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    • 1. 发明公开
    • Cooling apparatus
    • 冷却装置
    • EP2819279A1
    • 2014-12-31
    • EP13173928.6
    • 2013-06-27
    • ABB Research Ltd.
    • Agostini, FrancescoTorresin, DanieleHabert, MathieuAgostini, Bruno
    • H02K9/04H05K7/20
    • H05K7/20336F28D15/0233F28D15/0266F28F13/06
    • The invention relates to an electric apparatus (1) comprising at least two cooling elements (4) and a first fan arrangement (5) for cooling the at least two cooling elements (4) with a first air flow (11). In order to obtain an efficient cooling solution the electric apparatus (1) comprises a second fan arrangement (6) for cooling the at least two cooling elements (4) with a second air flow (12). The second fan (6) arrangement passes the second air flow (12) in a different flow direction as compared to the first air flow (11), and the first (11) and second air flows (12) are arranged to cool different parts (13, 17) of the at least two cooling elements (4).
    • 本发明涉及包括至少两个冷却元件(4)和第一风扇装置(5)的电气设备(1),所述第一风扇装置用于利用第一气流(11)冷却所述至少两个冷却元件(4)。 为了获得有效的冷却解决方案,电气设备(1)包括用于用第二气流(12)冷却至少两个冷却元件(4)的第二风扇装置(6)。 与第一气流(11)相比,第二风扇(6)装置在不同的流动方向上通过第二气流(12),并且第一气流(11)和第二气流(12)被布置成冷却不同的部分 (4)的至少两个冷却元件(13,17)。
    • 2. 发明公开
    • Cooling assembly
    • 冷却组件
    • EP2661165A1
    • 2013-11-06
    • EP12166363.7
    • 2012-05-02
    • ABB Research Ltd.
    • Koivuluoma, TimoAgostini, BrunoHabert, MathieuSiirilä, Jouko
    • H05K7/20
    • F28G1/166F28G1/16H05K7/20181H05K7/202
    • A cooling assembly comprising a device chamber (2), a cooling chamber (4), heat exchanger means, fan means and control means (6), the heat exchanger means comprising a first heat exchanger unit (31) and a second heat exchanger unit (32) located above the first heat exchanger unit (31), the fan means comprising a first fan (52) adapted to generate a first cooling air flow (521). The cooling assembly further comprises a first dust tray (72) located between the first heat exchanger unit (31) and the second heat exchanger unit (32), the first cooling air flow (521) being directed towards the first dust tray (72), the first dust tray (72) being adapted to receive and retain at least part of contaminant particles present in the first cooling air flow (521), the device chamber (2) being separated from the cooling chamber (4).
    • 一种冷却组件,包括装置室(2),冷却室(4),热交换器装置,风扇装置和控制装置(6),热交换器装置包括第一热交换器单元(31)和第二热交换器单元 (32),所述风扇装置包括适于产生第一冷却空气流(521)的第一风扇(52)。 冷却组件还包括位于第一热交换器单元(31)和第二热交换器单元(32)之间的第一灰尘盘(72),第一冷却空气流(521)指向第一灰尘盘(72) ,所述第一尘盘(72)适于接收并保持存在于所述第一冷却空气流(521)中的污染物颗粒的至少一部分,所述装置室(2)与所述冷却室(4)分离。
    • 3. 发明公开
    • Apparatus and method
    • 装置和方法
    • EP2568790A1
    • 2013-03-13
    • EP11180187.4
    • 2011-09-06
    • ABB Research Ltd.
    • Agostini, BrunoHabert, MathieuKauranen, MattiElo, Markku
    • H05K7/20
    • F28F9/00F28D15/0266F28D15/0275F28D20/02F28D2020/0013F28F27/00H05K7/20936H05K7/20945Y02E60/145
    • The invention relates to method for cooling and to an apparatus (1) comprising: a first heat transfer element (2) comprising a base plate (3), with a first surface (4) for receiving an electric component and channels (5) for transferring a heat load received via said first surface (4) into a fluid in said channels (5), at least some of the channels (5) protrude from a second surface (12) of the base plate (3), and a second heat transfer element for receiving fluid from the first heat transfer element and passing a heat load from said fluid to surroundings. In order to obtain an efficient cooling, a phase change material (11) is arranged at a second surface (12) of the base plate (3) between at least two of the channels (5), said phase change material (11) absorbing heat by changing phase at a phase change temperature during operation of said electric component.
