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    • 44. 发明公开
    • POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
    • POSITIV ARBITENDE PHOTOEMPFINDLICHE POLYIMIDHARZ-ZUSAMMENSETZUNG
    • EP1241527A1
    • 2002-09-18
    • EP00977917.4
    • 2000-11-24
    • Nissan Chemical Industries, Ltd.
    • ISHII, Kazuhisa, Nissan Chemical Industries, Ltd.NAKAYAMA, Tomonari Nissan Chemical Industries, LtdNIHIRA, Takayasu, Nissan Chemical Industries, Ltd.FUKURO, Hiroyoshi Nissan Chemical Industries, Ltd.
    • G03F7/023G03F7/038C08L79/08C08K5/28H01L21/027
    • H01L21/02118C08K5/20C08K5/28C08L79/08G03F7/0233H01L21/312
    • A positive type photosensitive resin composition which can be developed by an aqueous alkaline solution and which is excellent in the developability and the adhesion to a substrate, is presented. Namely, the present invention presents a positive type photosensitive polyimide resin composition characterized by comprising 100 parts by weight of a solvent-soluble polyimide having repeating units represented by the formula (1) and from 1 to 50 parts by weight of a polyimide precursor having repeating units represented by the formula (2), and by further containing an o-quinonediazide compound in an amount of from 1 to 100 parts by weight per 100 parts by weight of the total amount of the repeating units represented by the formula (1) and the repeating units represented by the formula (2):

      (wherein R 1 and R 3 are bivalent organic groups, from 1 to 90 mol% of R 1 is a bivalent organic group having one or plural groups of at least one type selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and from 10 to 99 mol% is a bivalent organic group having no phenolic hydroxyl, carboxylic, thiophenol or sulfonic group, and R 2 and R 4 are tetravalent organic groups constituting a tetracarboxylic acid or its derivative).
    • 本发明提供一种正极型感光性树脂组合物,其可以通过碱性水溶液显影,并且显影性和与基材的粘合性优异。 即,本发明提供一种正型感光性聚酰亚胺树脂组合物,其特征在于,含有100重量份具有式(1)表示的重复单元的溶剂可溶性聚酰亚胺和1〜50重量份具有重复 由式(2)表示的单元和通过进一步含有相对于由式(1)表示的重复单元的总量和100重量份的式(1)表示的重量单位为1〜100重量份的邻醌二叠氮化合物和 由式(2)表示的重复单元: CHEM>(其中R 1和R 3是2价有机基团,1至90摩尔%的R 1是具有 一个或多个选自酚羟基,羧基,苯硫酚基和磺酸基的至少一种,10〜99摩尔%为不含酚羟基的二价有机基团,羧酸 ,苯硫酚或苏氨酸 芳基,R 2和R 4是构成四羧酸或其衍生物的四价有机基团)。
    • 45. 发明公开
    • RADIATION-SENSITIVE RESIST COMPOSITION WITH HIGH HEAT RESISTANCE
    • HITZBESTÄNDIGEFOTORESISTZUSAMMENSETZUNG
    • EP0922998A1
    • 1999-06-16
    • EP98928557.2
    • 1998-06-18
    • Clariant International Ltd.
    • ITO, HiromiTANAKA, Hatsuyuki
    • G03F7/022G03F7/004H01L21/027C08K5/28C08L61/08C08G61/02
    • C08G61/02G03F7/0045G03F7/0233G03F7/038G03F7/039
    • A radiation sensitive resist composition with high sensitivity, capable of forming a highly heat-resistant resist pattern. The radiation-sensitive resist composition contains, together with a resist material, a polymer which is obtained by reacting (a) a xylylene compound, (b) salicylic acid and (c) 9,9'-bis(hydroxyphenyl)fluorene derivatives or diol compounds of 3,3,3',3'-tetramethyl-2,3,2',3'-tetrahydro-(1,1')-spirobiindene, and which has a weight average molecular weight of 1,000 to 5,000 and Tg of 100 to 150 °C . Examples of (c) include 9,9'-bis(4-hydroxyphenyl)fluorene and 3,3,3',3'-tetramathyl-2,3,2',3'-tetrahydro-(1,1')-spirobiindene-6,6'-diol. As the resist material, any of positive- and negative-working resists may be used, with that comprising an alkali-soluble resin and a quinonediazide photo-sensitizer being preferably used.
    • 具有高灵敏度的能够形成高耐热抗蚀剂图案的辐射敏感抗蚀剂组合物。 辐射敏感抗蚀剂组合物与抗蚀剂材料一起含有通过使(a)亚二甲苯基化合物,(b)水杨酸和(c)9,9'-双(羟基苯基)芴衍生物或二醇 3,3,3',3'-四甲基-2,3,2',3'-四氢 - (1,1') - 螺二茚的化合物,其重均分子量为1,000〜5000,Tg为 100〜150℃。 (c)的实例包括9,9'-双(4-羟基苯基)芴和3,3,3',3'-四甲基-2,3,2',3'-四氢 - (1,1') - 螺二茚-6,6'-二醇 作为抗蚀剂材料,可以使用任何正极和负极的抗蚀剂,优选使用包含碱溶性树脂和醌二叠氮化物光敏剂的抗蚀剂。