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41. 发明公开

EP2892012A1 Module électronique, son procédé de fabrication, et dispositif électronique comprenant un tel module 审中-公开
标题翻译：一种电子模块，它的生产方法和该模块全面的电子设备
公开(公告)号：EP2892012A1
公开(公告)日：2015-07-08
申请号：EP14305010.2
申请日：2014-01-06
申请人： Gemalto SA
发明人： Le Loc'h, Alain , Bertolotti, Jean-Marie , Fidalgo, Jean-Christophe
IPC分类号： G06K19/077
CPC分类号： H05K1/18 , G06K19/07747 , G06K19/07775 , H01L2224/45144 , H01L2224/48228 , H01L2224/49109 , H01L2224/49171 , H01Q1/38 , H05K1/097 , H05K1/111 , H05K3/125 , H05K3/1275 , H05K3/32 , H05K3/4007 , H01L2924/00
摘要： L'invention porte sur un module électronique de type double face destiné à équiper des dispositifs électroniques mixtes ou interconnectés. Le module (10) comprend un composant semi-conducteur (15) reporté sur une première face d'un film support diélectrique (11) et connectant ou destiné à être connecté électriquement à un circuit électrique. Le module est caractérisé en ce qu'il comprend, sur ladite première face du film support diélectrique (11), des pistes conductrices (20) imprimées présentant chacune au moins une première extrémité (21) électriquement reliée à un plot de contact dudit composant semi-conducteur (15) par l'intermédiaire d'un fil conducteur électrique (24).

42. 发明公开

EP2760058A4 LED MODULE AND LED LAMP EMPLOYING SAME 失效转让
标题翻译： LED模块及LED的灯，
公开(公告)号：EP2760058A4
公开(公告)日：2015-05-06
申请号：EP12833941
申请日：2012-09-18
申请人： CITIZEN HOLDINGS CO LTD , CITIZEN ELECTRONICS
发明人： IMAI SADATO , ISHII HIROHIKO
IPC分类号： H01L33/62 , F21K99/00 , H01L25/075 , H01L33/58 , H01L33/60 , H01L33/64
CPC分类号： F21K9/1355 , F21K9/23 , F21K9/232 , F21V3/00 , F21V29/006 , F21V29/51 , F21Y2107/00 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2224/16225 , H01L2924/15311 , H01L2924/181 , H05K3/32 , H05K2201/10106 , H05K2201/10295 , H05K2201/10962 , H01L2924/00012
摘要： Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.

43. 发明公开

EP2854188A1 LED device, method of manufacturing the same, and light-emitting apparatus 失效转让
标题翻译： LED装置，以用于其制备方法，和发光元件
公开(公告)号：EP2854188A1
公开(公告)日：2015-04-01
申请号：EP14180822.0
申请日：2011-01-18
申请人： Japan Aviation Electronics Industry, Ltd.
发明人： Kanno, Hideyuki
IPC分类号： H01L33/48 , H01L33/64 , H05K1/02 , F21V7/05 , F21V17/12 , H05K3/32 , H01L25/075 , H01L33/62 , H05K3/30 , F21K99/00 , F21Y103/02 , F21Y101/02 , F21Y105/00
CPC分类号： H01L33/647 , F21K9/90 , F21V7/05 , F21V17/12 , F21Y2101/00 , F21Y2103/33 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/01322 , H05K1/0203 , H05K3/301 , H05K3/32 , H05K2201/10189 , H05K2201/1031 , H05K2201/10409 , H05K2201/10962 , Y02P70/611 , H01L2924/00014 , H01L2924/00
摘要： The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.

44. 发明授权

EP2219911B1 ANSCHLUSSELEMENT UND ZUGEHÖRIGE FLUIDBAUGRUPPE 有权
标题翻译：连接件和相关的流动部
公开(公告)号：EP2219911B1
公开(公告)日：2015-02-11
申请号：EP08856239.2
申请日：2008-10-16
申请人： Robert Bosch GmbH
发明人： SCHALOWSKI, Gerhard , KELLNER, Bernd , WEEBER, Volker , FUERST, Rainer , FRESSER, Heiko , HAAS, Martin , MAILAENDER, Wolfgang , LUTZ, Bernd
IPC分类号： H01R12/58 , H05K3/32 , B60T8/36
CPC分类号： B60T8/3675 , H01R12/58 , H05K3/32 , H05K2201/1003 , H05K2201/10295 , H05K2201/1059 , H05K2201/10757 , H05K2201/10962