    • 本发明涉及一种用于冷却的方法和一种设备(1),包括:第一传热元件(2),其包括基板(3),第一表面(4)用于接收电部件和通道(5),用于 将经由所述第一表面(4)接收的热负载传递到所述通道(5)中的流体中,至少一些通道(5)从基板(3)的第二表面(12)突出,并且第二 传热元件,用于接收来自第一传热元件的流体并将来自所述流体的热负荷传递至周围环境。 为了获得有效的冷却,在至少两个通道(5)之间的基板(3)的第二表面(12)处设置相变材料(11),所述相变材料(11)吸收 通过在所述电气部件的操作期间在相变温度下改变相位来进行加热。
    • 10. 发明公开
    • Double-loop thermosiphon for cooling of electric and electronic components
    • 多宝贝热iph on on ile ile ile ile ile ile ile ile ile ile ile ile ile ile ile
    • EP2552182A1
    • 2013-01-30
    • EP11175915.5
    • 2011-07-29
    • ABB Research Ltd.
    • Bergamini, AlessioAgostini, FrancescoHabert, MathieuBesana, StefanoKaufmann, LilianMalinowski, Lukasz
    • H05K7/20F25B7/00F28D15/02
    • H05K7/20245F25B7/00F25B23/006F28D1/0308F28D1/0477F28D7/0025F28D15/0266F28D15/0275F28F2013/005H05K7/20336H05K7/20809
    • The present invention relates to the cooling of power electric and/or electronic components, in particular to a heat exchanger system (200) for moving heat from a heat source (120) comprising at least one of an electric and an electronic component (120). The heat exchanger system (200) comprises a first cooling circuit (210) that is formed as a loop-type thermo siphon comprising a first coolant with at least partially changes phases between the liquid state and a vaporous state in an operating state of the first cooling circuit (210) when heated up above a vaporization point of the first coolant. The first cooling circuit (210) has a first interface (212) for receiving a thermal load from the heat source (120) that is thermally connected to the first interface (212) and has a second interface (214) for releasing a major portion of said thermal load. The first interface (212) acts as a first evaporator (131) and the second interface (214) acts as a first condenser (133) in an operating state of the first cooling circuit (210). The heat exchanger system (200) further comprises a second cooling circuit (212) that is formed as a loop-type thermo siphon comprising a second coolant which at least partially changes phases between a liquid state and a vapor state, an operating state of the second cooling circuit (220) when heated up above a vaporization point of the second coolant. The second cooling circuit (212) has a third interface (216) that is thermally connected to the second interface (214). The second cooling circuit (220) has a fourth interface (218) for releasing the major portion of said thermal load taken up at the third interface (216). The third interface (216) acts as a second evaporator (212) and the fourth interface (218) acts as a second condenser (222) in an operating state of the second cooling circuit (212).
    • 本发明涉及功率电和/或电子部件的冷却,特别是涉及一种用于从包括电和电子部件(120)中的至少一个的热源(120)移动热量的热交换器系统(200) 。 热交换器系统(200)包括形成为环形热虹吸管的第一冷却回路(210),所述第一冷却回路包括第一冷却剂,所述第一冷却剂在第一冷却剂的第一冷却回路的运行状态下至少部分地改变液体状态和蒸汽状态之间的相位 冷却回路(210)当被加热到高于第一冷却剂的汽化点时。 第一冷却回路(210)具有用于从热源(120)接收热负荷的第一接口(212),其热连接到第一接口(212)并且具有用于释放主要部分的第二接口(214) 的所述热负荷。 在第一冷却回路(210)的运行状态下,第一接口(212)用作第一蒸发器(131),第二接口(214)用作第一冷凝器(133)。 热交换器系统(200)还包括第二冷却回路(212),其形成为环形热虹吸管,其包括至少部分地改变液体状态和蒸气状态之间的相位的第二冷却剂, 第二冷却回路(220)在第二冷却剂的蒸发点上方加热时。 第二冷却回路212具有热连接到第二接口214的第三接口216。 第二冷却回路(220)具有用于释放在第三接口(216)处被吸收的所述热负荷的主要部分的第四接口(218)。 在第二冷却回路(212)的运行状态下,第三接口(216)用作第二蒸发器(212),第四接口(218)用作第二冷凝器(222)。