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41. 发明公开

EP2516321A2 SENSOR MIT EINEM VORZUGSWEISE MEHRSCHICHTIGEN KERAMIKSUBSTRAT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权
标题翻译：具有优选多层陶瓷基板及其制造方法传感器
公开(公告)号：EP2516321A2
公开(公告)日：2012-10-31
申请号：EP11817213.9
申请日：2011-10-10
申请人： Micro-Epsilon Messtechnik GmbH & Co. KG
发明人： SCHMIDEDER, Sabine , THELEMANN, Torsten , NAGL, Josef , ASCHENBRENNER, Heinrich , HOENICKA, Reinhold
IPC分类号： B81B7/00
CPC分类号： H05K1/181 , B81B7/0006 , B81B2207/092 , B81B2207/096 , B81C1/00301 , H01L2924/0002 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K1/185 , H05K3/32 , H05K3/3447 , H05K3/4046 , H05K3/4629 , H05K2201/10151 , H05K2201/10287 , H05K2201/10303 , H05K2201/10318 , H05K2201/10356 , Y10T29/49128 , H01L2924/00
摘要： A sensor comprises a preferably multilayered ceramic substrate (2) and at least one sensor element (1) arranged in, at or on the ceramic substrate (2). Contact can be made with the sensor element (1) via a metallic contact (6), wherein the metallic contact (6) is produced by means of a soldering connection that electrically connects the contact (6) to the sensor element (1) and in the process produces a fixed mechanical connection of the contact (6) relative to the ceramic substrate (2). A method for producing the sensor according to the invention is furthermore claimed.

43. 发明公开

EP2355144A1 Component placement on flexible and/or stretchable substrates 审中-公开
标题翻译：。。。。。。。。。。。。。。。。。
公开(公告)号：EP2355144A1
公开(公告)日：2011-08-10
申请号：EP10153105.1
申请日：2010-02-09
申请人： Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO
发明人： Koetse, Marinus Marc , Schoo, Harmannus Franciscus Maria
IPC分类号： H01L21/98 , H01L21/68 , H01L51/56 , H05K3/30
CPC分类号： H05K13/0023 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/27505 , H01L2224/27515 , H01L2224/29076 , H01L2224/29139 , H01L2224/29147 , H01L2224/2919 , H01L2224/2929 , H01L2224/29393 , H01L2224/32225 , H01L2224/83192 , H01L2224/83862 , H01L2224/83874 , H01L2924/01029 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H05K1/0283 , H05K1/189 , H05K3/105 , H05K3/303 , H05K3/32 , H05K3/323 , H05K2201/0133 , H05K2203/1545 , Y02P70/613 , Y10T156/10 , Y10T156/1052 , Y10T156/1158 , Y10T156/1195 , H01L2924/00014 , H01L2924/01006 , H01L2924/0665 , H01L2924/00
摘要： According to one aspect, the invention provides a method of placement of a component on a stretchable substrate, comprising the steps of providing a base substrate having a stretchable substrate layer, providing a flexible foil comprising an integral arrangement (20) of a multiple of flexible foil components; the flexible foil components each comprising component pads for electro/optical access to the flexible foil components, providing in plane interconnecting traces on the stretchable substrate layer in correspondence with the component pads in the integral arrangement; aligning the base substrate and the flexible foil so as to be used in a reel based manufacturing process; providing, through lamination of the base substrate and the flexible foil an electro/optical via connection between the traces and the component pads of the integral component arrangement; and mechanically separating the integral arrangement of flexible foil components to provide a multiple of mechanically separated components from each other to arrange an electro/optical interconnected component system on a stretchable substrate layer
One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.
摘要翻译：根据一个方面，本发明提供了一种将部件放置在可拉伸基底上的方法，包括以下步骤：提供具有可拉伸基底层的基底基底，提供柔性箔，所述柔性箔包括多个柔性的整体布置（20）箔组件; 柔性箔组件各自包括用于电/光访问柔性箔部件的组件衬垫，在整体布置中提供与可伸缩衬底层上的平面互连迹线对应于组件衬垫; 对准基底基板和柔性箔片，以便在卷筒式制造工艺中使用; 通过所述基底基板和所述柔性箔层叠所述迹线和所述整体部件布置的所述部件焊盘之间的电/光通孔连接; 并且机械地分离柔性箔部件的整体布置，以提供多个彼此机械分离的部件，以将电/光互连部件系统布置在可拉伸的基底层上。本发明的一个优点是可用于制造过程用于多箔系统。

