专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明公开

EP1321978A3 Contact structure 失效
标题翻译：联系方式结构
公开(公告)号：EP1321978A3
公开(公告)日：2004-08-25
申请号：EP03003489.6
申请日：1997-05-15
申请人： FORMFACTOR, INC.
发明人： Khandros, Igor Y. , Pedersen, David V.
IPC分类号： H01L21/48 , H01L21/60 , H05K1/18 , H05K3/34 , G01R1/073
CPC分类号： H01L23/49811 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/287 , G01R31/2884 , G01R31/2889 , H01H1/0036 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H05K3/20 , H05K3/3421 , H05K3/4015 , H01L2224/13099 , H01L2924/00
摘要： Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate (106 and 108) having active electronic components (106a, 106b, 106c, 106d) such as ASICs mounted to an interconnection substrate (108) or incorporated therein, metallic spring contact element (110) effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) (102a, 102b, 102c, 102d) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements (110) may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. A significant reduction in interconnect count and consequent simplification of the interconnection substrate (108) is realized because the ASICs are capable of receiving a plurality of signals for testing the DUTs over relatively few signal lines from a host controller (116) and promulgating these signals over the relatively many interconnections between the ASICs and the DUTS.

42. 发明公开

EP1326079A3 Probe card 有权
标题翻译： Testkarte
公开(公告)号：EP1326079A3
公开(公告)日：2004-05-19
申请号：EP03003496.1
申请日：1999-12-02
申请人： FORMFACTOR, INC.
发明人： Eldridge, Benjamin N. , Grube, Gary W. , Mathieu, Gaetan L.
IPC分类号： G01R1/073 , G01R31/316
CPC分类号： B23K20/004 , B23K2201/40 , G01R1/06711 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13099 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H01L2924/00
摘要： A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

43. 发明公开

EP1387174A1 CONTACT PROBE 有权
标题翻译：接触探针
公开(公告)号：EP1387174A1
公开(公告)日：2004-02-04
申请号：EP02718523.0
申请日：2002-04-10
申请人： Sumitomo Electric Industries, Ltd.
发明人： HAGA, Tsuyoshi, Osaka Works of Sumitomo El.Ind.Ltd , OKADA, Kazunori Osaka Works of Sumitomo El.Ind.Ltd
IPC分类号： G01R1/067 , C22C19/03
CPC分类号： G01R1/07314 , C22C19/03 , C22C19/07 , C25D1/10 , G01R1/06716
摘要： A contact probe is fabricated by forming a resin mold with a cavity on a substrate having conductivity, and filling the cavity with metal through electroforming. The metal includes a cobalt-tungsten alloy. Alternatively, a cobalt-molybdenum alloy may be used instead of the cobalt-tungsten alloy. Alternatively, a contact probe can be made from nickel, cobalt or copper, and have a coat film of cobalt-tungsten alloy or cobalt-molybdenum alloy formed thereon to increase the abrasion resistance. A nickel-molybdenum alloy can be used instead of the cobalt-tungsten alloy or cobalt-molybdenum alloy.
摘要翻译：通过在具有导电性的基板上形成具有空腔的树脂模具并通过电铸填充金属腔体来制造接触式探针。该金属包括钴 - 钨合金。或者，可以使用钴 - 钼合金代替钴 - 钨合金。或者，接触探针可以由镍，钴或铜制成，并且具有在其上形成的钴 - 钨合金或钴 - 钼合金涂层膜以增加耐磨性。可以使用镍 - 钼合金代替钴 - 钨合金或钴 - 钼合金。

44. 发明授权

EP1135693B1 PROBE CARD FOR PROBING WAFERS WITH RAISED CONTACT ELEMENTS 有权
标题翻译：测试卡筹码增大的接触元素
公开(公告)号：EP1135693B1
公开(公告)日：2003-06-04
申请号：EP99963010.6
申请日：1999-12-02
申请人： FORMFACTOR, INC.
发明人： ELDRIDGE, Benjamin, N. , GRUBE, Gary, W. , MATHIEU, Gaetan, L.
IPC分类号： G01R31/316
CPC分类号： B23K20/004 , B23K2201/40 , G01R1/06711 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13099 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H01L2924/00
摘要： A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

