145 , H01L2224/33 , H01L2224/48247 , H01L2224/73265 , H02M7/003 , H05K7/1432 , H05K7/20218 , H05K7/2089 , H05K7/20927 , H05K7/20945 , Y02T10/642 , Y02T10/645 , Y02T10/70 , Y02T10/7022 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275
摘要： The invention relates to a
power conversion apparatus, comprising:
a power semiconductor module 300 that has a power semiconductor element to convert a direct current into an alternating current; a flow channel formation body 12 that forms a flow channel through which a cooling medium flows, wherein the power semiconductor module 300 has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion with the power semiconductor element therebetween, the flow channel formation body 12 has a top surface that faces the first heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween and a bottom surface that faces the second heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween, at the opposite side of the top surface with the power semiconductor module 300 therebetween, the flow channel formation body 12 is manufactured by a manufacturing method to cast a predetermined material in a mold, a surface of the side is a tapered surface 914 to facilitate separations with the mold, and surfaces of the top surface and the bottom surface having respectively an regular clearance 916 with respect to the first heat dissipation portion and the second heat dissipation portion.
摘要翻译：功率转换装置技术领域本发明涉及一种功率转换装置，其包括：功率半导体模块300，其具有将直流转换成交流的功率半导体元件; 流路形成体12，其形成冷却介质流动的流路;功率半导体模块300具有第一散热部和面对第一散热部并隔着功率半导体元件的第二散热部，流路形成体12具有隔着流路与功率半导体模块300的第一散热部对置的上表面和隔着流路面对功率半导体模块300的第二散热部的下表面，在与功率半导体模块300之间的上表面的相反侧，流路形成体12通过在模具中铸造规定的材料的制造方法来制造，其侧面为锥面914，与模具以及顶面和底面的表面分别具有相对于第一散热部分和第二散热部分的常规间隙916。

57. 发明公开

EP2568790A1 Apparatus and method 有权转让
标题翻译：装置和方法
公开(公告)号：EP2568790A1
公开(公告)日：2013-03-13
申请号：EP11180187.4
申请日：2011-09-06
申请人： ABB Research Ltd.
发明人： Agostini, Bruno , Habert, Mathieu , Kauranen, Matti , Elo, Markku
IPC分类号： H05K7/20
CPC分类号： F28F9/00 , F28D15/0266 , F28D15/0275 , F28D20/02 , F28D2020/0013 , F28F27/00 , H05K7/20936 , H05K7/20945 , Y02E60/145
摘要： The invention relates to method for cooling and to an apparatus (1) comprising: a first heat transfer element (2) comprising a base plate (3), with a first surface (4) for receiving an electric component and channels (5) for transferring a heat load received via said first surface (4) into a fluid in said channels (5), at least some of the channels (5) protrude from a second surface (12) of the base plate (3), and a second heat transfer element for receiving fluid from the first heat transfer element and passing a heat load from said fluid to surroundings. In order to obtain an efficient cooling, a phase change material (11) is arranged at a second surface (12) of the base plate (3) between at least two of the channels (5), said phase change material (11) absorbing heat by changing phase at a phase change temperature during operation of said electric component.
摘要翻译：本发明涉及一种用于冷却的方法和一种设备（1），包括：第一传热元件（2），其包括基板（3），第一表面（4）用于接收电部件和通道（5），用于将经由所述第一表面（4）接收的热负载传递到所述通道（5）中的流体中，至少一些通道（5）从基板（3）的第二表面（12）突出，并且第二传热元件，用于接收来自第一传热元件的流体并将来自所述流体的热负荷传递至周围环境。为了获得有效的冷却，在至少两个通道（5）之间的基板（3）的第二表面（12）处设置相变材料（11），所述相变材料（11）吸收通过在所述电气部件的操作期间在相变温度下改变相位来进行加热。

58. 发明公开

EP2498588A1 Procédé de gestion thermique d'une installation de conversion d'énergie électrique et installation pour mise en oeuvre du procédé 有权
标题翻译：过程用于电力变换系统的热控制，和装置用于实现该方法
公开(公告)号：EP2498588A1
公开(公告)日：2012-09-12
申请号：EP12354008.0
申请日：2012-01-23
申请人： Schneider Electric Industries SAS
发明人： Moreau, Julien , Radu, Daniel
IPC分类号： H05K7/20
CPC分类号： H05K7/20909 , H02B1/56 , H02B7/06 , H05K7/20945
摘要： Procédé de fonctionnement s'applique à une installation (1) de conversion d'énergie électrique comprenant une enceinte (30) dans laquelle sont disposés un convertisseur de tension (7) et un dispositif d'électronique de puissance (2). Le procédé de fonctionnement comprend la mise en oeuvre de différents cheminements d'un fluide caloporteur selon l'état de fonctionnement du dispositif d'électronique de puissance et/ou selon l'environnement thermique dans lequel se trouve l'installation. L'Installation (1) de conversion d'énergie électrique comprend une enceinte (30) munie d'un premier compartiment (6) dans lequel est disposé un convertisseur de tension (7) et munie d'un deuxième compartiment (3) dans lequel est disposé un dispositif d'électronique de puissance (2). L'installation comprenant des moyens matériels (11, 12, 13, 14, 15, 16, 17, 18) et/ou logiciels de mise en oeuvre du procédé de fonctionnement selon l'une des revendications précédentes.

59. 发明授权

EP0821468B1 Temperature control of electronic components 失效
标题翻译：用于电子电路的温度控制
公开(公告)号：EP0821468B1
公开(公告)日：2004-03-10
申请号：EP97305322.6
申请日：1997-07-16
申请人： GENERAL ELECTRIC COMPANY
发明人： Esser, Albert Andreas Maria , Keister, Lyle Thomas , Lyons, James Patrick , Sutherland, Steven Wade , Hughes, Melvin Lavern , Edmunds, Howard Ross , Nash, Stephen Daniel , Pate, Paul Stephen , McGinn, Patrick Henry , Pecile, Conrad Angelo
IPC分类号： H02M7/00 , H05K7/20
CPC分类号： H05K7/20945 , F28D15/0275 , H05K7/20936

60. 发明公开

EP0832450A1 THERMAL PROTECTION OF TRACTION INVERTERS 失效
标题翻译：保温驱动器，用于车辆行驶
公开(公告)号：EP0832450A1
公开(公告)日：1998-04-01
申请号：EP97915086.0
申请日：1997-03-06
申请人： GENERAL ELECTRIC COMPANY
发明人： KUMAR, Ajith, Kuttannair , MACCHIAROLI, Peter, Billey
IPC分类号： G05D23 , H05K7
CPC分类号： H05K7/20918 , G05D23/1917 , H01L2924/0002 , H05K7/20945 , H01L2924/00
摘要： A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown includes the steps of computing the cooling air mass flow rate, creating an electronic model of the semiconductor/heat sink combination and estimating the semiconductor junction temperature from the mass flow rate and model. The cooling mass flow rate is determined by measuring the temperature of the cooling air prior to passage over the heat sink, measuring atmospheric pressure of the cooling air, determining the volumetric air flow rate of the cooling air and computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate. Power dissipation in the semiconductors is then commuted and heat sink and semiconductor temperatures are estimated from power dissipation and cooling air mass flow rate. Semiconductor power dissipation is limited so as to restrict semiconductor temperature to a safe operating value.

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