44. 发明公开

EP2285197A1 Verfahren zur Verbindung eines elektronischen Bauteils mit einer Leiterplatte 有权
标题翻译：电子部件连接到电路板的方法
公开(公告)号：EP2285197A1
公开(公告)日：2011-02-16
申请号：EP10002908.1
申请日：2010-03-19
申请人： Automotive Lighting Reutlingen GmbH
发明人： Ripple, Heiko , Gabler, Lutz , Hiegler, Michael , Herter, Helmut, Dipl.-Ing. (FH)
IPC分类号： H05K1/18 , H05K3/32 , H05K3/34
CPC分类号： H05K1/18 , H05K3/32 , H05K3/34
摘要： Vorgestellt wird ein Verfahren zur Verbindung eines elektronischen Bauteils (14) mit einer Leiterplatte (12). Das Verfahren zeichnet sich dadurch aus, dass die Verbindung über ein Verbindungselement (26) erfolgt, das mit einem elektrischen Kontakt (16) der Leiterplatte (12) elektrisch leitend und stoffschlüssig verbunden wird und das mit einem elektrischen Kontakt (18) des elektronischen Bauteils (14) verschweißt wird. Ferner wird eine mit diesem Verfahren hergestellte Baugruppe (10) vorgestellt.
摘要翻译：该方法包括在通过钎焊和/或焊接电的印刷电路板（PCB）（12）导通和材料决定性方式的电触点（16）连接有连接元件（26）。该连接元件被焊接在与电子部件的电接触（18）（14），例如 LED，通过激光焊接。连接元件胶合与PCB的电接触。连接元件用塑料网连接，并且被实现为到甚至组件。

45. 发明公开

EP2285196A1 ELECTRIC CIRCUIT CONNECTION MEMBER 审中-公开
标题翻译： ELEKTRISCHES SCHALTUNGSVERBINDUNGSGLIED
公开(公告)号：EP2285196A1
公开(公告)日：2011-02-16
申请号：EP09738614.8
申请日：2009-04-23
申请人： Daikin Industries, Ltd.
发明人： KAGIMURA, Sumio , DOUMAE, Hiroshi , DOI, Hirotaka , GENDA, Shuuji
IPC分类号： H05K1/18
CPC分类号： H05K1/0263 , H01R4/34 , H01R12/515 , H05K3/32 , H05K2201/10287 , H05K2201/10295 , H05K2201/10409 , H05K2201/10545 , H05K2201/10962
摘要： A connecting member such as a terminal base (10) is used, which allows a printed circuit board unit in which circuit elements such as a power module (3) are mounted on a printed circuit board (2) to be rated at higher current as compared to a conventional printed circuit board unit; and therefore an increase in size of the unit can be reduced or prevented with a simple configuration of connection sections. The connecting member (10) of an electrical circuit connects the circuit element (3) of the electrical circuit including the printed circuit board (2), to an electrical wire (8). The connecting member (10) includes a terminal connecting section (11) to be directly connected to terminal pins (3a) of the circuit element (3); a wire connecting section (12) to be connected to the electrical wire (8); and attachment sections (14) for attaching the connecting member to the printed circuit board (2).
摘要翻译：使用诸如端子座（10）的连接构件，其允许印刷电路板单元，其中诸如功率模块（3）的电路元件安装在印刷电路板（2）上以更高的电流被额定为与传统印刷电路板单元相比; 因此可以通过简单的连接部分构造来减小或防止单元尺寸的增加。电路的连接构件（10）将包括印刷电路板（2）的电路的电路元件（3）连接到电线（8）。连接构件（10）包括直接连接到电路元件（3）的端子引脚（3a）的端子连接部分（11）。连接到电线（8）的电线连接部分（12）; 以及用于将连接构件附接到印刷电路板（2）的附接部分（14）。

46. 发明公开

EP2206419A1 PRODUCT PACKAGING 审中-公开
标题翻译：产品包装
公开(公告)号：EP2206419A1
公开(公告)日：2010-07-14
申请号：EP08806763.2
申请日：2008-10-17
申请人： Novalia Ltd
发明人： STONE, Kate
IPC分类号： H05K1/00
CPC分类号： F21V21/14 , H05K1/0266 , H05K1/028 , H05K1/038 , H05K1/0393 , H05K1/113 , H05K3/12 , H05K3/32 , H05K3/321 , H05K3/361 , H05K2201/09063 , H05K2201/09072 , H05K2201/091 , H05K2201/09936 , H05K2201/10674 , H05K2203/1545 , Y10T29/4913 , Y10T29/5313 , Y10T428/24273
摘要： A method of fabricating packaging for a product comprises forming a plurality of conductive tracks on a sheet of material and forming a physical barrier, such as a hole,for impeding fluid flow between adjacent conductive tracks.The method may furthercomprise depositing first and second regions conductive fluid onto adjacent first and second conductive tracks either sideof the physical barrier and mounting an electronic device having first and second terminals such that the electronic device forms a bridge over the physical barrier and the first ands second terminals contact the first and second conductive adjacent tracks.