45. 发明公开

EP1176635A3 Spring structure and method 有权
标题翻译： Federstruktur和Methode
公开(公告)号：EP1176635A3
公开(公告)日：2003-04-16
申请号：EP01305899.5
申请日：2001-07-09
申请人： Xerox Corporation
发明人： Fork, David K. , Ho, Jackson H. , Lau, Rachel King-Ha , Lu, Jeng Ping
IPC分类号： H01L21/48 , H01L23/48 , B81B3/00 , G01R1/067 , G01R1/073
CPC分类号： G01R1/06716 , B81B2203/0118 , B81C1/00484 , B81C2201/0136 , B81C2203/058 , G01R1/06727 , G01R1/07342 , G01R3/00 , H01L23/49811 , H01L2924/0002 , H01R4/48 , H01R12/57 , H05K3/4092 , Y10T29/4913 , Y10T29/49135 , Y10T29/4914 , H01L2924/00
摘要： Efficient methods for lithographically fabricating spring structures onto a substrate (301) containing contact pads or metal vias (305) by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material (310) is self-aligned to the spring metal finger (320) using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.
摘要翻译：通过使用单个掩模通过形成弹簧金属和释放材料层，将含有接触垫或金属过孔的弹性结构光刻制造到衬底上的高效方法。具体地，使用光致抗蚀剂掩模或电镀金属图案，或使用剥离处理技术，释放材料垫与弹簧金属指自对准。然后使用释放掩模来释放弹簧金属指，同时保持将弹簧金属指的锚定部分固定到基底的释放材料的一部分。当释放材料是导电的（例如钛）时，该释放材料部分直接位于接触垫或金属通孔上方，并且用作在完成的弹簧结构中的弹簧金属指的导管。当释放材料不导电时，形成金属带以将弹簧金属指连接到接触垫或金属通孔，并且还将弹簧金属指状物进一步锚定到基底。

46. 发明公开

EP1224476A1 PRÜFSTIFT FÜR EINE VORRICHTUNG ZUM TESTEN VON LEITERPLATTEN 有权
标题翻译：测试引脚，一种用于电路板检测
公开(公告)号：EP1224476A1
公开(公告)日：2002-07-24
申请号：EP00964113.5
申请日：2000-09-05
申请人： atg test systems GmbH & Co. KG , Ott, Bernd , Prokopp, Manfred
发明人： OTT, Bernd , PROKOPP, Manfred
IPC分类号： G01R1/067 , G01R1/073
CPC分类号： G01R1/07371 , G01R1/06716 , G01R1/06722
摘要： The present invention relates to a test probe for a device for testing printed circuit boards and to an adapter and a device for testing printed circuit boards. The test probe comprises a needle and a sleeve. The needle is guided in the sleeve in such a way that said needle can be displaced. A spring which counteracts a movement of the needle is provided in the sleeve. The needle protrudes from the sleeve by at least 10 mm, especially more than 20 mm. In another embodiment, the needle is conically tapered in the area that protrudes from the sleeve up to a tip of a contact. Adapter for printed circuit boards can be produced using the inventive test probe. Said adapters are provided with contacts having a high density. The test probes are also provided with a spring effect.

47. 发明公开

EP1160576A2 Contact probe and fabrication method thereof 有权
标题翻译： Kontaktsonde und deren Herstellungsverfahren
公开(公告)号：EP1160576A2
公开(公告)日：2001-12-05
申请号：EP01304766.7
申请日：2001-05-31
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Haga, Tsuyoshi, Sumitomo Electr. Ind., Ltd , Okumura, Katsuya , Hayasaka, Nobuo , Shibata, Hideki , Matsunaga, Noriaki
IPC分类号： G01R1/067
CPC分类号： G01R1/06716 , G01R1/06722 , G01R1/06733 , G01R1/06738
摘要： A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring.
摘要翻译：接触探针通过包括光刻步骤和电镀步骤的方法制造。接触探针包括与被测试电路形成接触的柱塞单元（1），弹簧单元（2）和引线连接单元（3），其全部被形成为具有均匀的三维构造相对于与预定平面构造垂直的厚度方向上的预定平面构造的厚度。优选地，平行于弹簧单元（2）的引导单元（6）也整体地形成。进一步优选地，接触探针一体地形成，还包括用于由板簧构成的弹簧单元（2）的每个单一构造的止动件（7）。