45. 发明公开

EP2760058A1 LED MODULE AND LED LAMP EMPLOYING SAME 失效转让
标题翻译： LED-MODUL UND LED-LAMPE DAMIT
公开(公告)号：EP2760058A1
公开(公告)日：2014-07-30
申请号：EP12833941.3
申请日：2012-09-18
申请人： Citizen Holdings Co., Ltd. , Citizen Electronics Co., Ltd
发明人： IMAI, Sadato , ISHII, Hirohiko
IPC分类号： H01L33/62 , H01L33/60 , H01L33/64
CPC分类号： F21K9/23 , F21K9/232 , F21V3/00 , F21V29/51 , F21Y2107/00 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2224/16225 , H01L2924/15311 , H01L2924/181 , H05K3/32 , H05K2201/10106 , H05K2201/10295 , H05K2201/10962 , H01L2924/00012
摘要： Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.
摘要翻译：提供了一种LED模块，即使在少量附接的LED器件中也可获得宽的光分布，并且其具有易于组装的简单结构。 LED模块包括柱状安装基板和多个LED器件。安装基板具有还包括在第一铜板和第二铜板之间的绝缘层的结构。当将多个LED装置安装在安装基板的前端部时，将第一铜板用作正极侧电极，将第二铜板用作负极侧电极。

46. 发明公开

EP2647269A1 METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIBLE SUBSTRATE AS WELL AS ASSEMBLY OF AN ELECTRIC COMPONENT WITH A FLEXIBLE SUBSTRATE 有权
标题翻译：方法和装置对电子组件安排与挠性基板中的柔性基板和布置的电子部件的
公开(公告)号：EP2647269A1
公开(公告)日：2013-10-09
申请号：EP11794257.3
申请日：2011-12-02
申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO
发明人： VAN DEN BRAND, Jeroen , KUSTERS, Roel Henry Louis , DIETZEL, Andreas Heinrich
IPC分类号： H05K3/32 , H01L23/00
CPC分类号： H05K3/32 , H01L23/4985 , H01L24/24 , H01L24/76 , H01L24/82 , H01L2224/2405 , H01L2224/24051 , H01L2224/24226 , H01L2224/25171 , H01L2224/25175 , H01L2224/76155 , H01L2224/76261 , H01L2224/766 , H01L2224/767 , H01L2224/82102 , H01L2224/82104 , H01L2224/82106 , H01L2224/82874 , H01L2224/9202 , H01L2224/92144 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0283 , H05K1/189 , H05K3/12 , H05K3/305 , H05K2201/10674 , H05K2203/107 , H05K2203/1469 , H05K2203/1545 , H05K2203/175 , Y10T29/49133 , Y10T29/53178 , H01L2924/00
摘要： A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of - placing the component (30) on a first main side (11) of the substrate, - applying a machine vision step to estimate a position of the electric contacts, - depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, - calculating partitioning lines depending on the estimated position of the electric contacts, - partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.

47. 发明授权

EP2547484B1 CAPACITOR-CIRCUIT BOARD INTERFACE FOR WELDING SYSTEM COMPONENTS 有权
标题翻译：电容式电路板等接口，用于焊接系统组件
公开(公告)号：EP2547484B1
公开(公告)日：2013-08-21
申请号：EP11731060.7
申请日：2011-03-15
申请人： Lincoln Global, Inc.
发明人： KOPRIVNAK, George, B. , DODGE, Robert, L. , BUDAY, Jeremie , PERRIN, David, W.
IPC分类号： B23K9/10
CPC分类号： H05K3/32 , B23K9/10 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49133 , Y10T29/49199

48. 发明公开

EP2595461A1 Anordnung mit einer Leiterplatte und mit einem Anschlusselement 有权
公开(公告)号：EP2595461A1
公开(公告)日：2013-05-22
申请号：EP11189400.2
申请日：2011-11-16
申请人： Siemens Aktiengesellschaft
发明人： Bräunlich, Michael , Griessbach, Gunter , Kuhn, Michael , Rochlitzer, Daniela , Schmidt, Dirk
IPC分类号： H05K1/18 , H05K3/32
CPC分类号： H01R12/515 , H01R13/6587 , H01R13/6594 , H05K3/306 , H05K3/32 , H05K2201/10189 , H05K2201/10287 , H05K2201/10356
摘要： Die Erfindung betrifft eine Anordnung mit einer Leiterplatte (1) und mit einem Anschlusselement (4), welches mehrere Anschlüsse zum Anschließen von Signalleitungen (5) aufweist. Es werden Maßnahmen vorgeschlagen, mittels deren das Verhalten der Anordnung sowie des Anschlusselementes im Hinblick auf die elektromagnetische Verträglichkeit (EMV-Verhalten) verbessert werden.
摘要翻译：该布置具有用于屏蔽的外层连接器，其布置在印刷电路板（1）上。连接器具有两个屏蔽部分，其中屏蔽部分具有相对于矩形后壁（10）可枢转的方形盖（11）。另一个屏蔽部分具有通过网（13）与屏蔽部分的其他半壳（15）连接的两个对称构造的侧部（12）。中心接触销（16）位于另一半壳体上，使得其他半壳体和侧部分与电路板的外层连接。电路板和连接器装置的连接器包括一个独立的权利要求。

