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    • 46. 发明公开
    • Semiconductor light-emitting device with third cladding layer
    • Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht。
    • EP0627799A1
    • 1994-12-07
    • EP94303990.9
    • 1994-06-03
    • SHARP KABUSHIKI KAISHA
    • Sasaki, KazuakiYamamoto, Osamu
    • H01S3/19H01S3/085H01S3/25H01L21/20H01L33/00
    • H01S5/2232H01L33/145H01S5/18352H01S5/2206H01S5/3202H01S5/32308H01S5/4031H01S2304/12
    • A semiconductor laser device includes a substrate (1) having one of p- and n-conductivity types, and a current constrictive layer (2) formed on a surface of the substrate (1) and having the other type of conductivity. The current constrictive layer (2) has a through-channel (2b) extending to the surface of the substrate (1) for defining a current path in a direction perpendicular to the surface of the substrate. The through-channel (2b) is of a belt-like pattern extending in a direction perpendicular to end surfaces of the substrate (1). A third cladding layer (8) having the one type of conductivity is filled in the through-channel (2b), a surface of the third cladding layer (8) being flush with a surface of a current constrictive layer (2). A first cladding layer (3), an active layer (4), and a second cladding layer (5) which constitute a double heterostructure are formed over the third cladding layer (8) and current constrictive layer (2).
    • 半导体激光器件包括具有p型和n型导电类型之一的衬底(1)和形成在衬底(1)的表面上并具有另一种导电性的电流限制层(2)。 电流收缩层(2)具有延伸到衬底(1)的表面的通道(2b),用于在垂直于衬底表面的方向上限定电流通路。 贯通通道(2b)是沿垂直于基板(1)的端面的方向延伸的带状图案。 具有一种导电性的第三包覆层(8)填充在通孔(2b)中,第三包覆层(8)的表面与电流缩窄层(2)的表面齐平。 在第三包层(8)和电流限制层(2)上形成构成双异质结构的第一包层(3),有源层(4)和第二覆层(5)。