48. 发明授权

EP0515577B1 MAKING AND TESTING AN INTEGRATED CIRCUIT USING HIGH DENSITY PROBE POINTS 失效
标题翻译：生产和集成电路的测试中使用测试点高密度
公开(公告)号：EP0515577B1
公开(公告)日：1998-07-01
申请号：EP91908938.3
申请日：1991-02-14
申请人： LEEDY, Glenn J.
发明人： LEEDY, Glenn J.
IPC分类号： H05K3/30 , B44C1/22 , G01R1/04 , B05D5/12
CPC分类号： G11C29/006 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/0735 , G01R31/2831 , G01R31/2863 , G01R31/287 , G01R31/2886 , G01R31/318505 , G01R31/318511 , G01R31/31905 , G01R31/31912 , G03F7/70466 , G03F7/70658 , H01L22/22 , H01L2924/15192 , H01L2924/3011 , Y10T29/4913 , Y10T29/49155 , Y10T29/49764
摘要： Each transistor or logic unit on an integrated wafer (1) is tested prior to interconnect metallization. By means of CAD software, the transistor or logic units placement net list is revised to substitute redundant defect-free logic units for defective ones. Then the interconnect metallization is laid down and patterned under control of a CAD computer syste. Each die in the wafer thus has its own interconnect scheme, although each die is functionally equivalent, and yields are much higher than wich conventional testing at the completed circuit level. The individual transistor or logic unit testing is accomplished by specially fabricated flexible tester surface (10) made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points (15-1, 15-2) on one side of the test surface (10). The probe points (330) electrically contact the contacts (2-1, 2-2) on the wafer (1) under test by fluid pressure.

49. 发明公开

EP0845680A1 Making and testing an integrated circuit using high density probe points 失效
标题翻译： Fabrikation und Testen von integrierten Schaltungen mit Testpunkten hoher Dichte
公开(公告)号：EP0845680A1
公开(公告)日：1998-06-03
申请号：EP97122519.8
申请日：1991-02-14
申请人： LEEDY, Glenn J.
发明人： LEEDY, Glenn J.
IPC分类号： G01R31/316
CPC分类号： G11C29/006 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/0735 , G01R31/2831 , G01R31/2863 , G01R31/287 , G01R31/2886 , G01R31/318505 , G01R31/318511 , G01R31/31905 , G01R31/31912 , G03F7/70466 , G03F7/70658 , H01L22/22 , H01L2924/15192 , H01L2924/3011 , Y10T29/4913 , Y10T29/49155 , Y10T29/49764
摘要： Each transistor or logic unit on an integrated wafer (1) is tested prior to interconnect metallization. By means of CAD software, the transistor or logic units placement net list is revised to substitute redundant defect-free logic units for defective ones. Then the interconnect metallization is laid down and patterned under control of a CAD computer syste. Each die in the wafer thus has its own interconnect scheme, although each die is functionally equivalent, and yields are much higher than wich conventional testing at the completed circuit level. The individual transistor or logic unit testing is accomplished by specially fabricated flexible tester surface (10) made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points (15-1, 15-2) on one side of the test surface (10). The probe points (330) electrically contact the contacts (2-1, 2-2) on the wafer (1) under test by fluid pressure.
摘要翻译：在互连金属化之前测试集成晶片（1）上的每个晶体管或逻辑单元。通过CAD软件，修改了晶体管或逻辑单元布局网表，以替代有缺陷的冗余无缺陷逻辑单元。然后在CAD计算机系统的控制下布线和图案化互连金属化。因此，晶片中的每个管芯具有其自己的互连方案，尽管每个管芯在功能上是等效的，并且产量远高于在完成的电路级别的常规测试。单个晶体管或逻辑单元测试通过在几层柔性二氧化硅的一个实施例中制造的特殊制造的柔性测试仪表面（10）来实现，每个层包含通孔和导电迹线，导通数千个微观金属探针点（15-1， 15-2）在测试表面（10）的一侧。探针点（330）通过流体压力与待测晶片（1）上的触点（2-1,2-2）电接触。

50. 发明公开

EP3268751A1 TESTING HEAD WITH VERTICAL PROBES, PARTICULARLY FOR HIGH FREQUENCY APPLICATIONS 有权
标题翻译：垂直探头测试头，特别适用于高频应用
公开(公告)号：EP3268751A1
公开(公告)日：2018-01-17
申请号：EP16713743.9
申请日：2016-03-10
申请人： Technoprobe S.p.A
发明人： ACCONCIA, Daniele
IPC分类号： G01R1/073 , G01R1/067
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/0675 , G01R1/07314 , G01R1/07357
摘要： A testing head for functionality testing a device under test comprises a plurality of contact probes, each contact probe having a rod-like body having a preset length less than 5000 μm extending between a first and a second end, the second end being a contact tip and an opening extending all over its length and defining a plurality of arms, parallel to each other, separated by the opening and connected to the end portions of the contact probe, and an auxiliary guide, arranged transverse to the body and provided with suitable guide holes, the contact probes sliding through each of them, the auxiliary guide defining a gap including one end of the opening being a critical portion of the body and a zone more prone to breakings in the body undergoing low or even no bending stresses in the gap with respect to the rest of the body.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式