49. 发明公开

EP2587899A1 Sinterable bonding material using copper nanoparticles, process for producing same, and method of bonding electronic component 有权
标题翻译：烧结粘接材料与铜纳米颗粒，其制造方法，和方法，用于接合电子元件
公开(公告)号：EP2587899A1
公开(公告)日：2013-05-01
申请号：EP12190163.1
申请日：2012-10-26
申请人： Hitachi Ltd.
发明人： Yasuda, Yusuke , Morita, Toshiaki , Kobayashi, Yoshio
IPC分类号： H05K1/09 , H01B1/22 , B22F9/16 , H05K3/32
CPC分类号： H05K1/097 , B22F1/0018 , B22F3/10 , B22F9/24 , B82Y30/00 , C22C1/0425 , C22C9/00 , H01B1/026 , H01B1/16 , H01B1/22 , H01L2224/16225 , H01L2224/83205 , H01L2224/8384 , H05K3/32 , H05K2201/0266 , H01L2924/00014
摘要： Disclosed is a sinterable bonding material which is a liquid or a paste containing copper nanoparticles having a particle diameter of 1,000 nm or less, in which the copper nanoparticles have one or more particle diameter peaks of a number-based grain size distribution within a class of particle diameter of 1 to 35 nm and within a class of particle diameter of more than 35 nm and 1, 000 nm or less respectively, and in which the copper nanoparticles include individual particles 155 (primary particles) and secondary particles, each of the secondary particles being a fused body 156 of the primary particles. Thus, oxidation resistance and bondability are made compatible in a sinterable bonding material using copper nanoparticles, and ion migration is suppressed in a bondedportion of a semiconductor device, etc. manufactured by using the sinterable bonding material.
摘要翻译：本发明提供一种烧结能够接合材料全部，其是液体或含具有1,000纳米或更小的粒径，其中，所述铜纳米颗粒具有一类内的基于数量的粒径分布的一个或更多个粒径峰的铜纳米粒子的糊剂的1至35纳米，一类超过35纳米，1，000纳米或更小粒径的分别内，并且其中粒径的铜纳米粒子包括单个颗粒155（初级颗粒）和二次粒子，二次的颗粒，其稠合体的一次粒子的156。因此，耐氧化性和粘合能力使用铜纳米颗粒由在烧结能够接合材料相容，并且离子迁移是在半导体装置等，通过使用烧结能够接合材料制造的bondedportion抑制。

50. 发明公开

EP2568783A1 ELECTRONIC DEVICE, CABLE CONNECTION STRUCTURE, AND PROCESS FOR PRODUCTION OF ELECTRONIC DEVICE 审中-公开
标题翻译：电子器件，电子器件用生产电缆连接构造和方法
公开(公告)号：EP2568783A1
公开(公告)日：2013-03-13
申请号：EP11777459.6
申请日：2011-05-02
申请人： Olympus Corporation
发明人： NAKAMURA, Mikio
IPC分类号： H05K3/40 , H01R12/53 , H05K1/18 , H05K9/00
CPC分类号： H05K3/403 , H05K3/32 , H05K2201/10356 , Y10T29/49117
摘要： A structure includes a substrate (2) on a surface of which a functional element (21) and a first electrode (22) are disposed, wherein the functional element (21) provides a predetermined function by an operation based on an electrical signal and the first electrode (22) is coupled to the functional element (21); an insulating member (3) in a thin film that covers the surface of the substrate (2) and extends from an end of the substrate (2); and a second electrode (51) disposed on a substrate-side surface of the extending portion, which is extending from the end of the substrate (2), of the insulating member (3), wherein the second electrode (51) is coupled to the first electrode (22). The second electrode (51) is electrically coupled to a coaxial cable (4).
摘要翻译：一种结构，包括：基板（2）的表面上的功能元件（21）和第一电极（22）设置，worin功能元件（21）的基础上，以电信号和在操作通过提供预定函数第一电极（22）耦合到所述功能元件（21）; 在一薄膜绝缘构件（3）的覆盖那样的表面（2）和从基片在所述多个基板的端部（2）延伸; 和设置在所述延伸部的底侧表面上的第二电极（51），所有这些都从绝缘构件（3）的基板（2）的端部延伸，worin第二电极（51）耦合到所述第一电极（22）。所述第二电极（51）被电耦合到一个同轴线缆（4）。

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