47. 发明公开

EP2181354A1 FLEXIBLE PIXEL ELEMENT FABRICATION AND SEALING METHOD 有权
标题翻译：用于生产和灵活的像素单元的密封
公开(公告)号：EP2181354A1
公开(公告)日：2010-05-05
申请号：EP08795477.2
申请日：2008-08-21
申请人： Daktronics, Inc.
发明人： WENDLER, Brett, D. , BRAVEK, Eric, S. , GREBEL, Erich, J.
IPC分类号： G02B26/00
CPC分类号： F21V31/005 , F21V15/01 , F21V23/06 , F21Y2115/10 , G09F9/301 , G09F9/33 , G09F13/22 , G09G3/06 , G09G3/12 , G09G3/32 , G09G2300/04 , G09G2300/0426 , G09G2310/0221 , H05K3/284 , H05K3/32 , H05K3/368 , H05K5/064 , Y10T29/49126 , Y10T29/49128
摘要： Discrete flexible pixel elements are hermetically sealed from the environment and comprise unitary, self-contained replaceable modules which enable efficient, economical production of large scale, free-form electronic displays, signs and lighting effects for outdoor use. The method and means for producing hermetically sealed discrete flexible pixel elements include encapsulation means, exterior casement means, and cable connector means.

48. 发明公开

EP2050131A1 VERFAHREN ZUR ERZEUGUNG EINER ELEKTRISCHEN FUNKTIONSSCHICHT AUF EINER OBERFLÄCHE EINES SUBSTRATS 有权
标题翻译：方法用于制造电功能层上的衬底的表面
公开(公告)号：EP2050131A1
公开(公告)日：2009-04-22
申请号：EP07788079.7
申请日：2007-07-31
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： WEIDNER, Karl , WEINKE, Robert , HOLST, Jens-Christian , JENSEN, Jens Dahl
IPC分类号： H01L21/60 , H01L23/48 , H05K3/14
CPC分类号： H05K3/32 , C23C24/04 , H01L23/552 , H01L24/24 , H01L24/80 , H01L24/82 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H05K3/102 , H05K3/14 , H05K2203/1344 , H05K2203/1469
摘要： The invention relates to a method for producing an electric functional layer (19) on a surface of a substrate (10), having at least an electronic component (15), particularly a semiconductor chip. The electric functional layer (19) is comprised by particles in powder form made of a electrically conductive material being selectively blown on the surface of the substrate (10) and forming a thick and strong adhesive layer on impact on the substrate (10).

49. 发明公开

EP2044821A1 BALL GRID ARRAY (BGA) CONNECTION SYSTEM AND RELATED METHOD AND BALL SOCKET 有权
标题翻译： CONNECTION SYSTEM FOR球栅阵列（BGA）和相应的方法和球底座
公开(公告)号：EP2044821A1
公开(公告)日：2009-04-08
申请号：EP07799288.1
申请日：2007-07-03
申请人： Harris Corporation
发明人： SMITH, Steven C. , SNYDER, Steven R.
IPC分类号： H05K3/34
CPC分类号： H05K3/32 , H05K3/4015 , H05K2201/1031 , H05K2201/10333 , H05K2201/10734 , H05K2201/10962 , Y02P70/611
摘要： A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

50. 发明公开

EP1699232A3 Non-planar x-ray image sensor 审中-公开
标题翻译：不均匀的射线图像传感器
公开(公告)号：EP1699232A3
公开(公告)日：2007-09-05
申请号：EP06251143.1
申请日：2006-03-02
申请人： E2V Technologies (UK) Limited
发明人： Wood, Scott Alan
IPC分类号： H04N5/32
CPC分类号： A61B6/145 , A61B6/4233 , H01L27/14634 , H01L27/14663 , H01L27/14689 , H01L27/1469 , H01L27/148 , H04N5/2253 , H04N5/32 , H05K1/0284 , H05K3/32 , H05K2201/10121
摘要： A non-planar x-ray sensor 40 has a scintillator-coated, thinned photoelectric sensor array on a flexible semiconductor die 45 conformed and affixed to a non-planar printed circuit board 43 providing electrical connections to the photoelectric sensor array. The sensor has particular application as an intra-oral cavity sensor for dental x-ray digital imaging.

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