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    • 46. 发明公开
    • Silicon single crystal production method
    • Verfahren zur Herstellung eines Siliciumeinzelkristalls
    • EP2415910A1
    • 2012-02-08
    • EP11175136.8
    • 2011-07-25
    • Siltronic AG
    • Kyufu, Shinichi
    • C30B29/06C30B15/28C30B15/30C30B30/04
    • C30B29/06C30B15/28C30B15/305C30B30/04
    • A silicon single crystal production method according to this invention will allow for the suppression of the deformation and the dislocations as well as the successful omission of the tail section.
      The silicon single crystal production method includes steps of growing the straight-body section 4 of the silicon single crystal 2 under the influence of the horizontal magnetic field with a magnetic flux density at its magnetic center L2 being equal to or more than 1000 Gauss, and equal to or less than 2000 Gauss, then reducing the relative lifting speed of the silicon single crystal to the surface of the melt 32 to 0 mm/minute, then maintaining the static state until there is a decrease in the apparent weight of the silicon single crystal, then further maintaining the static state so that the whole growth front of the silicon single crystal will form a convex shape protruding in the opposite direction to the lifting direction of the silicon single crystal, and finally separating the silicon single crystal from the melt.
    • 根据本发明的硅单晶制造方法将允许抑制变形和位错以及成功省略尾部。 硅单晶制造方法包括以下步骤:在水平磁场的影响下使硅单晶2的直体部分4生长,其磁性中心L2处的磁通密度等于或高于1000高斯, 等于或小于2000高斯,然后将硅单晶相对于熔体表面32的提升速度降低到0毫米/分钟,然后保持静态直到硅单体的表观重量减小 晶体,然后进一步保持静态,使得单晶的整个生长前沿将形成在与单晶的提升方向相反的方向上突出的凸形,并最终将硅单晶与熔体分离。